60mil RF-35 Radio Frequency Pcb Double Sided HASL White Silkscreen

The RF-35 PCB is a cutting-edge organic-ceramic laminate from Taconic’s ORCER family, specifically tailored for commercial microwave and radio frequency applications. Utilizing woven glass reinforcement, RF-35 leverages Taconic's expertise in ceramic fill technology and coated PTFE fiberglass, making it an excellent choice for low-cost, high-volume production.

RF-35 is distinguished by its superior peel strength for both 1/2 ounce and 1 ounce copper, which is essential for rework situations. Additionally, its ultra-low moisture absorption rate and low dissipation factor significantly minimize phase shifts with frequency, ensuring reliable performance.

Key Features
Dielectric Constant: 3.5 at 1.9 GHz, providing high signal integrity.
Dissipation Factor: Exceptionally low at 0.0018 at 1.9 GHz, reducing energy loss.
Dielectric Breakdown Strength: 41 kV, offering robust insulation.
Coefficient of Thermal Expansion (CTE): X CTE of 19 ppm/°C, Y CTE of 24 ppm/°C, Z CTE of 64 ppm/°C, ensuring stability across temperature variations.
Flammability Rating: UL-94 V0, indicating compliance with safety standards.

Benefits
The RF-35 PCB delivers numerous advantages:

Cost-Effective: Ideal for high-volume applications without compromising quality.
Excellent Peel Strength: Superior adhesion facilitates easier rework and assembly.
Low Moisture Absorption: Ensures reliable performance in humid conditions.
Enhanced Surface Smoothness: Improves performance in high-frequency applications.
 

PCB Stackup Configuration

This PCB features a 2-layer rigid stackup:

Copper Layer 1: 35 μm
RF-35 Core: 1.524 mm (60 mil)
Copper Layer 2: 35 μm

This configuration results in a finished board thickness of 1.6 mm, with a total copper weight of 1 oz (1.4 mils) on the outer layers.

Construction Details
Board Dimensions: 45.9 mm x 30.5 mm (±0.15 mm)
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.3 mm
No Blind Vias included in the design.
Via Plating Thickness: 25 μm
Surface Finish: HASL (Hot Air Solder Leveling) for reliable solderability.
Silkscreen and Solder Mask: Features a white top silkscreen; no bottom silkscreen or solder mask.

Each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring top-notch reliability and performance.

Quality Assurance
This PCB adheres to the IPC-Class-2 quality standard, ensuring high reliability suitable for a variety of applications.

Applications
The RF-35 PCB is well-suited for a range of applications, including:

Power Amplifiers: Optimized for efficient signal amplification.
Filters and Couplers: Designed for effective signal processing.
Passive Components: Ideal for various passive RF components.

Availability
This PCB is available worldwide, making it an excellent choice for engineers and designers seeking high-performance, cost-effective solutions for RF applications.