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1.6mm AD1000 PCB 50mil 1oz High Frequency Pcb Board ENIG

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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1.6mm AD1000 PCB 50mil 1oz High Frequency Pcb Board ENIG

1.6mm AD1000 PCB 50mil 1oz High Frequency Pcb Board ENIG
1.6mm AD1000 PCB 50mil 1oz High Frequency Pcb Board ENIG 1.6mm AD1000 PCB 50mil 1oz High Frequency Pcb Board ENIG

Large Image :  1.6mm AD1000 PCB 50mil 1oz High Frequency Pcb Board ENIG

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: AD1000 PCB Size: 42.6mm X 21.5 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: ENIG
Layer Count: 2-layer PCB Thickness: 1.6 Mm
High Light:

1oz PCB Board

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1.6mm PCB Board

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50mil High Frequency PCB Board

It's happy to share the newly shipped PCB based on the AD1000. The AD1000 is a high-performance, woven-glass reinforced laminate that offers exceptional dimensional stability, mechanical robustness, and electrical characteristics for high-frequency applications. Featuring a dielectric constant of 10.2 or greater, this material allows for circuit miniaturization compared to traditional low-loss laminates, making it ideal for power amplifiers, filters, couplers, and other components using low-impedance transmission lines.

 

The key features of the AD1000 PCB include:

- Woven glass-reinforced PTFE/ceramic construction for superior dimensional stability and mechanical integrity
- Industry-leading thermal conductivity for improved heat dissipation and management
- High copper peel strength of over 12 lbs/in, enabling thinner circuit traces
- Lowest insertion loss among 10 Dk products
- Large available panel sizes for efficient multi-circuit processing
- Low moisture absorption of just 0.03% for reliable performance in humid environments

 

Benefits:

The AD1000 PCB offers a range of benefits that make it an exceptional choice for high-frequency applications. The woven-glass reinforced PTFE/ceramic construction provides superior mechanical robustness and greater dimensional stability compared to other 10 Dk products. This allows for the design of miniaturized circuitry, leading to weight savings without compromising reliability.

 

The AD1000's industry-leading thermal conductivity ensures efficient heat dissipation and management, which is crucial for power-hungry components like amplifiers. Additionally, the low-loss properties of the material contribute to greater signal integrity, enabling more reliable and high-performing RF and microwave circuits.

 

The cost-effective board layout and processing capabilities of the AD1000 PCB make it an attractive option for engineers. The material's low moisture absorption of 0.03% also ensures reliable performance in humid environments.

 

Property Units Value Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 10.2 IPC TM-650 2.5.5.5
Dissipation Factor
@ 1 MHz -   IPC TM-650 2.5.5.3
@ 10 GHz - 0.0023 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric -    
TCεr @ 10 GHz (-40-150°C) ppm/℃ -380 IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90 MΩ-cm 1.40x109 IPC TM-650 2.5.17.1
E24/125 MΩ-cm 5.36x107 IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90 1.80x109 IPC TM-650 2.5.17.1
E24/125 3.16x108 IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 622 (24.5) IPC TM-650 2.5.6.2
Dielectric Breakdown kV >45 IPC TM-650 2.5.6
Arc Resistance sec >180 IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial >500 IPC TM-650 2.4.24.6
5% >500 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/℃ 8, 10 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/℃ 20 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) %   IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress lb/in (N/mm) >12 (2.1) IPC TM-650 2.4.8
At Elevated Temperatures (150º) lb/in (N/mm) 13.6 (2.4) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm)   IPC TM-650 2.4.8
Young’s Modulus kpsi (GPa) 200 (1.38) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 9.9/7.5 (68/52) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.1/4.3 (35/30) IPC TM-650 2.4.18.3
Compressive Modulus kpsi (GPa) >425 (>2.93) ASTM D-3410
Poisson’s Ratio - 0.16 ASTM D-3039
4. Physical Properties
Water Absorption % 0.03 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 3.20 ASTM D792 Method A
Thermal Conductivity W/mK 0.81 ASTM E1461
Flammability class Meets V0 UL-94
NASA Outgassing, 125ºC, ≤10-6 torr %   NASA SP-R-0022A
Total Mass Loss % 0.01 NASA SP-R-0022A
Collected Volatiles % 0.00 NASA SP-R-0022A
Water Vapor Recovered % 0.00 NASA SP-R-0022A

 

The 2-layer rigid PCB utilizes 35 μm copper layers on a 1.527 mm thick AD1000 core, with a total finished thickness of 1.6 mm. The construction details include a minimum 4/4 mil trace/space and 0.32 mm hole size, meeting the IPC-Class-2 standard.

 

PCB Construction Details:

Board dimensions: 42.6 mm x 21.5 mm, with a tolerance of ±0.15 mm
Minimum trace/space: 4/4 mils
Minimum hole size: 0.32 mm
No blind vias
Finished copper weight: 1 oz (1.4 mils) on the outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Gold
No top or bottom silkscreen or solder mask
100% electrical testing is performed prior to shipment to ensure quality and reliability.

 

1.6mm AD1000 PCB 50mil 1oz High Frequency Pcb Board ENIG 0

 

This 3-component, 11-pad PCB has 7 through-hole and 4 top-side SMT pads, with 4 vias interconnecting the 2 electrical nets. 100% electrical testing is performed prior to shipment to ensure exceptional quality and reliability.

 

The AD1000 PCB is an excellent choice for a wide range of high-frequency applications, including radar modules, collision avoidance systems, power amplifiers, low noise amplifiers, and miniaturized circuitry and patch antennas, particularly in the X-band and below frequency ranges. With its robust construction, superior electrical performance, and global availability, the AD1000 is a proven solution for demanding microwave and RF designs.

 

PCB Material: Woven Glass Reinforced PTFE/Ceramic Filled
Designation: AD1000
Dielectric constant: 10.2
Dissipation Factor 0.0023 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm ), 125mil ( 3.175mm ), 127mil (3.226mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)