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10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold

10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold
10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold 10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold 10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold

Large Image :  10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RO4835 PCB Size: 55.46mm X 41.5mm=1 PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Layer Count: 2-layer PCB Thickness: 10 Mil

Introducing our newly shipped PCB featuring RO4835, a high-performance laminate from Rogers. Designed for high frequency applications and cost-effective circuit fabrication, RO4835 offers enhanced stability at high temperatures and improved oxidation resistance compared to other hydrocarbon materials. This low loss laminate provides excellent electrical performance, making it ideal for performance-sensitive and high-volume applications.

 

Key Features:
- RoHS compliant and IPC-4103 compliant for safety and reliability
- Dielectric constant (Dk) of 3.48 +/- .05 for controlled impedance transmission lines
- Dissipation factor of 0.0037 at 10 GHz, ensuring low insertion loss
- Glass Transition Temp (Tg) >280 °C TMA for high-temperature operation
- Coefficient of Thermal Expansion of 10 ppm/°C on the X-axis, 12 ppm/°C on the Y-axis, and 31 ppm/°C on the Z-axis for stable performance over varying temperatures

 

Benefits:
- Enhanced oxidation resistance, ensuring reliable and durable performance
- Designed for high volume applications, offering a cost-effective solution
- Low loss characteristics enable application with higher operating frequencies, making it suitable for automotive applications
- Tight dielectric constant tolerance for controlled impedance transmission lines
- Lead-free process compatible, preventing blistering or delamination issues
- Low Z-axis expansion ensures reliable plated through holes
- Low in-plane expansion coefficient maintains stability during circuit processing temperatures

 

Property RO4835 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z - 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -100℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 5 x 108   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 7 x108   COND A IPC-TM-650 2.5.17.1
Electrical Strength 30.2(755) Z Kv/mm(v/mil)   IPC-TM-650 2.5.6.2
Tensile Modulus 7780(1128) Y MPa(ksi) RT ASTM D 638
Tensile Strength 136(19.7) Y MPa(ksi) RT ASTM D 638
Flexural Strength 186 (27)   Mpa (kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mils/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
31
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.66   W/m/oK 80℃ ASTM C518
Moisture Absorption 0.05   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.92   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88 (5.0)   N/mm (pli) after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

This PCB stackup features a 2-layer rigid configuration with finished copper thickness of 35 μm. The RO4835 dielectric layer has a thickness of 10 mil (0.254 mm), providing excellent electrical performance. The construction details include a board size of 55.46 mm x 41.5 mm for compact and versatile applications. The minimum trace/space is set at 5/5 mils, allowing for precise routing. The minimum hole size is 0.4 mm, accommodating various components and connectors.

 

This PCB does not include blind or buried vias, simplifying the manufacturing process. The finished board thickness is 0.3 mm, striking a balance between durability and space constraints. The finished copper weight is 1 oz (1.4 mils) on all layers, ensuring sufficient conductivity. Via plating thickness is 1 mil, providing reliable electrical connections. The surface finish is immersion gold, offering excellent solderability and a flat surface for component mounting.

 

For marking and identification, the top silkscreen is in white, providing clear labeling. The bottom silkscreen is not present in this configuration, keeping the design streamlined. The top solder mask is blue, offering protection against solder bridging. The bottom solder mask is not applied.

Each PCB has undergone a 100% electrical test to ensure quality and reliability. PCB statistics indicate that it comprises 27 components and has a total of 56 pads. Among these pads, 34 are through-hole pads, while 21 are top surface-mount technology (SMT) pads. The bottom SMT pads are not present in this configuration. The PCB features 41 vias for interconnection between different layers and components. The board has 2 nets, representing the interconnected pathways for signal transmission.

 

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4835
Dielectric constant: 3.48 (10 GHz)
Dissipation Factor 0.0037 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (ED copper) 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Dielectric thickness (LoPro copper) 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

 

10mil RO4835 RF PCB 2-layer Circuit Blue Solder Mask Immersion Gold 0

 

The artwork supplied for production is Gerber RS-274-X, a widely accepted format in the industry. PCB conforms to IPC-Class-2 standard, ensuring high-quality manufacturing and assembly.

 

Our PCB is available for worldwide shipping, providing easy access to this high-performance solution.

 

Typical applications for this PCB include automotive radar and sensors, point-to-point microwave systems, power amplifiers, phased-array radar, and RF components.

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)