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Product Details:
Payment & Shipping Terms:
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| Material: | TMM6 | PCB Size: | 56.04mm X 53.18 Mm=1PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Silver |
| Layer Count: | 2-layer | PCB Thickness: | 25 Mil |
| High Light: | 25mil Microwave PCB,Immersion Silver Microwave PCB,Custom PCB Board Microwave PCB |
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Introducing a newly shipped PCB based on TMM6 material. TMM6, the Rogers TMM 6 thermoset microwave material, is a cutting-edge ceramic thermoset polymer composite designed to provide reliability and performance for high plated thru-hole strip-line and micro-strip applications. Offering the advantages of both ceramic and traditional PTFE microwave circuit laminates, TMM6 eliminates the need for specialized production techniques typically associated with these materials. With a unique dielectric constant (Dk) compared to other materials in its product family, TMM6 sets a new standard in microwave PCB technology.
Key Features:
- Dielectric constant (Dk) of 6.0 +/- .08 at 10GHz ensures precise signal propagation.
- Dissipation factor of .0023 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -11 ppm/°K provides exceptional thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.72W/mk enables efficient heat dissipation.
- Available in a thickness range of .0015 to .500 inches, offering versatility in design.
Benefits:
The TMM6 PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Based on a thermoset resin, allowing for reliable wire-bonding.
- Compatible with all common PCB processes, making it versatile and easy to work with.
| Property | TMM6 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 6.0±0.08 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 6.3 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.0023 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | -11 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | 2 x 10^8 | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | 1 x 10^9 | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 362 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 18 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 18 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 26 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | 0.72 | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | 15.02 | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | 1.75 | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.06 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.2 | |||||
| Specific Gravity | 2.37 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.78 | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
PCB Stackup and Construction Details:
This PCB features a 2-layer rigid PCB stackup, providing simplicity and versatility. The construction details are as follows:
- Copper_layer_1: 35 μm for efficient signal conduction.
- Rogers TMM6 Core: 0.635 mm (25mil) for optimal electrical properties.
- Copper_layer_2: 35 μm for consistent signal performance.
With a board size of 56.04mm x 53.18mm, each PCB is manufactured with a tight tolerance of +/- 0.15mm, ensuring consistent dimensions. The minimum trace/space capability of 4/4 mils allows for intricate circuit designs and efficient routing. The minimum hole size of 0.3mm provides versatility for component placement. The absence of blind vias simplifies the manufacturing process while maintaining structural integrity.
The finished board thickness of 0.7mm strikes a balance between durability and compactness. The outer layers feature a 1oz (1.4 mils) copper weight, ensuring excellent conductivity and signal integrity. With a via plating thickness of 20 μm, reliable electrical connections are established throughout the PCB. The surface finish of immersion silver enhances conductivity and protects against oxidation. While there is no top or bottom silkscreen or solder mask, this allows for a clean and unobstructed PCB surface.
To ensure the highest quality, each PCB undergoes a 100% electrical test before shipment, guaranteeing that it meets rigorous performance standards. With these outstanding specifications, the TMM6 Thermoset Microwave PCB is ready to empower your electronic designs with reliability, precision, and efficient signal transmission.
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM6 |
| Dielectric constant: | 6 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
PCB Statistics:
- Components: 16
- Total Pads: 33
- Thru Hole Pads: 23
- Top SMT Pads: 10
- Bottom SMT Pads: 0
- Vias: 15
- Nets: 3
Artwork and Quality:
This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is manufactured and available worldwide, ensuring accessibility for various applications.
Typical Applications:
The TMM6 PCB is suitable for a wide range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers
Experience the reliability and performance of TMM6 Thermoset Microwave PCB and unlock a new realm of possibilities for your electronic designs.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
