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60mil RO3003 PCB Double-sided Immersion Gold Circuits
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60mil RO3003 PCB Double-sided Immersion Gold Circuits
  • name
  • name
  • name

60mil RO3003 PCB Double-sided Immersion Gold Circuits

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO3003
PCB Size:
63mm X 35 Mm=1PCS
Copper Weight:
1oz (1.4 Mils)
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
1.6mm
Highlight:

Double-sided Immersion Gold Circuits

,

RO3003 Immersion Gold Circuits

,

60mil Immersion Gold Circuits

Product Description

Introduction:
The Rogers RO3003 PCB is a state-of-the-art, ceramic-filled PTFE composite designed for commercial microwave and RF applications. This advanced laminate offers unparalleled stability of the dielectric constant (Dk) across a wide range of temperatures and frequencies, making it the perfect choice for cutting-edge technologies like automotive radar, 5G wireless infrastructure, and advanced driver assistance systems (ADAS).

 

Key Features:

Dielectric constant of 3 ± 0.04 at 10 GHz/23°C
Dissipation factor of 0.001 at 10 GHz/23°C
Thermal stability with Td > 500°C
Excellent mechanical properties with CTE matching copper
Low moisture absorption of just 0.04%
Economical volume manufacturing process

 

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   MΩ COND A IPC 2.5.17.1
Tensile Modulus 930
823		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
16
25		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits:

Reliable performance up to 77 GHz for applications like automotive radar
Stable dielectric constant ideal for filters, antennas, and oscillators
Dimensional stability for robust surface mount assembly
Suitable for hybrid multilayer designs with a range of dielectric constants
Cost-effective solution for high-volume production

 

PCB Specifications:

2-layer rigid PCB construction
60 mil (1.524 mm) Rogers RO3003 substrate
35 μm copper layers
Minimum trace/space of 4/6 mils
Finished board thickness of 1.6 mm
1 oz (1.4 mils) outer layer copper weight
Immersion gold surface finish

 

60mil RO3003 PCB Double-sided Immersion Gold Circuits 0

 

Applications:
The Rogers RO3003 PCB is the ideal choice for a wide range of high-frequency applications, including:

 

Automotive radar
Global positioning satellite antennas
Cellular telecommunications systems
Wireless communication patch antennas
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes

 

60mil RO3003 PCB Double-sided Immersion Gold Circuits 1

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
60mil RO3003 PCB Double-sided Immersion Gold Circuits
  • name
  • name
  • name
60mil RO3003 PCB Double-sided Immersion Gold Circuits
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO3003
PCB Size:
63mm X 35 Mm=1PCS
Copper Weight:
1oz (1.4 Mils)
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
1.6mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Double-sided Immersion Gold Circuits

,

RO3003 Immersion Gold Circuits

,

60mil Immersion Gold Circuits

Product Description

Introduction:
The Rogers RO3003 PCB is a state-of-the-art, ceramic-filled PTFE composite designed for commercial microwave and RF applications. This advanced laminate offers unparalleled stability of the dielectric constant (Dk) across a wide range of temperatures and frequencies, making it the perfect choice for cutting-edge technologies like automotive radar, 5G wireless infrastructure, and advanced driver assistance systems (ADAS).

 

Key Features:

Dielectric constant of 3 ± 0.04 at 10 GHz/23°C
Dissipation factor of 0.001 at 10 GHz/23°C
Thermal stability with Td > 500°C
Excellent mechanical properties with CTE matching copper
Low moisture absorption of just 0.04%
Economical volume manufacturing process

 

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   MΩ COND A IPC 2.5.17.1
Tensile Modulus 930
823		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
16
25		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits:

Reliable performance up to 77 GHz for applications like automotive radar
Stable dielectric constant ideal for filters, antennas, and oscillators
Dimensional stability for robust surface mount assembly
Suitable for hybrid multilayer designs with a range of dielectric constants
Cost-effective solution for high-volume production

 

PCB Specifications:

2-layer rigid PCB construction
60 mil (1.524 mm) Rogers RO3003 substrate
35 μm copper layers
Minimum trace/space of 4/6 mils
Finished board thickness of 1.6 mm
1 oz (1.4 mils) outer layer copper weight
Immersion gold surface finish

 

60mil RO3003 PCB Double-sided Immersion Gold Circuits 0

 

Applications:
The Rogers RO3003 PCB is the ideal choice for a wide range of high-frequency applications, including:

 

Automotive radar
Global positioning satellite antennas
Cellular telecommunications systems
Wireless communication patch antennas
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes

 

60mil RO3003 PCB Double-sided Immersion Gold Circuits 1

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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