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Double-Sided RO3010 PCB 25mil High Performance Circuit White Silkscreen

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Double-Sided RO3010 PCB 25mil High Performance Circuit White Silkscreen

Double-Sided RO3010 PCB 25mil High Performance Circuit White Silkscreen
Double-Sided RO3010 PCB 25mil High Performance Circuit White Silkscreen Double-Sided RO3010 PCB 25mil High Performance Circuit White Silkscreen

Large Image :  Double-Sided RO3010 PCB 25mil High Performance Circuit White Silkscreen

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RO3010 PCB Size: 90mm X 45 Mm=1PCS
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Layer Count: 2-layer PCB Thickness: 0.8 Mm

Introducing our newly shipped PCB featuring Rogers RO3010 advanced circuit materials. These ceramic-filled PTFE composites offer a higher dielectric constant with excellent stability, making them ideal for a wide range of applications across various frequencies. With exceptional mechanical and electrical stability, this competitively priced PCB simplifies the design of broadband components and supports circuit miniaturization.

 

Key Features:

Dielectric constant of 10.2+/- .30 at 10 GHz/23°C
Dissipation factor of 0.0022 at 10 GHz/23°C
Low Coefficient of Thermal Expansion (-55 to 288 °C): X axis 13 ppm/°C, Y axis 11 ppm/°C, Z axis 16 ppm/°C
Td> 500°C
Thermal Conductivity of 0.95 W/mK
Moisture Absorption of 0.05%
-40℃ to +85℃ operation

 

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.8   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits:

Dimensional stability with matched expansion coefficient to copper:
Ensures reliable performance and minimizes issues related to thermal expansion
Ideal for applications where stability is critical
Economical laminate pricing for volume manufacturing process:
Cost-effective solution for large-scale production
Suitable for use with multi-layer board designs:
Enables the creation of complex circuits and facilitates integration of multiple functionalities.

 

This PCB stackup consists of a 2-layer rigid PCB construction. The first copper layer, Copper_layer_1, has a thickness of 35 μm. It provides the necessary conductivity for signal transmission and power distribution. The core of the PCB is made of Rogers RO3010 substrate, which has a thickness of 25mil (0.635mm). This substrate material is known for its advanced properties, including a higher dielectric constant and excellent stability. Finally, the second copper layer, Copper_layer_2, also has a thickness of 35 μm, completing the stackup.

 

Moving on to the PCB construction details, the board dimensions are 90mm x 45 mm, providing a compact yet versatile size for various applications. The minimum trace/space width is 5/5 mils, allowing for precise routing of signals and efficient use of board space. The minimum hole size is 0.4mm, enabling the installation of components with different lead sizes.

 

This PCB does not include blind vias, simplifying the manufacturing process and reducing costs. The finished board thickness is 0.8mm, striking a balance between durability and space efficiency. The outer layers have a copper weight of 1 oz (1.4 mils), ensuring sufficient conductivity for signal transmission and power distribution. The via plating thickness is 20 μm, providing reliable connections between different layers of the PCB.

The surface finish of this PCB is immersion gold, which offers excellent corrosion resistance and solderability, ensuring robust performance in various environments. The top silkscreen is presented in white, providing clear and readable component labeling for ease of assembly and identification. The PCB does not include a bottom silkscreen, top solder mask, or bottom solder mask, simplifying the manufacturing process and reducing costs.

 

Double-Sided RO3010 PCB 25mil High Performance Circuit White Silkscreen 0

 

Before shipment, each PCB undergoes a 100% electrical test to ensure its functionality and performance. This comprehensive testing process guarantees that the PCB meets the required specifications and functions as intended.

 

In terms of PCB statistics, this PCB comprises 25 components, allowing for the creation of complex electronic circuits. It features a total of 96 pads, which serve as connection points for components and enable the transmission of electrical signals. Among these pads, 62 are dedicated to thru-hole components, while 34 are designed for surface-mount technology (SMT) components on the top side of the board. There are no SMT pads on the bottom side of the PCB. This PCB includes 71 vias, which enable connections between different layers and facilitate the flow of signals and power. Additionally, there are 4 nets, representing the distinct electrical paths within the PCB design.

 

The artwork format used for this PCB is Gerber RS-274-X, a widely accepted standard in the industry for PCB manufacturing. It ensures compatibility with various fabrication processes and allows for accurate reproduction of the design.

 

This PCB complies with the IPC-Class-2 standard, which sets specific quality and performance criteria for PCBs intended for general electronic products. This adherence to a recognized industry standard ensures that the PCB meets the required levels of reliability and performance.

The availability of this PCB is not limited to a specific region or market. It is accessible worldwide, allowing customers from different locations to benefit from its features and applications.

 

Double-Sided RO3010 PCB 25mil High Performance Circuit White Silkscreen 1

 

Some Typical Applications:

Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems: power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes

 

Experience the exceptional stability and performance of our worldwide available PCB featuring Rogers RO3010 advanced circuit materials. Designed for a range of applications, from automotive radar to power backplanes, this PCB ensures reliable operation across a broad frequency range. Benefit from its dimensional stability, cost-effectiveness, and suitability for multi-layer board designs in your next project.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)