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Product Details:
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Material: | AD1000 | PCB Size: | 42.6mm X 21.5 Mm=1PCS, +/- 0.15mm |
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Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | ENIG |
Layer Count: | 2-layer | PCB Thickness: | 1.6 Mm |
Highlight: | 1oz PCB Board,1.6mm PCB Board,50mil High Frequency PCB Board |
It's happy to share the newly shipped PCB based on the AD1000. The AD1000 is a high-performance, woven-glass reinforced laminate that offers exceptional dimensional stability, mechanical robustness, and electrical characteristics for high-frequency applications. Featuring a dielectric constant of 10.2 or greater, this material allows for circuit miniaturization compared to traditional low-loss laminates, making it ideal for power amplifiers, filters, couplers, and other components using low-impedance transmission lines.
The key features of the AD1000 PCB include:
- Woven glass-reinforced PTFE/ceramic construction for superior dimensional stability and mechanical integrity
- Industry-leading thermal conductivity for improved heat dissipation and management
- High copper peel strength of over 12 lbs/in, enabling thinner circuit traces
- Lowest insertion loss among 10 Dk products
- Large available panel sizes for efficient multi-circuit processing
- Low moisture absorption of just 0.03% for reliable performance in humid environments
Benefits:
The AD1000 PCB offers a range of benefits that make it an exceptional choice for high-frequency applications. The woven-glass reinforced PTFE/ceramic construction provides superior mechanical robustness and greater dimensional stability compared to other 10 Dk products. This allows for the design of miniaturized circuitry, leading to weight savings without compromising reliability.
The AD1000's industry-leading thermal conductivity ensures efficient heat dissipation and management, which is crucial for power-hungry components like amplifiers. Additionally, the low-loss properties of the material contribute to greater signal integrity, enabling more reliable and high-performing RF and microwave circuits.
The cost-effective board layout and processing capabilities of the AD1000 PCB make it an attractive option for engineers. The material's low moisture absorption of 0.03% also ensures reliable performance in humid environments.
Property | Units | Value | Test Method |
1. Electrical Properties | |||
Dielectric Constant (may vary by thickness) | |||
@1 MHz | - | IPC TM-650 2.5.5.3 | |
@ 10 GHz | - | 10.2 | IPC TM-650 2.5.5.5 |
Dissipation Factor | |||
@ 1 MHz | - | IPC TM-650 2.5.5.3 | |
@ 10 GHz | - | 0.0023 | IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric | - | ||
TCεr @ 10 GHz (-40-150°C) | ppm/℃ | -380 | IPC TM-650 2.5.5.5 |
Volume Resistivity | |||
C96/35/90 | MΩ-cm | 1.40x109 | IPC TM-650 2.5.17.1 |
E24/125 | MΩ-cm | 5.36x107 | IPC TM-650 2.5.17.1 |
Surface Resistivity | |||
C96/35/90 | MΩ | 1.80x109 | IPC TM-650 2.5.17.1 |
E24/125 | MΩ | 3.16x108 | IPC TM-650 2.5.17.1 |
Electrical Strength | Volts/mil (kV/mm) | 622 (24.5) | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | kV | >45 | IPC TM-650 2.5.6 |
Arc Resistance | sec | >180 | IPC TM-650 2.5.1 |
2. Thermal Properties | |||
Decomposition Temperature (Td) | |||
Initial | ℃ | >500 | IPC TM-650 2.4.24.6 |
5% | ℃ | >500 | IPC TM-650 2.4.24.6 |
T260 | min | >60 | IPC TM-650 2.4.24.1 |
T288 | min | >60 | IPC TM-650 2.4.24.1 |
T300 | min | >60 | IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC | ppm/℃ | 8, 10 | IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC | ppm/℃ | 20 | IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) | % | IPC TM-650 2.4.24 | |
3. Mechanical Properties | |||
Peel Strength to Copper (1 oz/35 micron) | |||
After Thermal Stress | lb/in (N/mm) | >12 (2.1) | IPC TM-650 2.4.8 |
At Elevated Temperatures (150º) | lb/in (N/mm) | 13.6 (2.4) | IPC TM-650 2.4.8.2 |
After Process Solutions | lb/in (N/mm) | IPC TM-650 2.4.8 | |
Young’s Modulus | kpsi (GPa) | 200 (1.38) | IPC TM-650 2.4.18.3 |
Flexural Strength (Machine/Cross) | kpsi (MPa) | 9.9/7.5 (68/52) | IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) | kpsi (MPa) | 5.1/4.3 (35/30) | IPC TM-650 2.4.18.3 |
Compressive Modulus | kpsi (GPa) | >425 (>2.93) | ASTM D-3410 |
Poisson’s Ratio | - | 0.16 | ASTM D-3039 |
4. Physical Properties | |||
Water Absorption | % | 0.03 | IPC TM-650 2.6.2.1 |
Density, ambient 23ºC | g/cm3 | 3.20 | ASTM D792 Method A |
Thermal Conductivity | W/mK | 0.81 | ASTM E1461 |
Flammability | class | Meets V0 | UL-94 |
NASA Outgassing, 125ºC, ≤10-6 torr | % | NASA SP-R-0022A | |
Total Mass Loss | % | 0.01 | NASA SP-R-0022A |
Collected Volatiles | % | 0.00 | NASA SP-R-0022A |
Water Vapor Recovered | % | 0.00 | NASA SP-R-0022A |
The 2-layer rigid PCB utilizes 35 μm copper layers on a 1.527 mm thick AD1000 core, with a total finished thickness of 1.6 mm. The construction details include a minimum 4/4 mil trace/space and 0.32 mm hole size, meeting the IPC-Class-2 standard.
PCB Construction Details:
Board dimensions: 42.6 mm x 21.5 mm, with a tolerance of ±0.15 mm
Minimum trace/space: 4/4 mils
Minimum hole size: 0.32 mm
No blind vias
Finished copper weight: 1 oz (1.4 mils) on the outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Gold
No top or bottom silkscreen or solder mask
100% electrical testing is performed prior to shipment to ensure quality and reliability.
This 3-component, 11-pad PCB has 7 through-hole and 4 top-side SMT pads, with 4 vias interconnecting the 2 electrical nets. 100% electrical testing is performed prior to shipment to ensure exceptional quality and reliability.
The AD1000 PCB is an excellent choice for a wide range of high-frequency applications, including radar modules, collision avoidance systems, power amplifiers, low noise amplifiers, and miniaturized circuitry and patch antennas, particularly in the X-band and below frequency ranges. With its robust construction, superior electrical performance, and global availability, the AD1000 is a proven solution for demanding microwave and RF designs.
PCB Material: | Woven Glass Reinforced PTFE/Ceramic Filled |
Designation: | AD1000 |
Dielectric constant: | 10.2 |
Dissipation Factor | 0.0023 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm ), 125mil ( 3.175mm ), 127mil (3.226mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848