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5mil RF-35A2 Double Sided PCB Immersion Silver No Solder Mask

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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5mil RF-35A2 Double Sided PCB Immersion Silver No Solder Mask

5mil RF-35A2 Double Sided PCB Immersion Silver No Solder Mask
5mil RF-35A2 Double Sided PCB Immersion Silver No Solder Mask 5mil RF-35A2 Double Sided PCB Immersion Silver No Solder Mask 5mil RF-35A2 Double Sided PCB Immersion Silver No Solder Mask

Large Image :  5mil RF-35A2 Double Sided PCB Immersion Silver No Solder Mask

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RF-35A2 PCB Size: 76.04mm X 33.18mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Silver
Layer Count: 2-layer PCB Thickness: 0.25 Mm
High Light:

Double Sided PCB Immersion Silver

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5mil RF-35A2 PCB

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No Solder Mask PCB Immersion Silver

Introducing the newly shipped PCB based on RF-35A2 Substrate.RF-35A2 is a cutting-edge PCB material designed to deliver exceptional performance in high-frequency applications. With its ultra-low fiberglass content and homogeneous dielectric constant, RF-35A2 achieves unparalleled insertion loss properties and optimal power transfer, making it the top choice for power amplifiers, filters/couplers, high-speed digital circuits, passive components, and wireless antennas.

 

RF-35A2 stands out with its ultra-low loss power amplifier substrate, providing an ideal platform for power amplifiers with minimal signal degradation and maximum efficiency. Its dielectric constant (Dk) of 3.5 at 10 GHz ensures consistent signal propagation and minimizes impedance variations, thanks to its homogeneous Dk throughout the laminate.

 

Exceptionally low dissipation factor is another notable feature of RF-35A2. With a dissipation factor of 0.0015 at 10 GHz and 23°C, RF-35A2 enables maximum power transfer while minimizing heat generation. This characteristic allows for efficient power amplification without sacrificing performance.

 

PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35A2
Dielectric constant: 3.15
Dissipation Factor 0.0015
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
Laminate thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

RF-35A2 exhibits low coefficients of thermal expansion (CTE) with x and y values of 10 ppm/°C and 13 ppm/°C, respectively. These low CTE values contribute to the material's dimensional stability and reliability, making it an excellent choice for surface mounting of chip carriers.

Manufactured using a proprietary multi-step process, RF-35A2 ensures excellent copper peel adhesion. This superior adhesion enhances the reliability and durability of connections between copper layers and the substrate, providing a solid foundation for your PCB design.

 

In addition to its outstanding electrical properties, RF-35A2 offers several benefits. Its Dk tolerance of ± 0.05 ensures consistent performance across production batches, while excellent peel strength (1 oz. VLP) of 12 lbs/in guarantees secure copper adhesion even under demanding conditions. With a low moisture absorption of 0.03%, RF-35A2 maintains stability and reliability in various environments. The material also facilitates ease of drilling, streamlining the PCB manufacturing process.

 

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   3.5   3.5
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.0015   0.0015
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Dielectric Breakdown IPC-650 2.5.6/ASTM D 149 kV 59 kV 59
Dielectric Strength ASTM D 149 V/mil 1000 V/mm 39,370
Volume Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm/cm 10^9 Mohm/cm 10^9
Surface Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm 10^8 Mohm 10^8
Arc Resistance IPC-650 2.5.1 Seconds 242 Seconds 242
Flexural Strength (MD) IPC-650 2.4.4 kpsi 24 N/mm2 165
Flexural Strength (CD) IPC-650 2.4.4 kpsi 15 N/mm2 103
Tensile Strength (MD) ASTM D 3039 psi 16,800 N/mm2 116
Tensile Strength (CD) ASTM D 3039 psi 11,000 N/mm2 75.8
Young’s Modulus (MD) ASTM D 3039 psi 106 N/mm2 8,343
Young’s Modulus (CD) ASTM D 3039 psi 106 N/mm2 7,171
Poisson’s Ratio (MD) ASTM D 3039   0.14   0.14
Poisson’s Ratio (CD) ASTM D 3039   0.1   0.1
Strain at Break (MD) ASTM D 3039 % 1.6 % 1.6
Strain at Break (CD) ASTM D 3039 % 1.4 % 1.4
Compressive Modulus (Z axis) ASTM D 695 (23°C) kpsi 385 N/mm2 2,650
Peel Strength (1 oz. VLP) IPC-650 2.4.8 (Thermal Stress) lbs/in 12 N/mm 2.1
Peel Strength (1 oz. VLP) IPC-650 2.4.8.3 (150°C ) (Elevated Temp.) lbs/in 14 N/mm 2.5
Peel Strength (1 oz. VLP) IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals) lbs/in 11 N/mm 2
Density (Specific Gravity)   gm/cm3 2.28 gm/cm3 2.28
Specific Heat ASTM E 1269 (DSC) (100°C) J/g/K 0.99 J/g/K 0.99
Thermal Conductivity ASTM F 433 W/M*K 0.29 W/M*K 0.29
Td IPC-650 2.4.24.6 2% Weight Loss °C 528 °C 528
Td IPC-650 2.4.24.6 5% Weight Loss °C 547 °C 547
CTE (x) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 10 ppm/°C 10
CTE (y) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 13 ppm/°C 13
CTE (z) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 108 ppm/°C 108

 

5mil RF-35A2 Double Sided PCB Immersion Silver No Solder Mask 0

 

This 2-layer rigid PCB constructed with RF-35A2 features a copper layer thickness of 35 μm (1 oz) for optimal conductivity. The RF-35A2 layer has a thickness of 0.127 mm (5 mil), providing the desired electrical properties. The board dimensions are 76.04mm x 33.18mm (1PCS) with a tolerance of +/- 0.15mm, ensuring precise dimensions for your specific requirements. The PCB undergoes 100% electrical testing prior to shipment, ensuring its reliability and adherence to quality standards.

 

With 23 components and 56 total pads, including 45 thru-hole pads and 11 top SMT pads, this PCB offers versatility for various applications. It includes 24 vias and 2 nets, providing flexibility in circuit connections. The PCB is compatible with Gerber RS-274-X artwork files and manufactured to meet the IPC-Class-2 quality standard, guaranteeing reliability and consistent performance.

 

RF-35A2 PCBs are available for worldwide purchase, allowing engineers and manufacturers from all regions to benefit from their exceptional quality. Unlock the potential of RF-35A2 in your high-frequency applications, such as power amplifiers, filters/couplers, high-speed digital circuits, passive components, and wireless antennas.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)