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RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin
RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

Large Image :  RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: CLTE-XT PCB Size: 42.91mm X 108.31 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Tin
Layer Count: 2-layer PCB Thickness: 30mil
High Light:

Black Soldermask RF PCB

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30mil CLTE-XT Laminates RF PCB

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Immersion Tin RF PCB

Introducing a High-Performance PCB on CLTE-XT. Rogers CLTE-XT laminates are composite materials that combine micro-dispersed ceramic filler, PTFE, and woven fiberglass reinforcement. Intended to deliver exceptional performance, CLTE-XT offers the lowest insertion loss and highest dimensional stability in its class. Let's explore the remarkable features and benefits of this cutting-edge PCB:

 

Features:

Dielectric Constant (DK) range of 2.79 to 2.94 at 10GHz, 23°C @ 50% RH
Dissipation Factor of 0.0010 at 10GHz, 23°C @ 50% RH
X-axis CTE of 12.7ppm/°C, Y-axis CTE of 13.7ppm/°C, Z-axis CTE of 40.8ppm/°C
Decomposition Temperature (Td) of 539°C
Thermal Coefficient of Dielectric Constant of -8ppm/°C
Tightest dielectric constant tolerance in the CLTE family (+/- .03)
Low Moisture Absorption of 0.02%

 

Benefits:

High plated through-hole reliability
Consistent performance across different production lots
Reduced circuit losses while maintaining dimensional stability
Stable dielectric constant under temperature variations, reducing stress on ceramic active devices

 

Properties CLTE-XT Units Test Conditions Test Method
Electrical Properties
Dielectric Constant 2.94 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissipation Factor 0.0010 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dielectric Constant (design) 2.93 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Thermal Coefficient of Dielectric Constant -8 ppm/˚C -50°C to 150°C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity 4.25x10⁸ Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity 2.49x10⁸ Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength) 1000 V/mil - - IPC TM-650 2.5.6.2
Dielectric Breakdown 58 kV D-48/50 X/Y direc- tion IPC TM-650 2.5.6
PIM (For antenna only) - dBc - 50 ohm
0.060"
43dBm 1900 MHz
Thermal Properties
Decomposition Temperature (Td) 539 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 12.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 13.7 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 40.8 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.56 W/(m.K) - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress 1.7
(9)
N/mm (lbs/ in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD, CMD) 40.7, 40.0
(5.9, 5.8)
MPa (ksi ) 25˚C  3˚C - ASTM D790
Tensile Strength (MD, CMD) 29.0, 25.5
(4.2, 3.7)
MPa (ksi ) 23C/50RH - ASTM D638
Flex Modulus (MD. CMD) 3247, 3261
(471, 473)
MPa (ksi ) 25C  3C - ASTM D790
Dimensional Stability (MD, CMD) -0.37, -0.67 mm/m 4 hr at 105˚C - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - C48/23/50 & C168/70 UL 94
Moisture Absorption 0.02 % E1/105+D24/23 - IPC TM-650 2.6.2.1
Density 2.17 g/cm³ C-24/23/50 - ASTM D792
Specifc Heat Capacity 0.61 J/g˚K 2 hours at 105˚C - ASTM E2716
NASA Outgassing 0.02 / 0.00 %   TML/CVCM ASTM E595

 

PCB Stackup:
2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers CLTE-XT Core - 0.762 mm (30mil)
Copper_layer_2 - 35 μm

 

The PCB construction details for this High-Performance PCB are as follows:

 

The board dimensions are 42.91mm x 108.31mm, with a tolerance of +/- 0.15mm for a single piece. The minimum trace width and spacing are 5 mils and 7 mils, respectively. The minimum hole size is 0.3mm, ensuring compatibility with a wide range of components.

 

The board does not include any blind vias, simplifying the manufacturing process. The finished board thickness is 0.8mm, providing a balance between durability and space constraints. The outer layers have a copper weight of 1oz (equivalent to 1.4 mils), ensuring good electrical conductivity and heat dissipation.

 

The via plating thickness is 20 μm, ensuring reliable connections throughout the board. The surface finish is immersion tin, which provides a protective coating and enhances solderability. The top silkscreen is printed in black, allowing for clear component labeling and identification. The bottom silkscreen is not included in this PCB design.

 

The top and bottom solder masks are not applied in this particular PCB. However, this can be customized based on specific requirements. Prior to shipment, a 100% electrical test is performed on each PCB to ensure its functionality and adherence to quality standards.

 

In terms of PCB statistics, this PCB includes a total of 21 components. There are 68 pads in total, with 41 being thru-hole pads and 27 being top surface mount technology (SMT) pads. There are no bottom SMT pads in this design. The PCB features 65 vias, facilitating connections between different layers. The design encompasses 3 nets, ensuring proper signal routing and integrity.

 

The quality standard for this PCB is IPC-Class-2, which guarantees reliability and adherence to industry standards. The artwork format used for this design is Gerber RS-274-X, a widely accepted format in the PCB manufacturing industry. The CLTE-XT High-Performance PCB is available worldwide, ensuring accessibility for engineers and manufacturers across different regions.

 

PCB material: Ceramic/PTFE Microwave Composite
Designation: CLTE-XT
Dielectric constant: 2.94
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin,ENEPIG, Bare copper, OSP, Pure gold plated etc..

 

RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin 0

 

Some Typical Applications:

Advanced Driver Assistance Systems (ADAS)
Patch Antennas
Phased Array Antennas
Power Amplifiers
Ground-based and airborne communications and radar systems

 

RF PCB On 30mil CLTE-XT Laminates Black Soldermask Immersion Tin 1

Contact Details
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Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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