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| Material: | TLX-8 | PCB Size: | 108.72mm X 59.59 Mm=1PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) | Surface Finish: | Immersion Gold |
| Layer Count: | 2-layer | PCB Thickness: | 1.6mm |
| High Light: | 60mil Immersion Gold Rigid Circuits,TLX-8 Immersion Gold Rigid Circuits,Immersion Gold pcb 2 layer |
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The TLX-8 is a PTFE fiberglass laminate material designed for reliable performance in a wide range of RF applications. Its versatility comes from the availability of various thicknesses and copper cladding options. This material is well-suited for low-layer-count microwave designs, offering mechanical reinforcement for use in severe environments such as:
- High-vibration conditions during space launch
- High-temperature exposure in engine modules
- Radiation-rich environments in space
- Extreme marine conditions for warship antennas
- Wide temperature ranges for altimeter substrates
Key Benefits
- Excellent PIM (Passive Intermodulation) performance, measured at less than -160 dBc
- Excellent mechanical and thermal properties
- Low and stable dielectric constant (Dk)
- Dimensionally stable with low moisture absorption
- Tightly controlled Dk
- Low dissipation factor (Df)
- UL 94 V0 flammability rating
- Suitable for low-layer-count microwave designs
| TLX-8 TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | V-0 | V-0 | ||
Technical Specifications
Electrical Properties
- Dielectric Constant @ 10 GHz: 2.55 ± 0.04
- Dissipation Factor @ 10 GHz: 0.0018
- Surface Resistivity (Elevated Temp.): 6.605 x 10^8 Mohm
- Surface Resistivity (Humidity Cond.): 3.550 x 10^6 Mohm
- Volume Resistivity (Elevated Temp.): 1.110 x 10^10 Mohm/cm
- Volume Resistivity (Humidity Cond.): 1.046 x 10^10 Mohm/cm
Dimensional Stability
- MD After Bake: 0.06 mm/M (mils/in)
- CD After Bake: 0.08 mm/M (mils/in)
- MD Thermal Stress: 0.09 mm/M (mils/in)
- CD Thermal Stress: 0.10 mm/M (mils/in)
CTE (25-260 °C)
- X: 21 ppm/°C
- Y: 23 ppm/°C
- Z: 215 ppm/°C
Thermal Properties
- 2% Weight Loss: 535 °C
- 5% Weight Loss: 553 °C
Chemical/Physical Properties
- Moisture Absorption: 0.02%
- Dielectric Breakdown: > 45 kV
- Flammability Rating: V-0 (UL-94)
PCB Construction
- 2-layer rigid PCB
- Copper layer 1: 35 μm
- Taconic TLX-8 Core: 1.524 mm (60 mil)
- Copper layer 2: 35 μm
- Board dimensions: 108.72 mm x 59.59 mm ± 0.15 mm
- Minimum trace/space: 5/5 mils
- Minimum hole size: 0.3 mm
- Finished board thickness: 1.6 mm
- Finished copper weight: 1 oz (1.4 mils) on outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion gold
- Top silkscreen: White
- Bottom silkscreen: None
- Top solder mask: None
- Bottom solder mask: None
- 100% electrical test prior to shipment
Availability
Worldwide
Typical Applications
- Radar systems
- Mobile communications
- Microwave test equipment
- Microwave transmission devices
- Couplers, splitters, combiners, amplifiers, and antennas
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
