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RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ

RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RO3006
PCB Size:
55mm X 47 Mm=1PCS
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.3 Mm
Highlight:

50mil RF PCB Board

,

1OZ Copper RF PCB Board

,

RO3006 RF PCB Board

Product Description

Introducing our newly shipped PCB featuring the cutting-edge Rogers RO3006 laminates. Designed with exceptional electrical and mechanical stability, this ceramic-filled PTFE composite ensures reliable performance in a wide range of applications. With a stable dielectric constant (Dk) over varying temperatures, it eliminates the step change in Dk commonly experienced with PTFE glass materials near room temperature.

 

Key Features:

Rogers RO3006 ceramic-filled PTFE composites
Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C
Dissipation factor of 0.002 at 10 GHz/23°C
Td> 500°C
Thermal Conductivity of 0.79 W/mK
Moisture Absorption of 0.02%
Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C

 

RO3006 Typical Value
Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1498
1293
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits:

Uniform mechanical properties for a range of dielectric constants:
Ideal for multi-layer board designs with varying dielectric constants
Suitable for use with epoxy glass multi-layer board hybrid designs
Low in-plane expansion coefficient (matching copper):
Allows for more reliable surface mounted assemblies
Ideal for temperature-sensitive applications
Excellent dimensional stability
Volume manufacturing process:
Economical laminate pricing

 

PCB Stackup:

2-layer rigid PCB
Copper_layer_1: 35 μm
Rogers RO3006 Substrate: 50mil (1.27mm)
Copper_layer_2: 35 μm

 

PCB Material: Ceramic-filled PTFE Composites
Designation: RO3006
Dielectric constant: 6.15
Dissipation Factor 0.002 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


PCB Construction Details:

This PCB has a compact size with dimensions of 55mm x 47mm, making it suitable for space-constrained applications. It features a minimum trace/space width of 4/6 mils, allowing for precise routing of signals and efficient use of board space. The minimum hole size is 0.3mm, enabling the installation of small components and facilitating ease of assembly.

 

The board does not include blind vias, simplifying the manufacturing process and reducing costs. With a finished board thickness of 1.4mm, it strikes a balance between durability and space efficiency. The outer layers have a copper weight of 1 oz (1.4 mils), providing sufficient conductivity for signal transmission and power distribution. The via plating thickness is 20 μm, ensuring reliable connections between different layers of the PCB.

 

The surface finish of this PCB is immersion gold, which offers excellent corrosion resistance and solderability, ensuring robust performance in various environments. The top silkscreen is presented in white, providing clear and readable component labeling for ease of assembly and identification. The board does not include a bottom silkscreen or top/bottom solder masks, simplifying the manufacturing process and reducing costs.

 

Before shipment, each PCB undergoes a 100% electrical test to ensure its functionality and performance. This comprehensive testing process guarantees that the PCB meets the required specifications and functions as intended.

 

RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ 0

 

PCB Statistics:

This PCB comprises 16 components, allowing for the creation of complex electronic circuits. It features a total of 46 pads, which serve as connection points for components and enable the transmission of electrical signals. Among these pads, 29 are dedicated to thru-hole components, while 17 are designed for surface-mount technology (SMT) components on the top side of the board. There are no SMT pads on the bottom side of the PCB.

 

The board includes 41 vias, which enable connections between different layers and facilitate the flow of signals and power. Additionally, there are 3 nets, representing the distinct electrical paths within the PCB design.

 

The artwork format used for this PCB is Gerber RS-274-X, a widely accepted standard in the industry for PCB manufacturing. It ensures compatibility with various fabrication processes and allows for accurate reproduction of the design.

 

This PCB complies with the IPC-Class-2 standard, which sets specific quality and performance criteria for PCBs intended for general electronic products. This adherence to a recognized industry standard ensures that the PCB meets the required levels of reliability and performance.

 

The availability of this PCB is not limited to a specific region or market. It is accessible worldwide, allowing customers from different locations to benefit from its features and applications.

 

Some Typical Applications:

Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems: power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes

 

Experience the reliability and performance of our worldwide available PCB featuring Rogers RO3006 laminates. Designed for a range of applications, from automotive radar to power backplanes, this PCB ensures exceptional electrical and mechanical stability in demanding environments. Trust in its uniform mechanical properties, low in-plane expansion coefficient, and cost-effective manufacturing process for your next project.

products
PRODUCTS DETAILS
RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RO3006
PCB Size:
55mm X 47 Mm=1PCS
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.3 Mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

50mil RF PCB Board

,

1OZ Copper RF PCB Board

,

RO3006 RF PCB Board

Product Description

Introducing our newly shipped PCB featuring the cutting-edge Rogers RO3006 laminates. Designed with exceptional electrical and mechanical stability, this ceramic-filled PTFE composite ensures reliable performance in a wide range of applications. With a stable dielectric constant (Dk) over varying temperatures, it eliminates the step change in Dk commonly experienced with PTFE glass materials near room temperature.

 

Key Features:

Rogers RO3006 ceramic-filled PTFE composites
Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C
Dissipation factor of 0.002 at 10 GHz/23°C
Td> 500°C
Thermal Conductivity of 0.79 W/mK
Moisture Absorption of 0.02%
Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C

 

RO3006 Typical Value
Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.27
0.15
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105   COND A IPC 2.5.17.1
Tensile Modulus 1498
1293
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits:

Uniform mechanical properties for a range of dielectric constants:
Ideal for multi-layer board designs with varying dielectric constants
Suitable for use with epoxy glass multi-layer board hybrid designs
Low in-plane expansion coefficient (matching copper):
Allows for more reliable surface mounted assemblies
Ideal for temperature-sensitive applications
Excellent dimensional stability
Volume manufacturing process:
Economical laminate pricing

 

PCB Stackup:

2-layer rigid PCB
Copper_layer_1: 35 μm
Rogers RO3006 Substrate: 50mil (1.27mm)
Copper_layer_2: 35 μm

 

PCB Material: Ceramic-filled PTFE Composites
Designation: RO3006
Dielectric constant: 6.15
Dissipation Factor 0.002 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


PCB Construction Details:

This PCB has a compact size with dimensions of 55mm x 47mm, making it suitable for space-constrained applications. It features a minimum trace/space width of 4/6 mils, allowing for precise routing of signals and efficient use of board space. The minimum hole size is 0.3mm, enabling the installation of small components and facilitating ease of assembly.

 

The board does not include blind vias, simplifying the manufacturing process and reducing costs. With a finished board thickness of 1.4mm, it strikes a balance between durability and space efficiency. The outer layers have a copper weight of 1 oz (1.4 mils), providing sufficient conductivity for signal transmission and power distribution. The via plating thickness is 20 μm, ensuring reliable connections between different layers of the PCB.

 

The surface finish of this PCB is immersion gold, which offers excellent corrosion resistance and solderability, ensuring robust performance in various environments. The top silkscreen is presented in white, providing clear and readable component labeling for ease of assembly and identification. The board does not include a bottom silkscreen or top/bottom solder masks, simplifying the manufacturing process and reducing costs.

 

Before shipment, each PCB undergoes a 100% electrical test to ensure its functionality and performance. This comprehensive testing process guarantees that the PCB meets the required specifications and functions as intended.

 

RO3006 Copper Coating Immersion Gold RF PCB Board 2-layer 50mil 1OZ 0

 

PCB Statistics:

This PCB comprises 16 components, allowing for the creation of complex electronic circuits. It features a total of 46 pads, which serve as connection points for components and enable the transmission of electrical signals. Among these pads, 29 are dedicated to thru-hole components, while 17 are designed for surface-mount technology (SMT) components on the top side of the board. There are no SMT pads on the bottom side of the PCB.

 

The board includes 41 vias, which enable connections between different layers and facilitate the flow of signals and power. Additionally, there are 3 nets, representing the distinct electrical paths within the PCB design.

 

The artwork format used for this PCB is Gerber RS-274-X, a widely accepted standard in the industry for PCB manufacturing. It ensures compatibility with various fabrication processes and allows for accurate reproduction of the design.

 

This PCB complies with the IPC-Class-2 standard, which sets specific quality and performance criteria for PCBs intended for general electronic products. This adherence to a recognized industry standard ensures that the PCB meets the required levels of reliability and performance.

 

The availability of this PCB is not limited to a specific region or market. It is accessible worldwide, allowing customers from different locations to benefit from its features and applications.

 

Some Typical Applications:

Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems: power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes

 

Experience the reliability and performance of our worldwide available PCB featuring Rogers RO3006 laminates. Designed for a range of applications, from automotive radar to power backplanes, this PCB ensures exceptional electrical and mechanical stability in demanding environments. Trust in its uniform mechanical properties, low in-plane expansion coefficient, and cost-effective manufacturing process for your next project.

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