MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing the newly shipped PCB based on RF-35.
RF-35, a cutting-edge organic-ceramic laminate in Taconic's renowned ORCER product family, brings together the expertise of ceramic fill technology and coated PTFE fiberglass. With its woven glass reinforcement, RF-35 emerges as the ultimate choice for cost-effective, high-volume commercial microwave and radio frequency applications. It surpasses standard epoxy materials in critical aspects such as exceptional peel strength for 1/2 ounce and 1 ounce copper, making it ideal for situations requiring rework. Moreover, its ultra-low moisture absorption rate and low dissipation factor minimize phase shift with frequency, ensuring optimal performance.
Key Features:
- Dielectric Constant at 1.9GHz: 3.5
- Dissipation Factor at 1.9GHz: 0.0018
- Dielectric Breakdown: 41 kV
- X CTE: 19 ppm/°C
- Y CTE: 24 ppm/°C
- Z CTE: 64 ppm/°C
- Flammability: UL-94 V0
Benefits:
- Low Cost: Cost-effective solution for high-volume production
- Excellent Peel Strength: Ensures robust adhesion, facilitating rework
- Exceptionally Low Dissipation Factor: Minimizes phase shift for reliable performance
- Low Moisture Absorption: Maintains stability and performance under varying conditions
- Enhanced Surface Smoothness: Enables precise trace and component placement
Property | Test Method | Unit | Value | Unit | Value |
Dielectric Constant @ 1.9 GHz | IPC-TM 650 2.5.5 | 3.5 | 3.5 | ||
Dissipation Factor @ 1.9 GHz | IPC-TM 650 2.5.5 | 0.0018 | 0.0018 | ||
Moisture Absorption (.060") | IPC-TM 650 2.6.2.1 | % | 0.02 | % | 0.02 |
Peel Strength (1/2 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >8.0 | N/mm | >1.5 |
Peel Strength (1 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >10.0 | N/mm | >1.8 |
Dielectric Breakdown | IPC-TM 650 2.5.6 | kV | 41 | kV | 41 |
Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm/cm | 1.26 x 109 | Mohm/cm | 1.26 x 109 |
Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 1.46 x 108 | Mohm | 1.46 x 108 |
Arc Resistance | IPC TM 650 2.5.1 | seconds | >180 | seconds | >180 |
Flexural Strength Lengthwise | ASTM D 790 | psi | >22,000 | N/mm2 | >152 |
Flexural Strength Crosswise | ASTM D 790 | psi | >18,000 | N/mm2 | >124 |
Thermal Conductivity | ASTM F 433 | W/m/K | 0.24 | W/m/K | 0.24 |
Tensile Strength Lengthwise | ASTM D 638 | psi | 27,000 | N/mm2 | 187 |
Tensile Strength Crosswise | ASTM D 638 | psi | 21,000 | N/mm2 | 145 |
Dimensional Stability Lengthwise | IPC-TM 650 2.4.39 | in/in | 0.00004 | mm/mm | 0.00004 |
Dimensional Stability Crosswise | IPC-TM 650 2.4.39 | in/in | -0.0001 | mm/mm | -0.0001 |
x-y CTE | ASTM D 3386 (TMA) | ppm/°C | 19-24 | ppm/°C | 19-24 |
z CTE | ASTM D 3386 (TMA) | ppm/°C | 64 | ppm/°C | 64 |
Flammability | UL-94 | V-0 | V-0 | ||
Hardness | Rockwell M Scale | 34 | 34 |
The RF-35 PCB is a 2-layer rigid PCB with copper layers of 35 μm thickness. The RF-35 core has a thickness of 10mil (0.254 mm). The board dimensions are 65.9mm x 36.32 mm (1PCS), with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 4/4 mils and a minimum hole size of 0.4mm. The finished board thickness is 0.3mm, with 1oz (1.4 mils) outer layers of copper weight. The via plating thickness is 25 μm, and the surface finish is immersion gold. The top silkscreen is black, while there is no silkscreen on the bottom. Solder masks are not applicable for both the top and bottom layers. Each PCB undergoes a 100% electrical test prior to shipment, ensuring quality and reliability.
The RF-35 PCB statistics showcase its versatility. It supports 18 components and offers a total of 26 pads, including 19 thru-hole pads, 7 top SMT pads, and 0 bottom SMT pads. The PCB features 11 vias and 2 nets.
PCB Material: | PTFE Ceramic Fiberglass |
Designation: | RF-35 |
Dielectric constant: | 3.5 |
Dissipation Factor | 0.0018 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
The artwork supplied for RF-35 is in the Gerber RS-274-X format, meeting industry standards. The quality standard for the PCB production is IPC-Class-2, ensuring consistency and reliability. RF-35 PCBs are available worldwide, catering to diverse application needs.
RF-35 finds wide application across various industries. It is an excellent choice for power amplifiers, filters, couplers, and passive components.
Discover the superior performance and affordability of RF-35, the perfect companion for your commercial microwave and RF projects. Experience reliable results and unleash your creativity with RF-35 PCBs.
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing the newly shipped PCB based on RF-35.
RF-35, a cutting-edge organic-ceramic laminate in Taconic's renowned ORCER product family, brings together the expertise of ceramic fill technology and coated PTFE fiberglass. With its woven glass reinforcement, RF-35 emerges as the ultimate choice for cost-effective, high-volume commercial microwave and radio frequency applications. It surpasses standard epoxy materials in critical aspects such as exceptional peel strength for 1/2 ounce and 1 ounce copper, making it ideal for situations requiring rework. Moreover, its ultra-low moisture absorption rate and low dissipation factor minimize phase shift with frequency, ensuring optimal performance.
Key Features:
- Dielectric Constant at 1.9GHz: 3.5
- Dissipation Factor at 1.9GHz: 0.0018
- Dielectric Breakdown: 41 kV
- X CTE: 19 ppm/°C
- Y CTE: 24 ppm/°C
- Z CTE: 64 ppm/°C
- Flammability: UL-94 V0
Benefits:
- Low Cost: Cost-effective solution for high-volume production
- Excellent Peel Strength: Ensures robust adhesion, facilitating rework
- Exceptionally Low Dissipation Factor: Minimizes phase shift for reliable performance
- Low Moisture Absorption: Maintains stability and performance under varying conditions
- Enhanced Surface Smoothness: Enables precise trace and component placement
Property | Test Method | Unit | Value | Unit | Value |
Dielectric Constant @ 1.9 GHz | IPC-TM 650 2.5.5 | 3.5 | 3.5 | ||
Dissipation Factor @ 1.9 GHz | IPC-TM 650 2.5.5 | 0.0018 | 0.0018 | ||
Moisture Absorption (.060") | IPC-TM 650 2.6.2.1 | % | 0.02 | % | 0.02 |
Peel Strength (1/2 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >8.0 | N/mm | >1.5 |
Peel Strength (1 oz. copper) | IPC-TM 650 2.4.8 | lbs./linear inch | >10.0 | N/mm | >1.8 |
Dielectric Breakdown | IPC-TM 650 2.5.6 | kV | 41 | kV | 41 |
Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm/cm | 1.26 x 109 | Mohm/cm | 1.26 x 109 |
Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 1.46 x 108 | Mohm | 1.46 x 108 |
Arc Resistance | IPC TM 650 2.5.1 | seconds | >180 | seconds | >180 |
Flexural Strength Lengthwise | ASTM D 790 | psi | >22,000 | N/mm2 | >152 |
Flexural Strength Crosswise | ASTM D 790 | psi | >18,000 | N/mm2 | >124 |
Thermal Conductivity | ASTM F 433 | W/m/K | 0.24 | W/m/K | 0.24 |
Tensile Strength Lengthwise | ASTM D 638 | psi | 27,000 | N/mm2 | 187 |
Tensile Strength Crosswise | ASTM D 638 | psi | 21,000 | N/mm2 | 145 |
Dimensional Stability Lengthwise | IPC-TM 650 2.4.39 | in/in | 0.00004 | mm/mm | 0.00004 |
Dimensional Stability Crosswise | IPC-TM 650 2.4.39 | in/in | -0.0001 | mm/mm | -0.0001 |
x-y CTE | ASTM D 3386 (TMA) | ppm/°C | 19-24 | ppm/°C | 19-24 |
z CTE | ASTM D 3386 (TMA) | ppm/°C | 64 | ppm/°C | 64 |
Flammability | UL-94 | V-0 | V-0 | ||
Hardness | Rockwell M Scale | 34 | 34 |
The RF-35 PCB is a 2-layer rigid PCB with copper layers of 35 μm thickness. The RF-35 core has a thickness of 10mil (0.254 mm). The board dimensions are 65.9mm x 36.32 mm (1PCS), with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 4/4 mils and a minimum hole size of 0.4mm. The finished board thickness is 0.3mm, with 1oz (1.4 mils) outer layers of copper weight. The via plating thickness is 25 μm, and the surface finish is immersion gold. The top silkscreen is black, while there is no silkscreen on the bottom. Solder masks are not applicable for both the top and bottom layers. Each PCB undergoes a 100% electrical test prior to shipment, ensuring quality and reliability.
The RF-35 PCB statistics showcase its versatility. It supports 18 components and offers a total of 26 pads, including 19 thru-hole pads, 7 top SMT pads, and 0 bottom SMT pads. The PCB features 11 vias and 2 nets.
PCB Material: | PTFE Ceramic Fiberglass |
Designation: | RF-35 |
Dielectric constant: | 3.5 |
Dissipation Factor | 0.0018 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. |
The artwork supplied for RF-35 is in the Gerber RS-274-X format, meeting industry standards. The quality standard for the PCB production is IPC-Class-2, ensuring consistency and reliability. RF-35 PCBs are available worldwide, catering to diverse application needs.
RF-35 finds wide application across various industries. It is an excellent choice for power amplifiers, filters, couplers, and passive components.
Discover the superior performance and affordability of RF-35, the perfect companion for your commercial microwave and RF projects. Experience reliable results and unleash your creativity with RF-35 PCBs.