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Product Details:
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Material: | RF-35TC | PCB Size: | 48.17 Mm X 47.7 Mm=3PCS = 3 Types, +/- 0.15mm |
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Copper Weight: | 1oz (1.4 Mils) | Surface Finish: | Immersion Gold |
Layer Count: | 2-layer | PCB Thickness: | 0.2mm |
High Light: | 1OZ RF-35TC PCB,5mil RF-35TC PCB,Double-sided RF-35TC PCB |
Introduction:
The RF-35TC PCB is a cutting-edge high-frequency material that offers best-in-class low dissipation factor and exceptional thermal conductivity. Designed for demanding high-power RF and microwave applications, this PTFE-based, ceramic-filled fiberglass substrate provides unparalleled performance where minimizing signal loss and efficiently dissipating heat are critical.
Features:
Thermally conductive low loss laminate with a dielectric constant of 3.5 ± 0.05 at 10 GHz/23°C
Ultra-low dissipation factor of 0.002 at 10 GHz/23°C
Impressive thermal conductivity of 0.87 W/m/K for 0.5 oz copper, 0.92 W/m/K for 1 oz copper
Excellent dimensional stability with low CTE of 11 ppm/°C (X-axis), 13 ppm/°C (Y-axis), 34 ppm/°C (Z-axis)
High thermal reliability with 5% weight loss temperature of 436°C
Low moisture absorption of only 0.05%
RF-35TC TYPICAL VALUES | |||||
Property | Test Method | Unit | Value | Unit | Value |
DK @10 GHz | IPC-650 2.5.5.5.1(modified) | 3.5 | 3.5 | ||
Tck(-30 to 120℃) | IPC-650 2.5.5.5.1(modified) | ppm | 24 | ppm | 24 |
Df @10 GHz | IPC-650 2.5.5.5.1(modified) | 0.0011 | 0.0011 | ||
Dielectric Breakdown | IPC-650 2.5.6(in-Plane,Two Pins in Oil) | kV | 56.7 | kV | 56.7 |
Dielectric Strength | ASTM D 149(Through Plane) | V/mil | 570 | V/mm | 22,441 |
Arc Resistance | IPC-650 2.5.1 | Seconds | 304 | Seconds | 304 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.05 | % | 0.05 |
Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 12,900 | N/mm2 | 88.94 |
Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 11,700 | N/mm2 | 80.67 |
Tensile Strength(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 9,020 | N/mm2 | 62.19 |
Tensile Strength(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 7,740 | N/mm2 | 53.37 |
Elongation at Break(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.89 | N/mm | 1.89 |
Elongation at Break(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.7 | % | 1.7 |
Young's Modulus(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 667,000 | N/mm2 | 4,599 |
Young's Modulus(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 637,000 | N/mm2 | 4,392 |
Poisson's Ratio(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.18 | 0.18 | ||
Poisson's Ratio(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.23 | 0.18 | ||
Compressive Modulus | ASTM D 695(23℃) | psi | 560,000 | N/mm2 | 3,861 |
Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.46 x 106 | N/mm2 | 10,309 |
Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.50 x 106 | N/mm2 | 10,076 |
Peel Stength(½ oz.CVH) | IPC-650 2.4.8(Thermal Stress.) | Ibs./inch | 7 | g/cm3 | 1.25 |
Thermal Conductivity(Unclad,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.6 | W/(mK) | 0.6 |
Thermal Conductivity(C1/C1,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.92 | W/(mK) | 0.92 |
Thermal Conductivity(CH/CH,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.87 | W/(mK) | 0.87 |
Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.23 | mm/M | 0.23 |
Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.64 | mm/M | 0.64 |
Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | -0.04 | mm/M | -0.04 |
Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.46 | mm/M | 0.46 |
Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 8.33 x 107 | Mohms | 8.33 x 107 |
Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 6.42 x 107 | Mohms | 6.42 x 107 |
Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 5.19 x 108 | Mohms/cm | 5.19 x 108 |
Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 2.91 x 108 | Mohms/cm | 2.91 x 108 |
CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 11 | ppm/℃ | 11 |
CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 13 | ppm/℃ | 13 |
CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 34 | ppm/℃ | 34 |
Density | ASTM D 792 | g/cm3 | 2.35 | g/cm3 | 2.35 |
Hardness | ASTM D 2240(Shore D) | 79.1 | 79.1 | ||
Strain at Break(MD) | ASTM D 790/IPC-650 2.4.4 | % | 0.014 | % | 0.014 |
Strain at Break(CD) | ASTM D 790/IPC-650 2.4.4 | % | 0.013 | % | 0.013 |
Specific Heat | ASTM E 1269-05,E 967-08,E968-02 | j/(g℃) | 0.94 | j/(g℃) | 0.94 |
Td(2% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 788 | ℃ | 420 |
Td(5% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 817 | ℃ | 436 |
Benefits:
"Best in class" loss tangent for maximum efficiency and signal integrity
Exceptional thermal management to dissipate heat from high-power components
Stable dielectric properties across a wide temperature range
Enhanced antenna gains and radiation efficiencies
Robust adhesion to very thin copper foils for high-density PCB designs
This 2-layer rigid PCB features a 0.127 mm (5 mil) RF-35TC core with 35 μm copper layers and is constructed to the highest quality standards. With its industry-leading performance, the RF-35TC is the premier choice for demanding RF and microwave designs.
Applications:
The RF-35TC PCB is ideal for a wide range of high-frequency, high-power applications, including:
Filters, couplers, and power amplifiers
Antennas and satellite communications
Radar and sensing systems
Test and measurement equipment
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848