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| Material: | F4BTM300 | PCB Size: | 84.33mm X 59.5 Mm=2Types = 2PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
| Layer Count: | 2-layer | PCB Thickness: | 40 Mil |
| High Light: | F4BTM300 PCB Immersion Gold,High Frequency PCB Immersion Gold,40mil PCB Immersion Gold |
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In the rapidly evolving world of high-frequency electronic systems, the demand for reliable and high-performance printed circuit boards (PCBs) has never been more crucial. Wangling, a leading innovator in the field of advanced materials, has answered this call with the introduction of the F4BTM300 – a groundbreaking 2-layer rigid PCB designed to push the boundaries of microwave, RF, and radar technologies.
At the heart of the F4BTM300 is Wangling's proprietary dielectric formulation, which seamlessly blends fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. This scientific approach to material engineering has resulted in a laminate that boasts an impressive set of electrical and thermal properties, making it an ideal choice for a wide range of high-frequency applications.
Unparalleled Electrical Performance
The F4BTM300 series is built upon the foundation of Wangling's renowned F4BM dielectric layer, but it takes performance to new heights through the strategic incorporation of high-dielectric and low-loss nano-ceramics. This innovative approach has yielded a dielectric constant (Dk) of 3.0 at 10GHz, a remarkable achievement that enables designers to work with tighter circuit dimensions and achieve higher packing densities without sacrificing signal integrity.
Complementing the exceptional Dk is an equally impressive dissipation factor (Df) of just 0.0018 at 10GHz. This exceptionally low loss characteristic ensures that signal transmission through the F4BTM300 PCB is efficient and well-preserved, minimizing power dissipation and thermal management challenges.
| Product Technical Parameters | Product Models & Data Sheet | ||||||
| Product Features | Test Conditions | Unit | F4BTM298 | F4BTM300 | F4BTM320 | F4BTM350 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.98 | 3.0 | 3.2 | 3.5 | |
| Dielectric Constant Tolerance | / | / | ±0.06 | ±0.06 | ±0.06 | ±0.07 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0018 | 0.0018 | 0.0020 | 0.0025 | |
| 20GHz | / | 0.0023 | 0.0023 | 0.0026 | 0.0035 | ||
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -78 | -75 | -75 | -60 | |
| Peel Strength | 1 OZ F4BTM | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | |
| 1 OZ F4BTME | N/mm | >1.4 | >1.4 | >1.4 | >1.4 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >32 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >34 | >35 | >40 | >40 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 15,16 | 15,16 | 13,15 | 10,12 |
| Z direction | -55 º~288ºC | ppm/ºC | 78 | 72 | 58 | 51 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.05 | |
| Density | Room Temperature | g/cm3 | 2.25 | 2.25 | 2.20 | 2.20 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.42 | 0.42 | 0.50 | 0.54 | |
| PIM | Only applicable to F4BTME | dBc | ≤-160 | ≤-160 | ≤-160 | ≤-160 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
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Thermal Resilience and Dimensional Stability
High-frequency electronic systems often operate in demanding environments, where thermal stability and dimensional precision are critical factors. The F4BTM300 PCB has been engineered to excel in these areas, boasting a low thermal coefficient of dielectric constant (-78 ppm/°C) and a carefully balanced coefficient of thermal expansion (CTE) across the x, y, and z-axes.
The x-axis CTE of 15 ppm/°C, y-axis CTE of 16 ppm/°C, and z-axis CTE of 78 ppm/°C ensure that the PCB maintains dimensional stability and minimizes the risk of warping or deformation, even when subjected to temperature extremes ranging from -55°C to 288°C. This level of thermal resilience is a game-changer for designers, allowing them to confidently integrate the F4BTM300 into their most demanding applications without compromising reliability or performance.
Tailored for High-Frequency Applications
The capabilities of the F4BTM300 PCB extend far beyond its exceptional electrical and thermal properties. Wangling has also developed two variants, the F4BTM300 and the F4BTME300, to cater to the specific needs of different high-frequency applications.
The F4BTM300 is paired with electrodeposited (ED) copper foil, making it an ideal choice for applications that do not require stringent passive intermodulation (PIM) performance. This variant offers excellent signal integrity, precise line control, and low conductor loss, making it a go-to solution for a wide range of microwave, RF, and radar systems.
On the other hand, the F4BTME300 is paired with reverse-treated (RTF) copper foil, providing superior PIM performance, more precise line control, and even lower conductor loss. This variant is particularly well-suited for applications where PIM mitigation is a critical requirement, such as in phase shifters, power dividers, couplers, and combiners used in phased array antennas and satellite communications.
| PCB Material: | PTFE / glass fiber cloth / Nano-ceramic filler | ||
| Designation (F4BTM ) | F4BTM | DK (10GHz) | DF (10 GHz) |
| F4BTM298 | 2.98±0.06 | 0.0018 | |
| F4BTM300 | 3.0±0.06 | 0.0018 | |
| F4BTM320 | 3.2±0.06 | 0.0020 | |
| F4BTM350 | 3.5±0.07 | 0.0025 | |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (or overall thickness) | 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤400mm X 500mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
Reliable and Versatile
To ensure the highest levels of reliability, the F4BTM300 PCB has been designed and manufactured to the exacting standards of IPC-Class-2 quality. This certification, combined with a moisture absorption of less than 0.05% and a flammability rating of UL-94 V0, underscores Wangling's commitment to delivering products that can withstand the rigors of demanding environments.
The versatility of the F4BTM300 PCB is further enhanced by its comprehensive set of construction details. With a finished board thickness of 1.1mm, 35μm copper layers, and a minimum trace/space of 4/6 mils, this laminate can be seamlessly integrated into a wide range of high-frequency electronic systems, from microwave and radar to phase-sensitive antennas and satellite communications.
Unlocking the Future of Microwave Technology
As the demand for higher performance, greater reliability, and increased miniaturization in high-frequency electronic systems continues to grow, Wangling's F4BTM300 PCB stands as a beacon of innovation, poised to transform the way designers approach the challenges of the microwave age. With its unparalleled electrical and thermal properties, tailored variants, and unwavering commitment to quality, this groundbreaking laminate is set to unlock new frontiers in microwave technology, paving the way for a future of unprecedented performance and reliability.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
