MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing our newly shipped PCB featuring the cutting-edge Rogers RO3006 laminates. Designed with exceptional electrical and mechanical stability, this ceramic-filled PTFE composite ensures reliable performance in a wide range of applications. With a stable dielectric constant (Dk) over varying temperatures, it eliminates the step change in Dk commonly experienced with PTFE glass materials near room temperature.
Key Features:
Rogers RO3006 ceramic-filled PTFE composites
Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C
Dissipation factor of 0.002 at 10 GHz/23°C
Td> 500°C
Thermal Conductivity of 0.79 W/mK
Moisture Absorption of 0.02%
Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C
RO3006 Typical Value | |||||
Property | RO3006 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.27 0.15 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 1498 1293 |
X Y |
MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.86 | j/g/k | Calculated | ||
Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) |
17 17 24 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Benefits:
Uniform mechanical properties for a range of dielectric constants:
Ideal for multi-layer board designs with varying dielectric constants
Suitable for use with epoxy glass multi-layer board hybrid designs
Low in-plane expansion coefficient (matching copper):
Allows for more reliable surface mounted assemblies
Ideal for temperature-sensitive applications
Excellent dimensional stability
Volume manufacturing process:
Economical laminate pricing
PCB Stackup:
2-layer rigid PCB
Copper_layer_1: 35 μm
Rogers RO3006 Substrate: 50mil (1.27mm)
Copper_layer_2: 35 μm
PCB Material: | Ceramic-filled PTFE Composites |
Designation: | RO3006 |
Dielectric constant: | 6.15 |
Dissipation Factor | 0.002 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
PCB Construction Details:
This PCB has a compact size with dimensions of 55mm x 47mm, making it suitable for space-constrained applications. It features a minimum trace/space width of 4/6 mils, allowing for precise routing of signals and efficient use of board space. The minimum hole size is 0.3mm, enabling the installation of small components and facilitating ease of assembly.
The board does not include blind vias, simplifying the manufacturing process and reducing costs. With a finished board thickness of 1.4mm, it strikes a balance between durability and space efficiency. The outer layers have a copper weight of 1 oz (1.4 mils), providing sufficient conductivity for signal transmission and power distribution. The via plating thickness is 20 μm, ensuring reliable connections between different layers of the PCB.
The surface finish of this PCB is immersion gold, which offers excellent corrosion resistance and solderability, ensuring robust performance in various environments. The top silkscreen is presented in white, providing clear and readable component labeling for ease of assembly and identification. The board does not include a bottom silkscreen or top/bottom solder masks, simplifying the manufacturing process and reducing costs.
Before shipment, each PCB undergoes a 100% electrical test to ensure its functionality and performance. This comprehensive testing process guarantees that the PCB meets the required specifications and functions as intended.
PCB Statistics:
This PCB comprises 16 components, allowing for the creation of complex electronic circuits. It features a total of 46 pads, which serve as connection points for components and enable the transmission of electrical signals. Among these pads, 29 are dedicated to thru-hole components, while 17 are designed for surface-mount technology (SMT) components on the top side of the board. There are no SMT pads on the bottom side of the PCB.
The board includes 41 vias, which enable connections between different layers and facilitate the flow of signals and power. Additionally, there are 3 nets, representing the distinct electrical paths within the PCB design.
The artwork format used for this PCB is Gerber RS-274-X, a widely accepted standard in the industry for PCB manufacturing. It ensures compatibility with various fabrication processes and allows for accurate reproduction of the design.
This PCB complies with the IPC-Class-2 standard, which sets specific quality and performance criteria for PCBs intended for general electronic products. This adherence to a recognized industry standard ensures that the PCB meets the required levels of reliability and performance.
The availability of this PCB is not limited to a specific region or market. It is accessible worldwide, allowing customers from different locations to benefit from its features and applications.
Some Typical Applications:
Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems: power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
Experience the reliability and performance of our worldwide available PCB featuring Rogers RO3006 laminates. Designed for a range of applications, from automotive radar to power backplanes, this PCB ensures exceptional electrical and mechanical stability in demanding environments. Trust in its uniform mechanical properties, low in-plane expansion coefficient, and cost-effective manufacturing process for your next project.
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing our newly shipped PCB featuring the cutting-edge Rogers RO3006 laminates. Designed with exceptional electrical and mechanical stability, this ceramic-filled PTFE composite ensures reliable performance in a wide range of applications. With a stable dielectric constant (Dk) over varying temperatures, it eliminates the step change in Dk commonly experienced with PTFE glass materials near room temperature.
Key Features:
Rogers RO3006 ceramic-filled PTFE composites
Dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C
Dissipation factor of 0.002 at 10 GHz/23°C
Td> 500°C
Thermal Conductivity of 0.79 W/mK
Moisture Absorption of 0.02%
Coefficient of Thermal Expansion (-55 to 288 °C): X axis 17 ppm/°C, Y axis 17 ppm/°C, Z axis 24 ppm/°C
RO3006 Typical Value | |||||
Property | RO3006 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.27 0.15 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 1498 1293 |
X Y |
MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.86 | j/g/k | Calculated | ||
Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) |
17 17 24 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Benefits:
Uniform mechanical properties for a range of dielectric constants:
Ideal for multi-layer board designs with varying dielectric constants
Suitable for use with epoxy glass multi-layer board hybrid designs
Low in-plane expansion coefficient (matching copper):
Allows for more reliable surface mounted assemblies
Ideal for temperature-sensitive applications
Excellent dimensional stability
Volume manufacturing process:
Economical laminate pricing
PCB Stackup:
2-layer rigid PCB
Copper_layer_1: 35 μm
Rogers RO3006 Substrate: 50mil (1.27mm)
Copper_layer_2: 35 μm
PCB Material: | Ceramic-filled PTFE Composites |
Designation: | RO3006 |
Dielectric constant: | 6.15 |
Dissipation Factor | 0.002 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
PCB Construction Details:
This PCB has a compact size with dimensions of 55mm x 47mm, making it suitable for space-constrained applications. It features a minimum trace/space width of 4/6 mils, allowing for precise routing of signals and efficient use of board space. The minimum hole size is 0.3mm, enabling the installation of small components and facilitating ease of assembly.
The board does not include blind vias, simplifying the manufacturing process and reducing costs. With a finished board thickness of 1.4mm, it strikes a balance between durability and space efficiency. The outer layers have a copper weight of 1 oz (1.4 mils), providing sufficient conductivity for signal transmission and power distribution. The via plating thickness is 20 μm, ensuring reliable connections between different layers of the PCB.
The surface finish of this PCB is immersion gold, which offers excellent corrosion resistance and solderability, ensuring robust performance in various environments. The top silkscreen is presented in white, providing clear and readable component labeling for ease of assembly and identification. The board does not include a bottom silkscreen or top/bottom solder masks, simplifying the manufacturing process and reducing costs.
Before shipment, each PCB undergoes a 100% electrical test to ensure its functionality and performance. This comprehensive testing process guarantees that the PCB meets the required specifications and functions as intended.
PCB Statistics:
This PCB comprises 16 components, allowing for the creation of complex electronic circuits. It features a total of 46 pads, which serve as connection points for components and enable the transmission of electrical signals. Among these pads, 29 are dedicated to thru-hole components, while 17 are designed for surface-mount technology (SMT) components on the top side of the board. There are no SMT pads on the bottom side of the PCB.
The board includes 41 vias, which enable connections between different layers and facilitate the flow of signals and power. Additionally, there are 3 nets, representing the distinct electrical paths within the PCB design.
The artwork format used for this PCB is Gerber RS-274-X, a widely accepted standard in the industry for PCB manufacturing. It ensures compatibility with various fabrication processes and allows for accurate reproduction of the design.
This PCB complies with the IPC-Class-2 standard, which sets specific quality and performance criteria for PCBs intended for general electronic products. This adherence to a recognized industry standard ensures that the PCB meets the required levels of reliability and performance.
The availability of this PCB is not limited to a specific region or market. It is accessible worldwide, allowing customers from different locations to benefit from its features and applications.
Some Typical Applications:
Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems: power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
Experience the reliability and performance of our worldwide available PCB featuring Rogers RO3006 laminates. Designed for a range of applications, from automotive radar to power backplanes, this PCB ensures exceptional electrical and mechanical stability in demanding environments. Trust in its uniform mechanical properties, low in-plane expansion coefficient, and cost-effective manufacturing process for your next project.