30mil DiClad 527 PCB 2 Layer Immersion Silver White Silkscreen

Introducing the DiClad 527 PCB, a newly shipped product that utilizes Rogers DiClad 527 laminates. These laminates are woven fiberglass reinforced, PTFE-based composite materials specifically designed for use as printed circuit board substrates. The DiClad 527 offers a higher ratio of fiberglass reinforcement to PTFE content, resulting in a range of enhanced features.

Features:

Dielectric Constant (Dk) Range: 2.4 to 2.6 at 10 GHz and 1 MHz, 50% RH
Dissipation Factor: 0.0017 at 10 GHz, 0.0010 at 1 MHz, 50% RH
TcDK (Temperature Coefficient of Dk): -153 ppm/°C, operating from -10°C to 140°C at 10 GHz
Low Moisture Absorption: 0.03%
Coefficient of Thermal Expansion (CTE): X-axis - 14 ppm/°C, Y-axis - 21 ppm/°C, Z-axis - 173 ppm/°C
 

Benefits:

Extremely Low Loss Tangent
Excellent Dimensional Stability
Consistent Product Performance
Uniform Electrical Properties Across Frequency
Reliable Mechanical Performance
Excellent Chemical Resistance
Stable Dk over a wide frequency range
Low circuit losses at high frequencies
Minimal performance drift in high humidity environments

The DiClad 527 PCB features a 2-layer rigid stackup for robust construction. The board consists of Copper Layer 1, with a thickness of 35 μm, followed by the DiClad 527 Core, measuring 0.762 mm (30mil) in thickness. The stackup is completed with Copper Layer 2, matching the same 35 μm thickness. This configuration ensures reliable performance and efficient signal transmission throughout the circuit.

When it comes to construction details, the DiClad 527 PCB offers precise specifications to meet your requirements. The board dimensions are set at 61.71 mm x 64 mm for a single piece, with a tolerance of +/- 0.15 mm. The minimum trace/space is 4/4 mils, allowing for intricate circuit designs. With a minimum hole size of 0.4 mm, the PCB accommodates various component types and facilitates efficient assembly.

The PCB design excludes blind vias, simplifying the manufacturing process. The finished board thickness is optimized at 0.8 mm for durability while maintaining a compact form factor. Copper weight is set at 1oz (1.4 mils) for the outer layers, ensuring efficient thermal management and reliable conductivity. Via plating thickness is 20 μm, further enhancing electrical connections.

For surface finish, the DiClad 527 PCB employs immersion silver, providing excellent conductivity and corrosion resistance. The top silkscreen is in white, enabling easy component identification and assembly. The top solder mask is green, offering protection and insulation for the copper traces. The absence of a bottom silkscreen and bottom solder mask streamlines the manufacturing process while maintaining functionality.

To ensure the highest quality, each DiClad 527 PCB undergoes a 100% electrical test before shipment. This comprehensive test guarantees the functionality and reliability of the board, giving you confidence in its performance.

With 21 components and a total of 83 pads, the PCB offers versatility for various electronic designs. It features 57 thru-hole pads and 25 top SMT pads, providing options for different component placement and assembly techniques. The PCB includes 23 vias for efficient signal routing and connectivity. With 2 nets, the board enables effective communication between components.

The artwork format for the DiClad 527 PCB is Gerber RS-274-X, a widely accepted standard in the industry. The PCB meets the IPC-Class-2 standard, ensuring reliable performance and quality. It is available for shipping worldwide, allowing you to access this advanced PCB for your projects, no matter your location.

Typical Applications:

Radar Feed Networks
Commercial Phased Array Networks
Low Loss Base Station Antennas
Guidance Systems
Digital Radio Antennas
Filters, Couplers, LNAs