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TMM6 25mil Microwave PCB Custom PCB Board Immersion Silver

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TMM6 25mil Microwave PCB Custom PCB Board Immersion Silver

TMM6 25mil Microwave PCB Custom PCB Board Immersion Silver
TMM6 25mil Microwave PCB Custom PCB Board Immersion Silver TMM6 25mil Microwave PCB Custom PCB Board Immersion Silver

Large Image :  TMM6 25mil Microwave PCB Custom PCB Board Immersion Silver

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TMM6 PCB Size: 56.04mm X 53.18 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Silver
Layer Count: 2-layer PCB Thickness: 25 Mil

Introducing a newly shipped PCB based on TMM6 material. TMM6, the Rogers TMM 6 thermoset microwave material, is a cutting-edge ceramic thermoset polymer composite designed to provide reliability and performance for high plated thru-hole strip-line and micro-strip applications. Offering the advantages of both ceramic and traditional PTFE microwave circuit laminates, TMM6 eliminates the need for specialized production techniques typically associated with these materials. With a unique dielectric constant (Dk) compared to other materials in its product family, TMM6 sets a new standard in microwave PCB technology.

 

Key Features:

- Dielectric constant (Dk) of 6.0 +/- .08 at 10GHz ensures precise signal propagation.
- Dissipation factor of .0023 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -11 ppm/°K provides exceptional thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.72W/mk enables efficient heat dissipation.
- Available in a thickness range of .0015 to .500 inches, offering versatility in design.

 

Benefits:

The TMM6 PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Based on a thermoset resin, allowing for reliable wire-bonding.
- Compatible with all common PCB processes, making it versatile and easy to work with.

 

Property TMM6 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.0±0.08 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 6.3 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0023 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -11 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 10^8 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 362 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 18 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 18 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 26 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.72 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.02 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.75 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.37 - - A ASTM D792
Specific Heat Capacity 0.78 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

PCB Stackup and Construction Details:

This PCB features a 2-layer rigid PCB stackup, providing simplicity and versatility. The construction details are as follows:
- Copper_layer_1: 35 μm for efficient signal conduction.
- Rogers TMM6 Core: 0.635 mm (25mil) for optimal electrical properties.
- Copper_layer_2: 35 μm for consistent signal performance.

 

With a board size of 56.04mm x 53.18mm, each PCB is manufactured with a tight tolerance of +/- 0.15mm, ensuring consistent dimensions. The minimum trace/space capability of 4/4 mils allows for intricate circuit designs and efficient routing. The minimum hole size of 0.3mm provides versatility for component placement. The absence of blind vias simplifies the manufacturing process while maintaining structural integrity.

 

The finished board thickness of 0.7mm strikes a balance between durability and compactness. The outer layers feature a 1oz (1.4 mils) copper weight, ensuring excellent conductivity and signal integrity. With a via plating thickness of 20 μm, reliable electrical connections are established throughout the PCB. The surface finish of immersion silver enhances conductivity and protects against oxidation. While there is no top or bottom silkscreen or solder mask, this allows for a clean and unobstructed PCB surface.

 

To ensure the highest quality, each PCB undergoes a 100% electrical test before shipment, guaranteeing that it meets rigorous performance standards. With these outstanding specifications, the TMM6 Thermoset Microwave PCB is ready to empower your electronic designs with reliability, precision, and efficient signal transmission.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM6
Dielectric constant: 6
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

 

TMM6 25mil Microwave PCB Custom PCB Board Immersion Silver 0

 

PCB Statistics:

- Components: 16
- Total Pads: 33
- Thru Hole Pads: 23
- Top SMT Pads: 10
- Bottom SMT Pads: 0
- Vias: 15
- Nets: 3

 

Artwork and Quality:

This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is manufactured and available worldwide, ensuring accessibility for various applications.

 

Typical Applications:

The TMM6 PCB is suitable for a wide range of applications, including:
 

- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers

 

Experience the reliability and performance of TMM6 Thermoset Microwave PCB and unlock a new realm of possibilities for your electronic designs.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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