Product Details:
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Material: | DiClad 880 | PCB Size: | 60mm X 60 Mm=1PCS, +/- 0.15mm |
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Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Silver |
Layer Count: | 2-layer | PCB Thickness: | 30 Mil |
Highlight: | 30mil DiClad 880 High Frequency PCB,DiClad 880 High Frequency PCB |
Introducing our newly shipped PCB based on DiClad 880, a cutting-edge substrate that harnesses the power of woven fiberglass and PTFE-based composites. Engineered by Rogers, a leader in advanced materials, the DiClad 880 PCB offers unparalleled performance, exceptional dielectric properties, and unmatched reliability for a wide range of applications.
Key Features & Benefits:
1. Impressive Dielectric Performance:
The DiClad 880 PCB boasts a low dielectric constant (DK) of 2.17 or 2.2 +/- 0.04 at 10 GHz/23°C and 1 MHz, ensuring optimal signal integrity and minimal loss. Its impressively low dissipation factor of 0.0009 at 10 GHz/23°C and 0.0008 at 1 MHz further enhances its efficiency.
2. Temperature Stability:
With a temperature coefficient of DK (TcDK) of -160 ppm/°C ranging from -10°C to 140°C, the DiClad 880 PCB maintains its exceptional performance even under extreme temperature conditions. Say goodbye to signal degradation and hello to reliability.
3. Moisture Resistance:
DiClad 880 features the lowest moisture absorption among PTFE-based composites, standing at a mere 0.02%. This exceptional moisture resistance ensures consistent performance and longevity, even in humid environments.
4. Dimensional Stability:
This PCB offers excellent dimensional stability, with a coefficient of thermal expansion (CTE) of 25 ppm/°C (X-axis), 34 ppm/°C (Y-axis), and 252 ppm/°C (Z-axis). This stability ensures precise and reliable connections, even with varying temperatures.
5. Wide Frequency Range:
Experience stable DK performance across a wide frequency range, making the DiClad 880 PCB suitable for diverse applications that demand consistent signal transmission.
6. Enhanced Design Flexibility:
Thanks to its low DK, the DiClad 880 PCB supports wider line widths, enabling lower insertion loss and improved design flexibility. Achieve optimal performance without compromising on your design requirements.
Property | Test Method | Condition | DiClad 880 |
Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 |
Dielectric Constant @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.17, 2.20 |
Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0009 |
Dissipation Factor @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 0.0008 |
Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 Adapted |
-10°C to +140°C | -160 |
Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.4 x 10 9 |
Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 2.9 x 10 6 |
Arc Resistance | ASTM D-495 | D48/50 | >180 |
Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 267, 202 |
Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 8.1, 7.5 |
Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 237 |
Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 357 |
Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
Density (g/cm3) | ASTM D-792 Method A | A, 23°C | 2.23 |
Water Absorption (%) | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
E1/105 + D24/23 | 0.02 |
Coefficient of Thermal | IPC TM-650 2.4.24 | 0°C to 100°C | |
Expansion (ppm/°C) | Mettler 3000 | ||
X Axis | Thermomechanical | 25 | |
Y Axis | Analyzer | 34 | |
Z Axis | 252 | ||
Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.261 |
Outgassing | NASA SP-R-0022A | 125°C, ≤ 10-6 torr | |
Total Mass Loss (%) | Maximum 1.00% | 0.01 | |
Collected Volatile | Maximum 0.10% | 0.01 | |
Condensable Material (%) | |||
Water Vapor Regain (%) | 0.01 | ||
Visible Condensate (±) | NO | ||
Flammability UL File E 80166 | UL 94 Vertical Burn IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
PCB Construction Details:
- 2-Layer Rigid PCB:
The construction of this PCB is a 2-layer rigid PCB, providing a sturdy foundation for your electronic designs.
- High-Quality Build:
With a copper layer of 35 μm on both the top and bottom sides and a DiClad 880 thickness of 0.762 mm (30 mil), this PCB ensures exceptional conductivity and durability.
- Precise Specifications:
The dimensions of this PCB measure 60 mm x 60 mm (+/- 0.15 mm), offering a compact yet versatile form factor. The minimum trace/space is 5/5 mils, while the minimum hole size is 0.35 mm. The finished board thickness is 0.8 mm, and the finished copper weight stands at 1 oz (1.4 mils) for the outer layers.
- Reliable Plating and Surface Finish:
This PCB features 20 μm via plating thickness to ensure robust connections. It also boasts an immersion silver surface finish, providing excellent conductivity and corrosion resistance.
- Rigorous Quality Assurance:
Prior to shipment, each PCB undergoes a 100% electrical test to ensure exceptional performance and reliability.
PCB Material: | Woven Fiberglass Reinforced, PTFE-based Composites |
Designation: | DiClad 880 |
Dielectric constant: | 2.20 (10 GHz) |
Dissipation factor | 0.0009 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc.. |
Applications:
The DiClad 880 PCB is well-suited for a wide range of applications, including:
- Radar Feed Networks
- Commercial Phased Array Networks
- Low Loss Base Station Antennas
- Guidance Systems
- Digital Radio Antennas
- Filters, Couplers, LNAs
Supply and Standards:
DiClad 880 PCBs are available worldwide, allowing you to access this advanced technology regardless of your location. This PCB adheres to IPC-Class-2 standard, guaranteeing high-quality manufacturing and consistent performance.
Enhance your electronic designs to a whole new level with the DiClad 880 PCB, unlocking unrivaled performance, exceptional reliability, and unparalleled design flexibility. Embrace the future of PCB technology and experience the cutting-edge today.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848