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Product Details:
Payment & Shipping Terms:
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| Material: | RO3003 | PCB Size: | 63mm X 35 Mm=1PCS |
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| Copper Weight: | 1oz (1.4 Mils) | Surface Finish: | Immersion Gold |
| Layer Count: | 2-layer | PCB Thickness: | 1.6mm |
| High Light: | Double-sided Immersion Gold Circuits,RO3003 Immersion Gold Circuits,60mil Immersion Gold Circuits |
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Introduction:
The Rogers RO3003 PCB is a state-of-the-art, ceramic-filled PTFE composite designed for commercial microwave and RF applications. This advanced laminate offers unparalleled stability of the dielectric constant (Dk) across a wide range of temperatures and frequencies, making it the perfect choice for cutting-edge technologies like automotive radar, 5G wireless infrastructure, and advanced driver assistance systems (ADAS).
Key Features:
Dielectric constant of 3 ± 0.04 at 10 GHz/23°C
Dissipation factor of 0.001 at 10 GHz/23°C
Thermal stability with Td > 500°C
Excellent mechanical properties with CTE matching copper
Low moisture absorption of just 0.04%
Economical volume manufacturing process
| RO3003 Typical Value | |||||
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 |
X Y |
MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
17 16 25 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits:
Reliable performance up to 77 GHz for applications like automotive radar
Stable dielectric constant ideal for filters, antennas, and oscillators
Dimensional stability for robust surface mount assembly
Suitable for hybrid multilayer designs with a range of dielectric constants
Cost-effective solution for high-volume production
PCB Specifications:
2-layer rigid PCB construction
60 mil (1.524 mm) Rogers RO3003 substrate
35 μm copper layers
Minimum trace/space of 4/6 mils
Finished board thickness of 1.6 mm
1 oz (1.4 mils) outer layer copper weight
Immersion gold surface finish
Applications:
The Rogers RO3003 PCB is the ideal choice for a wide range of high-frequency applications, including:
Automotive radar
Global positioning satellite antennas
Cellular telecommunications systems
Wireless communication patch antennas
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
