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| Material: | IsoClad 917 | PCB Size: | 70mm X 42 Mm=1PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Gold |
| Layer Count: | 2-layer | PCB Thickness: | 62mil |
| Highlight: | 62mil Immersion Gold PCB,Green Soldermask Immersion Gold PCB,IsoClad 917 PCB |
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Introducing a 2-layer rigid PCB made of IsoClad 917.
IsoClad 917, a Rogers laminates product, revolutionizes printed circuit board substrates with its non-woven fiberglass/PTFE composites. With a dielectric constant (Dk) of 2.17 or 2.20, IsoClad 917 offers the lowest Dk and dissipation factor in its class. Engineered with a low ratio of non-woven fiberglass/PTFE, this laminate delivers remarkable performance and dimensional stability for a wide range of applications.
Key Features of IsoClad 917:
Low Dk and Dissipation Factor: IsoClad 917 boasts a Dk of 2.17 or 2.20 at 10 GHz/23°C, ensuring reliable signal transmission and minimal energy loss. With a dissipation factor of 0.0013 at 10 GHz/23°C, this laminate minimizes signal attenuation, resulting in efficient signal integrity.
Thermal Stability: IsoClad 917 offers a TcDK of -157 ppm/°C ranging from -10°C to 140°C, ensuring consistent electrical performance across varying temperature conditions. This stability makes it ideal for applications where temperature fluctuations are common.
Strong Peel Strength: With a peel strength of 10 lbs. per inch, IsoClad 917 provides excellent adhesion and reliability, ensuring the integrity of the PCB even under demanding conditions.
Low Moisture Absorption: IsoClad 917 exhibits low moisture absorption of 0.04%, making it suitable for applications in humid environments without compromising its electrical performance or dimensional stability.
Isotropic and Dimensionally Stable: The non-woven fiberglass reinforcement of IsoClad 917 provides isotropic properties, ensuring uniform electrical performance in all directions. Additionally, the longer random fibers and proprietary manufacturing process contribute to greater dimensional stability and dielectric constant uniformity, surpassing competitors in similar classes.
| Typical Properties: IsoClad 917 | |||
| Property | IsoClad 917 | Condition | Test Method |
| Dielectric Constant @ 10 GHz | 2.17, 2.20 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Er (ppm/°C) | -157 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength (lbs.per inch) | 10 | After Thermal | IPC TM-650 2.4.8 |
| Volume Resistivity (MΩ-cm) | 1.5 x 10 10 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 1.0 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance (seconds) | >180 | D48/50 | ASTM D-495 |
| Tensile Modulus (kpsi) | 133, 120 | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 4.3, 3.8 | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 182 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 213 | A, 23°C | ASTM D-790 |
| Dielectric Breakdown (kv) | >45 | D48/50 | ASTM D-149 |
| Density (g/cm3) | 2.23 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.04 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Coefficient of Thermal | 0°C to 100°C | IPC TM-650 2.4.24 | |
| Expansion (ppm/°C) | Mettler 3000 | ||
| X Axis | 46 | Thermomechanical | |
| Y Axis | 47 | Analyzer | |
| Z Axis | 236 | ||
| Thermal Conductivity (W/mK) | 0.263 | 100°C | ASTM E-1225 |
| Outgassing | 125°C, ≤10-6 torr | ||
| Total Mass Loss (%) | 0.02 | Maximum 1.00% | |
| Collected Volatile | 0.00 | Maximum 0.10% | |
| Condensable Material (%) | |||
| Water Vapor Regain (%) | 0.02 | ||
| Visible Condensate (±) | NO | ||
| Flammability | Meets requirements of UL94-V0 |
C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
Benefits of IsoClad 917:
Versatile Design Options: IsoClad 917's non-woven fiberglass reinforcement allows flexibility in PCB design. It can be used in applications where the final PCB may need to be bent or shaped, including conformal or wrap-around antennas, without compromising performance.
High Signal Integrity: The low Dk and dissipation factor of IsoClad 917 enable reliable signal transmission with minimal loss, ensuring superior signal quality and reduced signal degradation.
Enhanced Thermal Management: IsoClad 917's thermal stability and low moisture absorption contribute to effective heat dissipation, preventing overheating issues and maintaining optimal performance in challenging thermal environments.
Improved Electrical Performance: The laminate's isotropic nature and stable Dk over a range of frequencies ensure consistent and reliable electrical performance, making it suitable for applications such as guidance systems, radar, and electronic systems.
Reliable and Durable: IsoClad 917's exceptional dimensional stability and peel strength ensure the PCB's long-term reliability and durability, even
in demanding operating conditions.
The stackup of this PCB consists of a copper layer with a thickness of 35 μm, followed by the IsoClad 917 core, which measures 1.575 mm (62mil), and another copper layer with a thickness of 35 μm. This stackup provides a solid foundation for reliable circuitry.
When it comes to the construction details, this PCB offers a board dimension of 70mm x 42mm (1PCS, +/- 0.15mm). It supports a minimum trace/space of 4/6 mils, allowing for precise routing of signals. The minimum hole size is 0.4mm, providing flexibility for various component sizes.
The board has a finished thickness of 1.6mm, ensuring durability and stability. With a finished copper weight of 1oz (1.4 mils) on the outer layers, it provides adequate conductivity. The via plating thickness is 20 μm, facilitating reliable connections. The surface finish is immersion gold, which offers excellent solderability and corrosion resistance. This PCB does not come with top or bottom silkscreen, but it features a green top solder mask. Additionally, each board undergoes a 100% electrical test prior to shipment, ensuring quality and reliability.
| PCB Material: | Non-woven Fiberglass / PTFE Composites |
| Designation: | IsoClad 917 |
| Dielectric constant: | 2.17 or 2.20 (10 GHz) |
| Dissipation factor | 0.0013 (10 GHz) |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | ENIG(immersion gold), HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc.. |
PCB Statistics:
Components: 29
Total Pads: 53
Thru Hole Pads: 32
Top SMT Pads: 21
Bottom SMT Pads: 0
Vias: 28
Nets: 2
Supported Artwork Format: Gerber RS-274-X
Accepted Quality Standard: IPC-Class-2
Availability: The IsoClad 917 PCB is available for worldwide, ensuring engineers and designers can access its advanced capabilities regardless of their location.
Some Typical Applications:
Conformal Antennas
Stripline and Microstrip Circuits
Guidance Systems
Radar and Electronic Systems
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
