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20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits

20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO4003C
PCB Size:
43.88mm X 33.2 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
20mil
Highlight:

20mil RO4003C PCB

,

High Frequency Circuits PCB

,

Immersion Gold pcb 2 layer

Product Description

Introducing a newly shipped PCB based on the RO4003C material. The RO4003C PCB, utilizing Rogers Corporation's proprietary woven glass reinforced hydrocarbon/ceramics materials, combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This groundbreaking PCB offers exceptional performance and cost-effectiveness, making it an ideal choice for a wide range of applications.

 

Key Features:

Unmatched Electrical Performance: The RO4003C PCB boasts an impressive dielectric constant (DK) of 3.38 +/- 0.05 at 10GHz, ensuring accurate signal transmission and reception. With a low dissipation factor of 0.0027 at 10GHz, it minimizes signal loss, providing superior performance in high-frequency applications.

 

Enhanced Thermal Management: Engineered with a thermal conductivity of 0.71 W/m/°K, the RO4003C PCB excels at dissipating heat efficiently. Its low coefficient of thermal expansion (CTE) matched to copper (11ppm/°C in the X-axis, 14ppm/°C in the Y-axis) guarantees thermal stability, even in extreme temperature conditions (-50°C to 150°C).

 

Cost-Effective Solution: The RO4003C PCB offers the same processing method as standard epoxy/glass, eliminating the need for special through-hole treatments or handling procedures. This results in lower fabrication costs compared to conventional microwave laminates, making it an economical choice for high-performance applications.

 

Versatility and Reliability: Designed for multi-layer board (MLB) constructions, the RO4003C PCB is ideal for performance-sensitive, high-volume applications. Its competitive pricing, combined with exceptional electrical characteristics, ensures reliable and cost-effective solutions.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150 IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/ -55to288 IPC-TM-650 2.4.41
Tg >280   TMA A IPC-TM-650 2.4.24.3
Td 425   TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80 ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density 1.79   gm/cm3 23 ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits 0

 

Featuring a 2-layer rigid PCB stackup with a copper layer thickness of 35 μm (outer layers) and a Rogers 4003C core thickness of 0.508 mm (20mil), this PCB provides a solid foundation for your projects. It has a board dimension of 43.88mm x 33.2 mm, allowing for compact and efficient layouts.

 

With a minimum trace/space of 5/5 mils and a minimum hole size of 0.3mm, the RO4003C PCB supports intricate and precise circuit designs. It has a finished board thickness of 0.6mm and a finished copper weight of 1oz (1.4 mils) on outer layers, ensuring durability and reliability.

Each PCB undergoes rigorous testing, with 100% electrical testing performed prior to shipment, ensuring its quality and adherence to IPC-Class-2 standards. The availability of worldwide shipping ensures easy access to this high-performance PCB.

 

Some typical applications of the RO4003C PCB include cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNB's for direct broadcast satellites. Choose the RO4003C PCB to unleash the power of high-frequency performance in your advanced applications. Trust Rogers Corporation's expertise in cutting-edge PCB materials for superior results.

 

20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits 1

products
PRODUCTS DETAILS
20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO4003C
PCB Size:
43.88mm X 33.2 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
20mil
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

20mil RO4003C PCB

,

High Frequency Circuits PCB

,

Immersion Gold pcb 2 layer

Product Description

Introducing a newly shipped PCB based on the RO4003C material. The RO4003C PCB, utilizing Rogers Corporation's proprietary woven glass reinforced hydrocarbon/ceramics materials, combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This groundbreaking PCB offers exceptional performance and cost-effectiveness, making it an ideal choice for a wide range of applications.

 

Key Features:

Unmatched Electrical Performance: The RO4003C PCB boasts an impressive dielectric constant (DK) of 3.38 +/- 0.05 at 10GHz, ensuring accurate signal transmission and reception. With a low dissipation factor of 0.0027 at 10GHz, it minimizes signal loss, providing superior performance in high-frequency applications.

 

Enhanced Thermal Management: Engineered with a thermal conductivity of 0.71 W/m/°K, the RO4003C PCB excels at dissipating heat efficiently. Its low coefficient of thermal expansion (CTE) matched to copper (11ppm/°C in the X-axis, 14ppm/°C in the Y-axis) guarantees thermal stability, even in extreme temperature conditions (-50°C to 150°C).

 

Cost-Effective Solution: The RO4003C PCB offers the same processing method as standard epoxy/glass, eliminating the need for special through-hole treatments or handling procedures. This results in lower fabrication costs compared to conventional microwave laminates, making it an economical choice for high-performance applications.

 

Versatility and Reliability: Designed for multi-layer board (MLB) constructions, the RO4003C PCB is ideal for performance-sensitive, high-volume applications. Its competitive pricing, combined with exceptional electrical characteristics, ensures reliable and cost-effective solutions.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150 IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/ -55to288 IPC-TM-650 2.4.41
Tg >280   TMA A IPC-TM-650 2.4.24.3
Td 425   TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80 ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density 1.79   gm/cm3 23 ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits 0

 

Featuring a 2-layer rigid PCB stackup with a copper layer thickness of 35 μm (outer layers) and a Rogers 4003C core thickness of 0.508 mm (20mil), this PCB provides a solid foundation for your projects. It has a board dimension of 43.88mm x 33.2 mm, allowing for compact and efficient layouts.

 

With a minimum trace/space of 5/5 mils and a minimum hole size of 0.3mm, the RO4003C PCB supports intricate and precise circuit designs. It has a finished board thickness of 0.6mm and a finished copper weight of 1oz (1.4 mils) on outer layers, ensuring durability and reliability.

Each PCB undergoes rigorous testing, with 100% electrical testing performed prior to shipment, ensuring its quality and adherence to IPC-Class-2 standards. The availability of worldwide shipping ensures easy access to this high-performance PCB.

 

Some typical applications of the RO4003C PCB include cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNB's for direct broadcast satellites. Choose the RO4003C PCB to unleash the power of high-frequency performance in your advanced applications. Trust Rogers Corporation's expertise in cutting-edge PCB materials for superior results.

 

20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits 1

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