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Hybrid PCB of RT duroid 5880 and RO4003C 1.3mm Thick with Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Hybrid PCB of RT duroid 5880 and RO4003C 1.3mm Thick with Immersion Gold

Hybrid PCB of RT duroid 5880 and RO4003C 1.3mm Thick with Immersion Gold
Hybrid PCB of RT duroid 5880 and RO4003C 1.3mm Thick with Immersion Gold

Large Image :  Hybrid PCB of RT duroid 5880 and RO4003C 1.3mm Thick with Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RT Duroid 5880 And RO4003C PCB Size: 109mm X 71.57 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: ENIG
Layer Count: 4-layer PCB Thickness: 1.3mm
High Light:

RO4003C Hybrid PCB

,

Immersion Gold Hybrid PCB

,

1.3mm Thick Hybrid PCB

The RT/duroid 5880 and RO4003C hybrid PCB combines the strengths of two exceptional materials to deliver unparalleled electrical performance and reliable thermal management. With the RT/duroid 5880's low loss properties and stable dielectric constant (Dk), paired with the low loss and excellent electrical characteristics of RO4003C, this hybrid PCB offers enhanced functionality and design flexibility for a wide range of high-frequency applications.

 

Key Features of RT/duroid 5880:

Dk of 2.20 +/- .02: The RT/duroid 5880 maintains a consistent dielectric constant across a wide frequency range, ensuring reliable signal transmission and minimal signal loss.
 

Dissipation factor of .0009 at 10GHz: With an impressively low dissipation factor, the RT/duroid 5880 minimizes energy loss, maximizing signal integrity and efficiency.
 

Low moisture absorption: The RT/duroid 5880 exhibits low moisture absorption, making it suitable for applications in humid environments while maintaining stable electrical performance.
 

Isotropic: The isotropic nature of RT/duroid 5880 ensures uniform electrical properties in all directions, simplifying the design process and enabling consistent performance.

 

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23 Test at 100 N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80 ASTM C 518
Coefficient of Thermal Expansion 31
48
237
X
Y
Z
ppm/ 0-100 IPC-TM-650 2.4.41
Td 500 N/A TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

Key Features of RO4003C:

Dk of 3.38 +/- 0.05: The RO4003C offers a controlled dielectric constant, providing stability and predictability in high-frequency applications.
 

Dissipation factor of 0.0027 at 10 GHz: With low loss characteristics, the RO4003C minimizes signal attenuation and ensures efficient signal transmission.
 

Low Z-axis coefficient of thermal expansion (CTE) at 46 ppm/°C: The RO4003C's low CTE helps mitigate issues related to thermal expansion, ensuring reliable performance in varying temperature conditions.

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Benefits of the RT/duroid 5880 and RO4003C Hybrid:

Enhanced electrical performance: By combining the unique properties of RT/duroid 5880 and RO4003C, this hybrid PCB optimizes electrical performance, ensuring reliable signal integrity, minimal loss, and consistent high-frequency operation.
 

Improved thermal management: The high thermal conductivity of RO4003C helps dissipate heat effectively, preventing overheating issues in areas prone to heat generation. Incorporating RO4003C layers in strategic locations enhances thermal management capabilities.

 

Design flexibility: The hybrid design allows for greater flexibility in PCB layout and design. Engineers can selectively use either RT/duroid 5880 or RO4003C in different areas of the board to achieve desired electrical and thermal characteristics, optimizing functionality and meeting specific design requirements.

 

Cost-effectiveness: By utilizing a hybrid approach, engineers can achieve cost benefits compared to using a single material throughout the board. Selecting the most suitable material for specific regions based on performance requirements optimizes costs while maintaining functionality.

 

Wide frequency range: The combination of RT/duroid 5880 and RO4003C expands the utility of the hybrid PCB across a wide frequency range, making it suitable for various high-frequency and broadband applications, including automotive radar, commercial airline broadband antennas, microstrip and stripline circuits, millimeter-wave applications, and point-to-point digital radio antennas.

 

Reliability and durability: Both RT/duroid 5880 and RO4003C are known for their high-quality construction and reliability. When combined in a hybrid PCB, they contribute to the overall durability and long-term performance of the board, ensuring robustness and stability in demanding applications.

 

Hybrid PCB of RT duroid 5880 and RO4003C 1.3mm Thick with Immersion Gold 0

 

PCB Stackup and Construction Details:
 

This 4-layer rigid PCB features a stackup with RT/duroid 5880 and RO4003C cores, along with prepreg layers. The board dimensions are 109mm x 71.57mm, with a finished thickness of 1.3mm. The PCB adheres to strict manufacturing standards, including a minimum trace/space of 4/4 mils, a minimum hole size of 0.3mm, and a 100% electrical test prior to shipment. The surface finish is Immersion Gold, and the top layer has a white silkscreen.

 

PCB Statistics and Artwork:
This PCB contains 68 components, 117 total pads (72 through-hole, 45 top-side SMT), 87 vias, and 5 nets. The artwork is provided in Gerber RS-274-X format, and this PCB is manufactured to the IPC-Class-2 quality standard.

 

This hybrid PCB is available worldwide.

 

Applications:

This hybrid PCB is ideal for a wide range of applications, including:

Automotive radar and sensors
Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter-wave applications
Point-to-point digital radio antennas

 

With its exceptional electrical performance, thermal management capabilities, and design flexibility, this hybrid PCB is the perfect choice for engineers seeking a reliable and cost-effective solution for their high-frequency and broadband projects.

 

Hybrid PCB of RT duroid 5880 and RO4003C 1.3mm Thick with Immersion Gold 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)