logo
products
PRODUCTS DETAILS
Home > Products >
30mil AD250C Double-sided PCB Immersion Gold Plating

30mil AD250C Double-sided PCB Immersion Gold Plating

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
AD250C
PCB Size:
196mm X 162 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
30mil
Highlight:

Double-sided PCB Immersion Gold Plating

,

AD250C PCB Immersion Gold Plating

,

30mil PCB Immersion Gold Plating

Product Description

Introducing our newly shipped PCB. The AD250C Commercial Microwave and RF PCB is a cutting-edge printed circuit board (PCB) built on the innovative Rogers AD250C laminate material. Designed specifically for telecommunications infrastructure, this PCB offers exceptional performance and cost-effectiveness, making it an ideal choice for a wide range of applications.

 

Key Features:
1. Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates: The PCB is constructed using high-quality materials, ensuring durability and reliability.

 

2. Controlled Dielectric Constant: With a dielectric constant of 2.5 and tight tolerance at 10 GHz/23°C, the AD250C PCB provides consistent and predictable circuit performance.
 

3. Low Loss Tangent: The PCB boasts a low loss tangent of <0.002 at 10 GHz, resulting in excellent circuit performance across typical wireless frequency bands.
 

4. High Temperature Resistance: With a decomposition temperature (Td) exceeding 500°C, the AD250C PCB maintains its integrity even under extreme heat conditions.
 

5. Moisture Absorption: The PCB exhibits minimal moisture absorption, with a rate of only 0.04%, ensuring long-term reliability and stability.
 

6. Excellent Dimensional Stability: The AD250C PCB offers exceptional dimensional stability, resulting in repeatable circuit performance and improved manufacturing yields.
 

7. Very Low PIM: With an impressive PIM rating of -159 dBc at 30 mil, 1900 MHz, this PCB delivers outstanding antenna performance and minimizes yield loss associated with PIM-related issues.

 

Electrical Properties AD250C Units Test Conditions Test Method
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.52 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
Dielectric Constant (design) 2.50 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -117 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 4.8 x 108 Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 4.1 x 107 Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 979 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 47 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 29 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.33 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.6
(14.8)
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 6.0/5.6 (41.4/38.6) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 885/778 (6,102/5,364) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.02/0.06 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.04 % E1/105 +D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716

 

Benefits:
1. Superior Antenna Efficiency: The AD250C PCB enables higher antenna efficiencies, ensuring optimal performance in antenna applications.

 

2. Repeatable Circuit Performance: Thanks to its controlled dielectric constant and ceramic composition, this PCB provides repeatable circuit performance, even in varying temperature conditions.
 

3. Enhanced Dk Stability: The ceramic component of the PCB contributes to a higher degree of dielectric constant (Dk) stability during temperature changes, ensuring consistent operation.

 

PCB Stackup and Construction:
This PCB is a 2-layer rigid PCB with a copper layer on both sides. It features a 35 μm copper layer on the top and bottom, sandwiching the 0.762 mm (30 mil) AD250C laminate. The finished board thickness is 0.8mm, and the outer layers have a 1oz (1.4 mils) copper weight. The vias have a 20 μm plating thickness. The surface finish is Immersion Gold, providing excellent conductivity and corrosion resistance. Notably, the PCB does not have silkscreen on either the top or bottom side.

 

PCB Material: PTFE based Woven Fiberglass/Ceramic Filled Composites
Designation: AD250C
Dielectric constant: 2.50 (10 GHz)
Dissipation factor 0.0013 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated etc..

 

PCB Specifications:
- Board Dimensions: 196mm x 162mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.3mm
- No Blind Vias
- 100% Electrical Test: Each PCB undergoes a comprehensive electrical test prior to shipment, ensuring quality and reliability.

 

PCB Statistics:
- Components: 81
- Total Pads: 228
- Thru Hole Pads: 97
- Top SMT Pads: 131
- Bottom SMT Pads: 0
- Vias: 132
- Nets: 4

 

Accepted Standards and Availability:
This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and performance. It is available for purchase worldwide, making it easily accessible for customers across different regions.

 

Typical Applications:
The AD250C PCB is well-suited for various applications, including:
- Cellular infrastructure base station antennas
- Automotive telematics antenna systems
- Commercial satellite radio antennas

 

30mil AD250C Double-sided PCB Immersion Gold Plating 0

 

Experience the exceptional performance and reliability of the AD250C Commercial Microwave and RF PCB. With its advanced features, controlled dielectric constant, and low loss tangent, this PCB empowers your wireless communication infrastructure with unparalleled efficiency and stability.

products
PRODUCTS DETAILS
30mil AD250C Double-sided PCB Immersion Gold Plating
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
AD250C
PCB Size:
196mm X 162 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
30mil
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Double-sided PCB Immersion Gold Plating

,

AD250C PCB Immersion Gold Plating

,

30mil PCB Immersion Gold Plating

Product Description

Introducing our newly shipped PCB. The AD250C Commercial Microwave and RF PCB is a cutting-edge printed circuit board (PCB) built on the innovative Rogers AD250C laminate material. Designed specifically for telecommunications infrastructure, this PCB offers exceptional performance and cost-effectiveness, making it an ideal choice for a wide range of applications.

 

Key Features:
1. Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates: The PCB is constructed using high-quality materials, ensuring durability and reliability.

 

2. Controlled Dielectric Constant: With a dielectric constant of 2.5 and tight tolerance at 10 GHz/23°C, the AD250C PCB provides consistent and predictable circuit performance.
 

3. Low Loss Tangent: The PCB boasts a low loss tangent of <0.002 at 10 GHz, resulting in excellent circuit performance across typical wireless frequency bands.
 

4. High Temperature Resistance: With a decomposition temperature (Td) exceeding 500°C, the AD250C PCB maintains its integrity even under extreme heat conditions.
 

5. Moisture Absorption: The PCB exhibits minimal moisture absorption, with a rate of only 0.04%, ensuring long-term reliability and stability.
 

6. Excellent Dimensional Stability: The AD250C PCB offers exceptional dimensional stability, resulting in repeatable circuit performance and improved manufacturing yields.
 

7. Very Low PIM: With an impressive PIM rating of -159 dBc at 30 mil, 1900 MHz, this PCB delivers outstanding antenna performance and minimizes yield loss associated with PIM-related issues.

 

Electrical Properties AD250C Units Test Conditions Test Method
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.52 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)
Dielectric Constant (design) 2.50 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant -117 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 4.8 x 108 Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 4.1 x 107 Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 979 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 47 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 29 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.33 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.6
(14.8)
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 6.0/5.6 (41.4/38.6) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 885/778 (6,102/5,364) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.02/0.06 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.04 % E1/105 +D48/50 - IPC TM-650 2.6.2.1
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716

 

Benefits:
1. Superior Antenna Efficiency: The AD250C PCB enables higher antenna efficiencies, ensuring optimal performance in antenna applications.

 

2. Repeatable Circuit Performance: Thanks to its controlled dielectric constant and ceramic composition, this PCB provides repeatable circuit performance, even in varying temperature conditions.
 

3. Enhanced Dk Stability: The ceramic component of the PCB contributes to a higher degree of dielectric constant (Dk) stability during temperature changes, ensuring consistent operation.

 

PCB Stackup and Construction:
This PCB is a 2-layer rigid PCB with a copper layer on both sides. It features a 35 μm copper layer on the top and bottom, sandwiching the 0.762 mm (30 mil) AD250C laminate. The finished board thickness is 0.8mm, and the outer layers have a 1oz (1.4 mils) copper weight. The vias have a 20 μm plating thickness. The surface finish is Immersion Gold, providing excellent conductivity and corrosion resistance. Notably, the PCB does not have silkscreen on either the top or bottom side.

 

PCB Material: PTFE based Woven Fiberglass/Ceramic Filled Composites
Designation: AD250C
Dielectric constant: 2.50 (10 GHz)
Dissipation factor 0.0013 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated etc..

 

PCB Specifications:
- Board Dimensions: 196mm x 162mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.3mm
- No Blind Vias
- 100% Electrical Test: Each PCB undergoes a comprehensive electrical test prior to shipment, ensuring quality and reliability.

 

PCB Statistics:
- Components: 81
- Total Pads: 228
- Thru Hole Pads: 97
- Top SMT Pads: 131
- Bottom SMT Pads: 0
- Vias: 132
- Nets: 4

 

Accepted Standards and Availability:
This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and performance. It is available for purchase worldwide, making it easily accessible for customers across different regions.

 

Typical Applications:
The AD250C PCB is well-suited for various applications, including:
- Cellular infrastructure base station antennas
- Automotive telematics antenna systems
- Commercial satellite radio antennas

 

30mil AD250C Double-sided PCB Immersion Gold Plating 0

 

Experience the exceptional performance and reliability of the AD250C Commercial Microwave and RF PCB. With its advanced features, controlled dielectric constant, and low loss tangent, this PCB empowers your wireless communication infrastructure with unparalleled efficiency and stability.

Sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.