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2-layer 125mil RT duroid 5880 PCB ENEPIG Surface Finished

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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2-layer 125mil RT duroid 5880 PCB ENEPIG Surface Finished

2-layer 125mil RT duroid 5880 PCB ENEPIG Surface Finished
2-layer 125mil RT duroid 5880 PCB ENEPIG Surface Finished 2-layer 125mil RT duroid 5880 PCB ENEPIG Surface Finished

Large Image :  2-layer 125mil RT duroid 5880 PCB ENEPIG Surface Finished

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RT Duroid 5880 PCB Size: 43mm X 43 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: ENEPIG
Layer Count: 2-layer PCB Thickness: 125 Mil

Introducing our newly shipped PCB featuring Rogers RT/duroid 5880 high frequency laminates. These advanced PTFE composites reinforced with glass microfibers offer exceptional performance for high frequency and broadband applications. With a low dielectric constant (Dk) and low dielectric loss, this PCB ensures uniform electrical properties over a wide frequency range. Its isotropic nature and tight tolerances make it an ideal choice for demanding applications in various industries.


Key Features:
- Dielectric constant of 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C
- Dissipation factor of 0.0009 at 10 GHz
- Temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C
- Low moisture absorption of 0.02%
- Coefficient of Thermal Expansion (CTE) in X-axis: 31 ppm/°C, Y-axis: 48 ppm/°C, Z-axis: 237 ppm/°C
- Isotropic material with uniform electrical properties


1. Uniform electrical properties: The PCB maintains consistent electrical performance across a wide frequency range, ensuring reliable signal transmission.


2. Easy customization: RT/duroid 5880 laminates are easy to cut, shape, and machine, allowing for precise customization to meet specific design requirements.


3. Chemical resistance: These laminates are resistant to solvents and reagents used in etching or plating processes, enhancing their durability and longevity.


4. Suitable for high moisture environments: With low moisture absorption, RT/duroid 5880 laminates perform well in high humidity or moisture-prone environments.


5. Well-established material: RT/duroid 5880 is a well-known and widely used material in the industry, ensuring a proven track record of reliability and performance.


6. Low electrical loss: This PCB offers the lowest electrical loss among reinforced PTFE materials, ensuring efficient signal transmission and minimal signal degradation.


Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
1 MHz IPC-TM-650
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
Z N/A C24/23/50
1 MHz IPC-TM-650
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A


This PCB stackup features a 2-layer rigid construction. The first copper layer, Copper_layer_1, has a thickness of 35 μm, providing excellent conductivity for signal transmission. The core of the PCB is composed of RT/duroid 5880 laminate, which has a thickness of 3.175 mm (125mil). Finally, the second copper layer, Copper_layer_2, also has a thickness of 35 μm, completing the stackup.


Moving on to the PCB construction details, the board dimensions are 43mm x 43mm, with a tight tolerance of +/- 0.15mm. The minimum trace/space width is 4/5 mils, allowing for precise routing and efficient use of board space. The minimum hole size is 0.5mm, accommodating components with different lead sizes.


This PCB does not include blind vias, simplifying the manufacturing process and reducing costs. The finished board thickness is 3.2mm, providing durability and stability. The outer layers have a copper weight of 1 oz (1.4 mils), ensuring sufficient conductivity for signal transmission. The via plating thickness is 20 μm, ensuring reliable connections between different layers of the PCB.

The surface finish of this PCB is ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), which offers excellent corrosion resistance and solderability. The PCB does not include top or bottom silkscreen or top or bottom solder mask, simplifying the manufacturing process and reducing costs.


2-layer 125mil RT duroid 5880 PCB ENEPIG Surface Finished 0


Before shipment, each PCB undergoes a 100% electrical test to ensure its functionality and performance. This comprehensive testing process guarantees that the PCB meets the required specifications and functions as intended.


In terms of PCB statistics, this PCB comprises 8 components, allowing for simplified assembly and integration. It features a total of 28 pads, which serve as connection points for components and enable the transmission of electrical signals. Among these pads, 17 are dedicated to thru-hole components, while 11 are designed for surface-mount technology (SMT) components on the top side of the board. There are no SMT pads on the bottom side of the PCB. This PCB board includes 7 vias, which enable connections between different layers and facilitate the flow of signals and power. Additionally, there is 1 net, representing the distinct electrical path within the PCB design.


The artwork format used for this PCB is Gerber RS-274-X, a widely accepted standard in the industry for PCB manufacturing. It ensures compatibility with various fabrication processes and allows for accurate reproduction of the design.


The PCB complies with the IPC-Class-2 standard, which sets specific quality and performance criteria for PCBs intended for general electronic products. This adherence to a recognized industry standard ensures that the PCB meets the required levels of reliability and performance.

The availability of this PCB is not limited to a specific region or market. It is accessible worldwide, allowing customers from different locations to benefit from its features and applications.


RT duroid 5880 PCB is commonly used in commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave applications, radar systems, guidance systems, and point-to-point digital radio antennas.


2-layer 125mil RT duroid 5880 PCB ENEPIG Surface Finished 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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