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Rogers PCB 30mil RO3203 2 Layer Immersion Silver RF Circuits

Rogers PCB 30mil RO3203 2 Layer Immersion Silver RF Circuits

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RO3203 Substrate
PCB Size:
30mm X 60 Mm=1PCS
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Layer Count:
2-layer
PCB Thickness:
0.8 Mm
Highlight:

Rogers RO3203 rf pcb boards

,

Immersion Silver rf pcb manufacturer

,

Rogers RO3203 rf pcb manufacturer

Product Description

The RO3203 PCB is engineered from high-frequency circuit materials that combine ceramic-filled laminates with woven fiberglass reinforcement. Part of the renowned RO3000 Series, this laminate is designed for exceptional electrical performance and enhanced mechanical stability, making it suitable for demanding applications beyond 40 GHz. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, the RO3203 PCB provides reliable solutions for high-frequency circuit designs.

 

Features
Material Type: Ceramic-filled PTFE composites
Dielectric Constant: 3.02 ±0.04 at 10 GHz/23°C
Dissipation Factor: 0.0016 at 10 GHz/23°C
Thermal Degradation Temperature (Td): > 500°C
Thermal Conductivity: 0.87 W/mK
Coefficient of Thermal Expansion (CTE):
X-axis: 13 ppm/°C
Y-axis: 13 ppm/°C
Z-axis: 58 ppm/°C

Flammability Rating: 94V-0, lead-free process compatible

 

Benefits
Improved Rigidity: Woven glass reinforcement allows for easier handling.
Consistent Performance: Ideal for complex multi-layer high-frequency structures.
Low Dielectric Loss: Suitable for applications exceeding 20 GHz.
Expansion Coefficient Matching: Low in-plane expansion coefficient for reliable surface-mounted assemblies.
High Dimensional Stability: Ensures excellent production yields.
Cost-Effective: Economically priced for volume manufacturing.
Surface Smoothness: Facilitates finer line etching tolerances.

 

Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2)   W/mK Float 100℃ ASTM C518
Volume Resistivity 107   MΩ.cm A ASTM D257
Surface Resistivity 107   A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus   X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1   % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386
Td 500   TGA ASTM D3850
Density 2.1   gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74)   lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Technical Specifications

Stackup Configuration: 2-layer rigid PCB
 

Copper Layer 1: 35 μm
RO3203 Substrate: 30 mil (0.762 mm)
Copper Layer 2: 35 μm

 

Finished Board Thickness: 0.8 mm
Finished Copper Weight: 1 oz (1.4 mils) on outer layers
Minimum Trace/Space: 4/7 mils
Minimum Hole Size: 0.55 mm
Vias: 27 (no blind vias)
Surface Finish: Immersion Silver
Silkscreen: None on top or bottom
Solder Mask: None on top or bottom
Electrical Testing: 100% electrical test conducted prior to shipment

 

Rogers PCB 30mil RO3203 2 Layer Immersion Silver RF Circuits 0

 

Quality Standards
This PCB meets IPC-Class-2 standards, ensuring high reliability for various applications.

 

Typical Applications
Automotive collision avoidance systems
Global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure

 

Availability
The RO3203 PCB is available worldwide, making it an excellent choice for engineers and designers in need of high-performance RF and microwave solutions.

 

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
products
PRODUCTS DETAILS
Rogers PCB 30mil RO3203 2 Layer Immersion Silver RF Circuits
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RO3203 Substrate
PCB Size:
30mm X 60 Mm=1PCS
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Silver
Layer Count:
2-layer
PCB Thickness:
0.8 Mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Rogers RO3203 rf pcb boards

,

Immersion Silver rf pcb manufacturer

,

Rogers RO3203 rf pcb manufacturer

Product Description

The RO3203 PCB is engineered from high-frequency circuit materials that combine ceramic-filled laminates with woven fiberglass reinforcement. Part of the renowned RO3000 Series, this laminate is designed for exceptional electrical performance and enhanced mechanical stability, making it suitable for demanding applications beyond 40 GHz. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, the RO3203 PCB provides reliable solutions for high-frequency circuit designs.

 

Features
Material Type: Ceramic-filled PTFE composites
Dielectric Constant: 3.02 ±0.04 at 10 GHz/23°C
Dissipation Factor: 0.0016 at 10 GHz/23°C
Thermal Degradation Temperature (Td): > 500°C
Thermal Conductivity: 0.87 W/mK
Coefficient of Thermal Expansion (CTE):
X-axis: 13 ppm/°C
Y-axis: 13 ppm/°C
Z-axis: 58 ppm/°C

Flammability Rating: 94V-0, lead-free process compatible

 

Benefits
Improved Rigidity: Woven glass reinforcement allows for easier handling.
Consistent Performance: Ideal for complex multi-layer high-frequency structures.
Low Dielectric Loss: Suitable for applications exceeding 20 GHz.
Expansion Coefficient Matching: Low in-plane expansion coefficient for reliable surface-mounted assemblies.
High Dimensional Stability: Ensures excellent production yields.
Cost-Effective: Economically priced for volume manufacturing.
Surface Smoothness: Facilitates finer line etching tolerances.

 

Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2)   W/mK Float 100℃ ASTM C518
Volume Resistivity 107   MΩ.cm A ASTM D257
Surface Resistivity 107   A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus   X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1   % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386
Td 500   TGA ASTM D3850
Density 2.1   gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74)   lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Technical Specifications

Stackup Configuration: 2-layer rigid PCB
 

Copper Layer 1: 35 μm
RO3203 Substrate: 30 mil (0.762 mm)
Copper Layer 2: 35 μm

 

Finished Board Thickness: 0.8 mm
Finished Copper Weight: 1 oz (1.4 mils) on outer layers
Minimum Trace/Space: 4/7 mils
Minimum Hole Size: 0.55 mm
Vias: 27 (no blind vias)
Surface Finish: Immersion Silver
Silkscreen: None on top or bottom
Solder Mask: None on top or bottom
Electrical Testing: 100% electrical test conducted prior to shipment

 

Rogers PCB 30mil RO3203 2 Layer Immersion Silver RF Circuits 0

 

Quality Standards
This PCB meets IPC-Class-2 standards, ensuring high reliability for various applications.

 

Typical Applications
Automotive collision avoidance systems
Global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure

 

Availability
The RO3203 PCB is available worldwide, making it an excellent choice for engineers and designers in need of high-performance RF and microwave solutions.

 

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
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