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20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes

20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes
20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes 20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes 20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes

Large Image :  20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RF-10 PCB Size: 18.33mm X 25.16mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Layer Count: 2-layer PCB Thickness: 0.6mm
High Light:

Double Sided RF-10 PCB

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20mil RF-10 PCB

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0.6mm RF-10 PCB

Introducing a newly shipped PCB based on RF-10 Copper Clad Laminate. The RF-10 substrate is a cutting-edge composite material, combining ceramic-filled PTFE and woven fiberglass. Engineered with a high dielectric constant and low dissipation factor, RF-10 offers exceptional performance and reliability for RF circuits. Its thin woven fiberglass reinforcement ensures low dielectric loss, improved rigidity, and enhanced dimensional stability for multilayer circuits.

 

Intended to meet industry demands, RF-10 provides a cost-effective solution without compromising on delivery times. With its ability to bond effectively to smooth low-profile copper, RF-10 minimizes insertion losses at higher frequencies, where skin effect losses are significant.

 

Key Features:

Dielectric Constant: RF-10 boasts a dielectric constant of 10.2 ± 0.3 at 10GHz, facilitating RF circuit size reduction and improved performance.
Dissipation Factor: With a dissipation factor of 0.0025 at 10GHz, RF-10 ensures minimal energy loss and maximum signal integrity.
High Thermal Conductivity: RF-10 exhibits high thermal conductivity of 0.85 W/mk (Unclad), enabling efficient thermal management.
Dimensional Stability: Enjoy excellent dimensional stability, ensuring precise and reliable performance.
Low Moisture Absorption: With a moisture absorption rate of only 0.08%, RF-10 maintains consistent performance even in humid conditions.
Flammability Rating: RF-10 is rated V-0, ensuring high safety standards for your applications.

 

RF-10 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 

Benefits:

Size Reduction: RF-10's high dielectric constant enables compact RF circuit designs.
Dimensional Stability: Experience enhanced reliability and accuracy with RF-10's excellent dimensional stability.
Tight DK Tolerance: RF-10 offers a tight dielectric constant tolerance of 10.2 ± 0.3, ensuring precise and consistent performance.
Enhanced Thermal Management: The high thermal conductivity of RF-10 facilitates efficient heat dissipation, safeguarding critical components.
Excellent Adhesion: RF-10 exhibits excellent adhesion to smooth copper surfaces, ensuring reliable and durable circuitry.
Low Expansion: RF-10's low X, Y, and Z coefficient of thermal expansion (CTE) minimizes the risk of warping or delamination.
Price/Performance Ratio: RF-10 delivers outstanding performance at an excellent price point.

 

This PCB specifications include a 2-layer rigid stackup with 35μm copper layers on both sides. It has dimensions of 18.33mm x 25.16mm, a minimum trace/space of 6/6 mils, and a minimum hole size of 0.3mm. The finished board thickness is 0.6mm, and it features a 1oz copper weight on the outer layers with a 20μm via plating thickness. The surface finish is an immersion gold finish, and there is no silkscreen or solder mask on either side. Each PCB undergoes a 100% electrical test for quality assurance.

 

PCB Material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation: RF-10
Dielectric constant: 10.2
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

20mil 0.6mm RF-10 PCB Double Sided Circuit Fast PCB Prototypes 0

 

The PCB statistics include 11 components, 38 pads (14 thru-hole and 24 top SMT pads), 17 vias, and 2 nets.


Quality Standard: Manufactured to IPC-Class-2 standards, ensuring reliable performance.

 

Availability: RF-10 PCBs are available worldwide, catering to global demand.

 

RF-10 PCB finds applications in microstrip patch antennas, GPS antennas, passive components, aircraft collision avoidance systems, and satellite components. Its high-performance characteristics and reliability make it a suitable choice for demanding RF applications in various industries.

 

In summary, RF-10 PCB is designed to meet the demanding requirements of RF applications. With its exceptional dielectric properties, thermal conductivity, and dimensional stability, RF-10 offers unparalleled performance and reliability.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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