RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

Introducing a High-Performance PCB on CLTE-XT. Rogers CLTE-XT laminates are composite materials that combine micro-dispersed ceramic filler, PTFE, and woven fiberglass reinforcement. Intended to deliver exceptional performance, CLTE-XT offers the lowest insertion loss and highest dimensional stability in its class. Let's explore the remarkable features and benefits of this cutting-edge PCB:

Features:

Dielectric Constant (DK) range of 2.79 to 2.94 at 10GHz, 23°C @ 50% RH
Dissipation Factor of 0.0010 at 10GHz, 23°C @ 50% RH
X-axis CTE of 12.7ppm/°C, Y-axis CTE of 13.7ppm/°C, Z-axis CTE of 40.8ppm/°C
Decomposition Temperature (Td) of 539°C
Thermal Coefficient of Dielectric Constant of -8ppm/°C
Tightest dielectric constant tolerance in the CLTE family (+/- .03)
Low Moisture Absorption of 0.02%

Benefits:

High plated through-hole reliability
Consistent performance across different production lots
Reduced circuit losses while maintaining dimensional stability
Stable dielectric constant under temperature variations, reducing stress on ceramic active devices

PCB Stackup:
2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers CLTE-XT Core - 0.762 mm (30mil)
Copper_layer_2 - 35 μm

The PCB construction details for this High-Performance PCB are as follows:

The board dimensions are 42.91mm x 108.31mm, with a tolerance of +/- 0.15mm for a single piece. The minimum trace width and spacing are 5 mils and 7 mils, respectively. The minimum hole size is 0.3mm, ensuring compatibility with a wide range of components.

The board does not include any blind vias, simplifying the manufacturing process. The finished board thickness is 0.8mm, providing a balance between durability and space constraints. The outer layers have a copper weight of 1oz (equivalent to 1.4 mils), ensuring good electrical conductivity and heat dissipation.

The via plating thickness is 20 μm, ensuring reliable connections throughout the board. The surface finish is immersion tin, which provides a protective coating and enhances solderability. The top silkscreen is printed in black, allowing for clear component labeling and identification. The bottom silkscreen is not included in this PCB design.

The top and bottom solder masks are not applied in this particular PCB. However, this can be customized based on specific requirements. Prior to shipment, a 100% electrical test is performed on each PCB to ensure its functionality and adherence to quality standards.

In terms of PCB statistics, this PCB includes a total of 21 components. There are 68 pads in total, with 41 being thru-hole pads and 27 being top surface mount technology (SMT) pads. There are no bottom SMT pads in this design. The PCB features 65 vias, facilitating connections between different layers. The design encompasses 3 nets, ensuring proper signal routing and integrity.

The quality standard for this PCB is IPC-Class-2, which guarantees reliability and adherence to industry standards. The artwork format used for this design is Gerber RS-274-X, a widely accepted format in the PCB manufacturing industry. The CLTE-XT High-Performance PCB is available worldwide, ensuring accessibility for engineers and manufacturers across different regions.

Some Typical Applications:

Advanced Driver Assistance Systems (ADAS)
Patch Antennas
Phased Array Antennas
Power Amplifiers
Ground-based and airborne communications and radar systems