20mil DiClad 870 PCB 1OZ Copper Rigid Circuits

Introducing the DiClad 870 PCB, a newly shipped PCB that utilizes Rogers DiClad 870 laminates. These laminates are woven fiberglass reinforced, PTFE-based composites designed specifically for use as printed circuit board substrates. With their unique composition, the DiClad 870 laminates offer a lower dielectric constant (Dk) and dissipation factor, providing exceptional performance while maintaining a similar thickness to other laminates in the DiClad series.

Key Features:
- Dielectric Constant (Dk): 2.33 at 10 GHz and 1 MHz, 50% RH
- Dissipation Factor: 0.0013 at 10 GHz, 0.0009 at 1 MHz, 50% RH
- TcDK (Temperature Coefficient of Dk): -161 ppm/°C, operating from -10°C to 140°C at 10 GHz
- Arc Resistance: >180 seconds
- Low Moisture Absorption: 0.02%
- Coefficient of Thermal Expansion (CTE): X-axis - 17 ppm/°C, Y-axis - 29 ppm/°C, Z-axis - 217 ppm/°C
- Copper Peel Strength: 14 lbs/in, 10s @ 288°C
- Flammability: UL 94V0 grade

Benefits:
- Lowest moisture absorption among PTFE-based composites
- Stable Dk over a wide frequency range
- Support for wider line widths, enabling lower insertion loss

This PCB features a 2-layer rigid stackup for robust construction. The board consists of Copper Layer 1, with a thickness of 35 μm, followed by the DiClad 870 core, measuring 0.508 mm (20mil) in thickness. The stackup is completed with Copper Layer 2, matching the same 35 μm thickness. This configuration ensures reliable performance and efficient signal transmission throughout the circuit.

The PCB construction details provide precise specifications for optimal performance. The board dimensions are set at 66.2 mm x 66.2 mm for a single piece, with a tolerance of +/- 0.15 mm. The minimum trace/space is 5/4 mils, allowing for intricate circuit designs. With a minimum hole size of 0.4 mm, the PCB accommodates various component types and facilitates efficient assembly.

This PCB excludes blind vias, simplifying the manufacturing process. The finished board thickness is optimized at 0.6 mm for durability while maintaining a compact form factor. Copper weight is set at 1oz (1.4 mils) for the outer layers, ensuring efficient thermal management and reliable conductivity. Via plating thickness is 20 μm, further enhancing electrical connections.

For surface finish, this PCB employs immersion silver, providing excellent conductivity and corrosion resistance. The absence of top and bottom silkscreens and solder masks streamlines the manufacturing process while maintaining functionality.

To ensure the highest quality, each PCB undergoes a 100% electrical test before shipment. This comprehensive test guarantees the functionality and reliability of the board, giving you confidence in its performance.

With 16 components and a total of 40 pads, this PCB offers versatility for various electronic designs. It features 26 thru-hole pads and 14 top SMT pads, providing options for different component placement and assembly techniques. The PCB includes 15 vias for efficient signal routing and connectivity. With 2 nets, the board enables effective communication between components.

The artwork format for this PCB is Gerber RS-274-X, a widely accepted industry standard. This PCB meets the IPC-Class-2 standard, ensuring reliable performance and quality. It is available for shipping worldwide, allowing you to access this advanced PCB for your projects, regardless of your location. Experience the reliability and versatility of the DiClad 870 PCB for your electronic designs.

The DiClad 870 PCB is suitable for a range of applications, including radar feed networks, commercial phased array networks, low-loss base station antennas, guidance systems, digital radio antennas, and components like filters, couplers, and low-noise amplifiers (LNAs). Harness the exceptional performance and reliability of the DiClad 870 PCB to unlock the full potential of your electronic designs.