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Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished

Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished
Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished

Large Image :  Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: Rogers RO4350B, Rogers RO4003C PCB Size: 32mm X 42 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Layer Count: 6-layer PCB Thickness: 1.6 Mm
High Light:

4mil RO4350B PCB

,

20mil RO4003C PCB

,

Immersion Gold finished PCB

Introducing our Hybrid PCB,a revolutionary printed circuit board that combines multiple materials to unlock unparalleled performance and flexibility. By integrating diverse substrate materials within a single board, the Hybrid PCB empowers you to harness the unique properties of each material, allowing you to push the boundaries of your applications. Let's delve into the remarkable features and specifications that make this Hybrid PCB the ideal choice for your next project.

 

Powerful Features for Optimal Performance:

This Hybrid PCB is available in two variants: the RO4003C and the RO4350B, both engineered to deliver exceptional results in a variety of demanding applications. Here's a closer look at the remarkable features of each variant:

 

RO4003C:
- Dielectric Constant Dk of 3.38 +/- .05
- Dissipation factor of .0027 at 10GHz
- Thermal coefficient of Dk of 40 ppm/°K
- Coefficient of thermal expansion matched to copper: x y z - 11ppm/K, 14ppm/K, 46ppm/K
- Decomposition Temperature (Td) of 425 °C TGA
- Thermal Conductivity of 0.71W/mk
- Tg >280°C TMA

 

Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150 IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/ -55to288 IPC-TM-650 2.4.41
Tg >280   TMA A IPC-TM-650 2.4.24.3
Td 425   TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80 ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density 1.79   gm/cm3 23 ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

RO4350B:
- Dielectric Constant Dk of 3.48 +/- .05
- Dissipation factor of .0037 at 10GHz
- Thermal coefficient of Dk of 50 ppm/°K
- Coefficient of thermal expansion matched to copper: x y z - 10ppm/K, 12ppm/K, 32ppm/K
- Decomposition Temperature (Td) of 390 °C TGA
- Thermal Conductivity of 0.69W/mk
- Tg >280°C TMA

 

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.69   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0       UL 94
Lead-free Process Compatible Yes        

 

Optimized PCB Stackup:
This Hybrid PCB features a 6-layer rigid construction, meticulously designed to maximize performance and reliability. The stackup includes copper layers, RogersRO4350B and RogersRO4003C cores, and RO4450F prepreg layers. This carefully crafted combination ensures efficient signal transmission and excellent thermal management, even under demanding conditions.

 

Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished 0

 

Precise Construction Details:
With this Hybrid PCB, precision is paramount. Here are the key construction details that set our board apart:
- Board dimensions: 32mm x 42mm, ensuring compatibility with various applications
- Minimum Trace/Space: 6/6 mils, enabling intricate circuitry design
- Minimum Hole Size: 0.4mm, facilitating seamless integration of components
- Finished board thickness: 1.6mm, striking a balance between compactness and durability
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring optimal conductivity
- Via plating thickness: 20 μm, guaranteeing reliable electrical connections
- Surface finish: Immersion Gold, providing superior corrosion resistance and solderability
- Top Silkscreen: No, for a sleek and minimalistic appearance
- Bottom Silkscreen: No, maintaining a clean and professional aesthetic
- Top Solder Mask: Green, for enhanced protection and visual distinction
- Bottom Solder Mask: No, ensuring a streamlined design
- 100% Electrical test: Each board undergoes rigorous testing to ensure flawless functionality prior to shipment.

 

Hybrid PCB on 20mil RO4003C and 4mil RO4350B Immersion Gold finished 1

 

Uncompromising Quality and Standards:
This Hybrid PCB adheres to the IPC-Class-2 quality standard, guaranteeing exceptional workmanship and reliability. We take pride in delivering products that meet and exceed industry benchmarks, enabling you to achieve outstanding results in your applications.

 

Endless Possibilities, Worldwide Availability:

The versatility of our Hybrid PCB makes it an ideal choice for a wide range of applications, including:
- Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB's for Direct Broadcast Satellites

 

Whether you're designing next-generation wireless communication systems or advanced automotive electronics, the Hybrid PCB empowers you to realize your vision, unlocking new possibilities for innovation.

 

Harness the Power of Hybrid PCB Technology:
Experience the future of electronic design with the Hybrid PCB. With its unmatched combination of materials, exceptional performance features, and meticulous craftsmanship, our Hybrid PCB is the ultimate solution for your circuitry needs.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)