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5mil RF-35TC PCB Double-sided 1OZ Circuit Board

5mil RF-35TC PCB Double-sided 1OZ Circuit Board

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-35TC
PCB Size:
48.17 Mm X 47.7 Mm=3PCS = 3 Types, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils)
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.2mm
Highlight:

1OZ RF-35TC PCB

,

5mil RF-35TC PCB

,

Double-sided RF-35TC PCB

Product Description

Introduction:
The RF-35TC PCB is a cutting-edge high-frequency material that offers best-in-class low dissipation factor and exceptional thermal conductivity. Designed for demanding high-power RF and microwave applications, this PTFE-based, ceramic-filled fiberglass substrate provides unparalleled performance where minimizing signal loss and efficiently dissipating heat are critical.

 

Features:

Thermally conductive low loss laminate with a dielectric constant of 3.5 ± 0.05 at 10 GHz/23°C
Ultra-low dissipation factor of 0.002 at 10 GHz/23°C
Impressive thermal conductivity of 0.87 W/m/K for 0.5 oz copper, 0.92 W/m/K for 1 oz copper
Excellent dimensional stability with low CTE of 11 ppm/°C (X-axis), 13 ppm/°C (Y-axis), 34 ppm/°C (Z-axis)
High thermal reliability with 5% weight loss temperature of 436°C
Low moisture absorption of only 0.05%

 

RF-35TC TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.5.1(modified)   3.5   3.5
Tck(-30 to 120℃) IPC-650 2.5.5.5.1(modified) ppm 24 ppm 24
Df @10 GHz IPC-650 2.5.5.5.1(modified)   0.0011   0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19   0.18   0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19   0.23   0.18
Compressive Modulus ASTM D 695(23) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 11 ppm/ 11
CTE(Y axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 13 ppm/ 13
CTE(Z axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 34 ppm/ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D)   79.1   79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g) 0.94 j/(g) 0.94
Td(2% Weight Loss) IPC-650 2.4.24.6/TGA oF 788 420
Td(5% Weight Loss) IPC-650 2.4.24.6/TGA oF 817 436

 

Benefits:

"Best in class" loss tangent for maximum efficiency and signal integrity
Exceptional thermal management to dissipate heat from high-power components
Stable dielectric properties across a wide temperature range
Enhanced antenna gains and radiation efficiencies
Robust adhesion to very thin copper foils for high-density PCB designs

 

5mil RF-35TC PCB Double-sided 1OZ Circuit Board 0

 

This 2-layer rigid PCB features a 0.127 mm (5 mil) RF-35TC core with 35 μm copper layers and is constructed to the highest quality standards. With its industry-leading performance, the RF-35TC is the premier choice for demanding RF and microwave designs.

 

Applications:
The RF-35TC PCB is ideal for a wide range of high-frequency, high-power applications, including:

Filters, couplers, and power amplifiers
Antennas and satellite communications
Radar and sensing systems
Test and measurement equipment

 

products
PRODUCTS DETAILS
5mil RF-35TC PCB Double-sided 1OZ Circuit Board
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-35TC
PCB Size:
48.17 Mm X 47.7 Mm=3PCS = 3 Types, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils)
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.2mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

1OZ RF-35TC PCB

,

5mil RF-35TC PCB

,

Double-sided RF-35TC PCB

Product Description

Introduction:
The RF-35TC PCB is a cutting-edge high-frequency material that offers best-in-class low dissipation factor and exceptional thermal conductivity. Designed for demanding high-power RF and microwave applications, this PTFE-based, ceramic-filled fiberglass substrate provides unparalleled performance where minimizing signal loss and efficiently dissipating heat are critical.

 

Features:

Thermally conductive low loss laminate with a dielectric constant of 3.5 ± 0.05 at 10 GHz/23°C
Ultra-low dissipation factor of 0.002 at 10 GHz/23°C
Impressive thermal conductivity of 0.87 W/m/K for 0.5 oz copper, 0.92 W/m/K for 1 oz copper
Excellent dimensional stability with low CTE of 11 ppm/°C (X-axis), 13 ppm/°C (Y-axis), 34 ppm/°C (Z-axis)
High thermal reliability with 5% weight loss temperature of 436°C
Low moisture absorption of only 0.05%

 

RF-35TC TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.5.1(modified)   3.5   3.5
Tck(-30 to 120℃) IPC-650 2.5.5.5.1(modified) ppm 24 ppm 24
Df @10 GHz IPC-650 2.5.5.5.1(modified)   0.0011   0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19   0.18   0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19   0.23   0.18
Compressive Modulus ASTM D 695(23) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 11 ppm/ 11
CTE(Y axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 13 ppm/ 13
CTE(Z axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 34 ppm/ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D)   79.1   79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g) 0.94 j/(g) 0.94
Td(2% Weight Loss) IPC-650 2.4.24.6/TGA oF 788 420
Td(5% Weight Loss) IPC-650 2.4.24.6/TGA oF 817 436

 

Benefits:

"Best in class" loss tangent for maximum efficiency and signal integrity
Exceptional thermal management to dissipate heat from high-power components
Stable dielectric properties across a wide temperature range
Enhanced antenna gains and radiation efficiencies
Robust adhesion to very thin copper foils for high-density PCB designs

 

5mil RF-35TC PCB Double-sided 1OZ Circuit Board 0

 

This 2-layer rigid PCB features a 0.127 mm (5 mil) RF-35TC core with 35 μm copper layers and is constructed to the highest quality standards. With its industry-leading performance, the RF-35TC is the premier choice for demanding RF and microwave designs.

 

Applications:
The RF-35TC PCB is ideal for a wide range of high-frequency, high-power applications, including:

Filters, couplers, and power amplifiers
Antennas and satellite communications
Radar and sensing systems
Test and measurement equipment

 

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