|
Product Details:
Payment & Shipping Terms:
|
| Material: | RO4003C | PCB Size: | 28.33mm X 167.16 Mm=1PCS, +/- 0.15mm |
|---|---|---|---|
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
| Layer Count: | 2-layer | PCB Thickness: | 8 Mil |
| Highlight: | 8mil RO4003C PCB,Black Silkscreen PCB,8mil two layer pcb |
||
Introducing the newly shipped PCB built on RO4003C. This RO4003C PCB is a cutting-edge product that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Utilizing proprietary woven glass reinforced hydrocarbon/ceramics materials, this PCB offers exceptional performance at a fraction of the cost of conventional microwave laminates. With tight control over dielectric constant (Dk) and low loss, the RO4003C laminates provide a reliable and cost-effective solution for a wide range of applications.
Key Features:
Dielectric Constant (DK): 3.38 +/-0.05 at 10GHz
Dissipation Factor: 0.0027 at 10GHz, 0.0021 at 2.5GHz
Thermal Coefficient of Dielectric Constant: +40 ppm/°C
Thermal Conductivity: 0.71 W/m/°K
X Axis CTE: 11ppm/°C, Y Axis CTE: 14ppm/°C, Z Axis CTE: 46ppm/°C
Low Moisture Absorption: 0.06%
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Benefits:
Ideal for Multi-Layer Board (MLB) Constructions: The RO4003C material's dimensional stability, similar to that of copper, makes it perfect for mixed dielectric multi-layer board constructions.
Cost-Effective Fabrication: Process the RO4003C PCB like FR-4 at a lower fabrication cost while maintaining high performance.
Designed for Performance-Sensitive, High-Volume Applications: The PCB is engineered to meet the demands of performance-sensitive applications, enabling high-volume production.
Competitive Pricing: Enjoy the benefits of advanced materials and performance without breaking the bank.
With a 2-layer rigid PCB stackup and a finished board thickness of 0.3mm, this PCB offers compact and reliable construction. It features a copper layer thickness of 35μm on both sides, ensuring excellent conductivity. The PCB's dimensions are precisely controlled at 28.33mm x 167.16mm (1PCS), with a tolerance of +/- 0.15mm. The minimum trace/space is set at 5/5 mils, providing flexibility for intricate designs. The PCB also supports minimum hole sizes of 0.2mm, while the absence of blind vias simplifies the manufacturing process.
Quality is paramount, and this PCB adheres to the IPC-Class-2 standard. Each PCB undergoes a 100% electrical test before shipment, ensuring that it meets the required specifications and guarantees reliability. The supplied artwork is in Gerber RS-274-X format, a widely accepted industry standard that facilitates seamless integration into existing design workflows.
The availability of this RO4003C PCB is not limited to specific regions; it is widely accessible worldwide. This global availability ensures that this PCB can be utilized across various industries and markets, meeting the diverse needs of customers.
The RO4003C PCB finds its application in a range of advanced technologies. It is well-suited for cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, as well as LNBs for direct broadcast satellites.
Upgrade your PCB designs with the RO4003C PCB, and experience the perfect blend of performance, cost-effectiveness, and reliability in a globally available solution.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
