MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing our newly shipped PCB. The AD250C Commercial Microwave and RF PCB is a cutting-edge printed circuit board (PCB) built on the innovative Rogers AD250C laminate material. Designed specifically for telecommunications infrastructure, this PCB offers exceptional performance and cost-effectiveness, making it an ideal choice for a wide range of applications.
Key Features:
1. Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates: The PCB is constructed using high-quality materials, ensuring durability and reliability.
2. Controlled Dielectric Constant: With a dielectric constant of 2.5 and tight tolerance at 10 GHz/23°C, the AD250C PCB provides consistent and predictable circuit performance.
3. Low Loss Tangent: The PCB boasts a low loss tangent of <0.002 at 10 GHz, resulting in excellent circuit performance across typical wireless frequency bands.
4. High Temperature Resistance: With a decomposition temperature (Td) exceeding 500°C, the AD250C PCB maintains its integrity even under extreme heat conditions.
5. Moisture Absorption: The PCB exhibits minimal moisture absorption, with a rate of only 0.04%, ensuring long-term reliability and stability.
6. Excellent Dimensional Stability: The AD250C PCB offers exceptional dimensional stability, resulting in repeatable circuit performance and improved manufacturing yields.
7. Very Low PIM: With an impressive PIM rating of -159 dBc at 30 mil, 1900 MHz, this PCB delivers outstanding antenna performance and minimizes yield loss associated with PIM-related issues.
Electrical Properties | AD250C | Units | Test Conditions | Test Method | |
PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
Dielectric Constant (process) | 2.52 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
Dielectric Constant (design) | 2.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant | -117 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
Volume Resistivity | 4.8 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Surface Resistivity | 4.1 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Electrical Strength (dielectric strength) | 979 | V/mil | - | - | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
Thermal Properties | |||||
Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
Coefficient of Thermal Expansion - x | 47 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - y | 29 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Thermal Conductivity | 0.33 | W/mK | - | z direction | ASTM D5470 |
Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
Mechanical Properties | |||||
Copper Peel Strength after Thermal Stress | 2.6 (14.8) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
Tensile Strength (MD/CMD) | 6.0/5.6 (41.4/38.6) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
Flex Modulus (MD/CMD) | 885/778 (6,102/5,364) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
Dimensional Stability (MD/CMD) | 0.02/0.06 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
Physical Properties | |||||
Flammability | V-0 | - | - | - | UL-94 |
Moisture Absorption | 0.04 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Benefits:
1. Superior Antenna Efficiency: The AD250C PCB enables higher antenna efficiencies, ensuring optimal performance in antenna applications.
2. Repeatable Circuit Performance: Thanks to its controlled dielectric constant and ceramic composition, this PCB provides repeatable circuit performance, even in varying temperature conditions.
3. Enhanced Dk Stability: The ceramic component of the PCB contributes to a higher degree of dielectric constant (Dk) stability during temperature changes, ensuring consistent operation.
PCB Stackup and Construction:
This PCB is a 2-layer rigid PCB with a copper layer on both sides. It features a 35 μm copper layer on the top and bottom, sandwiching the 0.762 mm (30 mil) AD250C laminate. The finished board thickness is 0.8mm, and the outer layers have a 1oz (1.4 mils) copper weight. The vias have a 20 μm plating thickness. The surface finish is Immersion Gold, providing excellent conductivity and corrosion resistance. Notably, the PCB does not have silkscreen on either the top or bottom side.
PCB Material: | PTFE based Woven Fiberglass/Ceramic Filled Composites |
Designation: | AD250C |
Dielectric constant: | 2.50 (10 GHz) |
Dissipation factor | 0.0013 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated etc.. |
PCB Specifications:
- Board Dimensions: 196mm x 162mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.3mm
- No Blind Vias
- 100% Electrical Test: Each PCB undergoes a comprehensive electrical test prior to shipment, ensuring quality and reliability.
PCB Statistics:
- Components: 81
- Total Pads: 228
- Thru Hole Pads: 97
- Top SMT Pads: 131
- Bottom SMT Pads: 0
- Vias: 132
- Nets: 4
Accepted Standards and Availability:
This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and performance. It is available for purchase worldwide, making it easily accessible for customers across different regions.
Typical Applications:
The AD250C PCB is well-suited for various applications, including:
- Cellular infrastructure base station antennas
- Automotive telematics antenna systems
- Commercial satellite radio antennas
Experience the exceptional performance and reliability of the AD250C Commercial Microwave and RF PCB. With its advanced features, controlled dielectric constant, and low loss tangent, this PCB empowers your wireless communication infrastructure with unparalleled efficiency and stability.
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing our newly shipped PCB. The AD250C Commercial Microwave and RF PCB is a cutting-edge printed circuit board (PCB) built on the innovative Rogers AD250C laminate material. Designed specifically for telecommunications infrastructure, this PCB offers exceptional performance and cost-effectiveness, making it an ideal choice for a wide range of applications.
Key Features:
1. Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates: The PCB is constructed using high-quality materials, ensuring durability and reliability.
2. Controlled Dielectric Constant: With a dielectric constant of 2.5 and tight tolerance at 10 GHz/23°C, the AD250C PCB provides consistent and predictable circuit performance.
3. Low Loss Tangent: The PCB boasts a low loss tangent of <0.002 at 10 GHz, resulting in excellent circuit performance across typical wireless frequency bands.
4. High Temperature Resistance: With a decomposition temperature (Td) exceeding 500°C, the AD250C PCB maintains its integrity even under extreme heat conditions.
5. Moisture Absorption: The PCB exhibits minimal moisture absorption, with a rate of only 0.04%, ensuring long-term reliability and stability.
6. Excellent Dimensional Stability: The AD250C PCB offers exceptional dimensional stability, resulting in repeatable circuit performance and improved manufacturing yields.
7. Very Low PIM: With an impressive PIM rating of -159 dBc at 30 mil, 1900 MHz, this PCB delivers outstanding antenna performance and minimizes yield loss associated with PIM-related issues.
Electrical Properties | AD250C | Units | Test Conditions | Test Method | |
PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
Dielectric Constant (process) | 2.52 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
Dielectric Constant (design) | 2.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant | -117 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
Volume Resistivity | 4.8 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Surface Resistivity | 4.1 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Electrical Strength (dielectric strength) | 979 | V/mil | - | - | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
Thermal Properties | |||||
Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
Coefficient of Thermal Expansion - x | 47 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - y | 29 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Thermal Conductivity | 0.33 | W/mK | - | z direction | ASTM D5470 |
Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
Mechanical Properties | |||||
Copper Peel Strength after Thermal Stress | 2.6 (14.8) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
Tensile Strength (MD/CMD) | 6.0/5.6 (41.4/38.6) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
Flex Modulus (MD/CMD) | 885/778 (6,102/5,364) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
Dimensional Stability (MD/CMD) | 0.02/0.06 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
Physical Properties | |||||
Flammability | V-0 | - | - | - | UL-94 |
Moisture Absorption | 0.04 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Benefits:
1. Superior Antenna Efficiency: The AD250C PCB enables higher antenna efficiencies, ensuring optimal performance in antenna applications.
2. Repeatable Circuit Performance: Thanks to its controlled dielectric constant and ceramic composition, this PCB provides repeatable circuit performance, even in varying temperature conditions.
3. Enhanced Dk Stability: The ceramic component of the PCB contributes to a higher degree of dielectric constant (Dk) stability during temperature changes, ensuring consistent operation.
PCB Stackup and Construction:
This PCB is a 2-layer rigid PCB with a copper layer on both sides. It features a 35 μm copper layer on the top and bottom, sandwiching the 0.762 mm (30 mil) AD250C laminate. The finished board thickness is 0.8mm, and the outer layers have a 1oz (1.4 mils) copper weight. The vias have a 20 μm plating thickness. The surface finish is Immersion Gold, providing excellent conductivity and corrosion resistance. Notably, the PCB does not have silkscreen on either the top or bottom side.
PCB Material: | PTFE based Woven Fiberglass/Ceramic Filled Composites |
Designation: | AD250C |
Dielectric constant: | 2.50 (10 GHz) |
Dissipation factor | 0.0013 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated etc.. |
PCB Specifications:
- Board Dimensions: 196mm x 162mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.3mm
- No Blind Vias
- 100% Electrical Test: Each PCB undergoes a comprehensive electrical test prior to shipment, ensuring quality and reliability.
PCB Statistics:
- Components: 81
- Total Pads: 228
- Thru Hole Pads: 97
- Top SMT Pads: 131
- Bottom SMT Pads: 0
- Vias: 132
- Nets: 4
Accepted Standards and Availability:
This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and performance. It is available for purchase worldwide, making it easily accessible for customers across different regions.
Typical Applications:
The AD250C PCB is well-suited for various applications, including:
- Cellular infrastructure base station antennas
- Automotive telematics antenna systems
- Commercial satellite radio antennas
Experience the exceptional performance and reliability of the AD250C Commercial Microwave and RF PCB. With its advanced features, controlled dielectric constant, and low loss tangent, this PCB empowers your wireless communication infrastructure with unparalleled efficiency and stability.