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30mil DiClad 880 High Frequency PCB 2-layer Immesion Silver

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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30mil DiClad 880 High Frequency PCB 2-layer Immesion Silver

30mil DiClad 880 High Frequency PCB 2-layer Immesion Silver
30mil DiClad 880 High Frequency PCB 2-layer Immesion Silver 30mil DiClad 880 High Frequency PCB 2-layer Immesion Silver

Large Image :  30mil DiClad 880 High Frequency PCB 2-layer Immesion Silver

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: DiClad 880 PCB Size: 60mm X 60 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Silver
Layer Count: 2-layer PCB Thickness: 30 Mil
High Light:

30mil DiClad 880 High Frequency PCB

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DiClad 880 High Frequency PCB

Introducing our newly shipped PCB based on DiClad 880, a cutting-edge substrate that harnesses the power of woven fiberglass and PTFE-based composites. Engineered by Rogers, a leader in advanced materials, the DiClad 880 PCB offers unparalleled performance, exceptional dielectric properties, and unmatched reliability for a wide range of applications.

 

Key Features & Benefits:

1. Impressive Dielectric Performance:
The DiClad 880 PCB boasts a low dielectric constant (DK) of 2.17 or 2.2 +/- 0.04 at 10 GHz/23°C and 1 MHz, ensuring optimal signal integrity and minimal loss. Its impressively low dissipation factor of 0.0009 at 10 GHz/23°C and 0.0008 at 1 MHz further enhances its efficiency.

 

2. Temperature Stability:
With a temperature coefficient of DK (TcDK) of -160 ppm/°C ranging from -10°C to 140°C, the DiClad 880 PCB maintains its exceptional performance even under extreme temperature conditions. Say goodbye to signal degradation and hello to reliability.

 

3. Moisture Resistance:
DiClad 880 features the lowest moisture absorption among PTFE-based composites, standing at a mere 0.02%. This exceptional moisture resistance ensures consistent performance and longevity, even in humid environments.

 

4. Dimensional Stability:
This PCB offers excellent dimensional stability, with a coefficient of thermal expansion (CTE) of 25 ppm/°C (X-axis), 34 ppm/°C (Y-axis), and 252 ppm/°C (Z-axis). This stability ensures precise and reliable connections, even with varying temperatures.

 

5. Wide Frequency Range:
Experience stable DK performance across a wide frequency range, making the DiClad 880 PCB suitable for diverse applications that demand consistent signal transmission.

 

6. Enhanced Design Flexibility:
Thanks to its low DK, the DiClad 880 PCB supports wider line widths, enabling lower insertion loss and improved design flexibility. Achieve optimal performance without compromising on your design requirements.

 

Property Test Method Condition DiClad 880
Dielectric Constant @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20
Dielectric Constant @ 1 MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009
Dissipation Factor @ 1 MHz IPC TM-650 2.5.5.3 C23/50 0.0008
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5
Adapted
-10°C to +140°C -160
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 1.4 x 10 9
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 2.9 x 10 6
Arc Resistance ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 267, 202
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.1, 7.5
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 237
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 357
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm3) ASTM D-792 Method A A, 23°C 2.23
Water Absorption (%) MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
E1/105 + D24/23 0.02
Coefficient of Thermal IPC TM-650 2.4.24 0°C to 100°C  
Expansion (ppm/°C) Mettler 3000  
X Axis Thermomechanical 25
Y Axis Analyzer 34
Z Axis   252
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.261
Outgassing NASA SP-R-0022A 125°C, ≤ 10-6 torr  
Total Mass Loss (%) Maximum 1.00% 0.01
Collected Volatile Maximum 0.10% 0.01
Condensable Material (%)    
Water Vapor Regain (%)   0.01
Visible Condensate (±)   NO
Flammability UL File E 80166 UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

 

PCB Construction Details:

 

- 2-Layer Rigid PCB:
The construction of this PCB is a 2-layer rigid PCB, providing a sturdy foundation for your electronic designs.

 

- High-Quality Build:
With a copper layer of 35 μm on both the top and bottom sides and a DiClad 880 thickness of 0.762 mm (30 mil), this PCB ensures exceptional conductivity and durability.

 

- Precise Specifications:
The dimensions of this PCB measure 60 mm x 60 mm (+/- 0.15 mm), offering a compact yet versatile form factor. The minimum trace/space is 5/5 mils, while the minimum hole size is 0.35 mm. The finished board thickness is 0.8 mm, and the finished copper weight stands at 1 oz (1.4 mils) for the outer layers.

 

- Reliable Plating and Surface Finish:
This PCB features 20 μm via plating thickness to ensure robust connections. It also boasts an immersion silver surface finish, providing excellent conductivity and corrosion resistance.

 

- Rigorous Quality Assurance:
Prior to shipment, each PCB undergoes a 100% electrical test to ensure exceptional performance and reliability.

 

PCB Material: Woven Fiberglass Reinforced, PTFE-based Composites
Designation: DiClad 880
Dielectric constant: 2.20 (10 GHz)
Dissipation factor 0.0009 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc..

 

30mil DiClad 880 High Frequency PCB 2-layer Immesion Silver 0

 

Applications:

The DiClad 880 PCB is well-suited for a wide range of applications, including:

- Radar Feed Networks
- Commercial Phased Array Networks
- Low Loss Base Station Antennas
- Guidance Systems
- Digital Radio Antennas
- Filters, Couplers, LNAs

 

Supply and Standards:

DiClad 880 PCBs are available worldwide, allowing you to access this advanced technology regardless of your location. This PCB adheres to IPC-Class-2 standard, guaranteeing high-quality manufacturing and consistent performance.

 

Enhance your electronic designs to a whole new level with the DiClad 880 PCB, unlocking unrivaled performance, exceptional reliability, and unparalleled design flexibility. Embrace the future of PCB technology and experience the cutting-edge today.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)