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2-layer RF PCB TMM10 20mil Thick with Blue Soldermask and Immersion Silver

2-layer RF PCB TMM10 20mil Thick with Blue Soldermask and Immersion Silver

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
TMM10
PCB Size:
63mm X 45 Mm=1PCS, +/- 0.15mm
Copper Weight:
1OZ
Surface Finish:
Immersion Silver
Layer Count:
Double-sided
PCB Thickness:
0.6mm
Highlight:

Blue Soldermask RF PCB

,

20mil Thick RF PCB

,

Immersion Silver RF PCB

Product Description

Prepare to witness a new era in RF and microwave circuitry with our groundbreaking TMM10 PCB. Meticulously engineered using Rogers TMM 10 thermoset microwave material, this advanced PCB is poised to revolutionize the industry. Discover the extraordinary features and benefits that set the TMM10 PCB apart, delivering unparalleled performance and setting new standards of excellence.

 

Unmatched Performance:

 

1. Superior Signal Integrity:
- With a Dk of 9.20 +/- .23 at 10GHz, the TMM10 PCB ensures precise and reliable signal propagation, minimizing loss and distortion.
- A dissipation factor of .0022 at 10GHz guarantees exceptional signal fidelity, allowing for high-quality data transmission.
- The thermal coefficient of Dk of -38 ppm/°K enables stable performance across temperature variations, ensuring consistent signal integrity.

 

2. Advanced Thermal Management:
- The TMM10 PCB boasts a thermal coefficient of expansion matched to copper, mitigating thermal stress and enhancing overall reliability.
- With a thermal conductivity of 0.76W/mk, heat dissipation is optimized, preventing performance degradation in demanding applications.
- The impressive Decomposition Temperature (Td) of 425 °C TGA ensures the PCB's resilience even under high-temperature conditions.

 

TMM10 Typical Value
Property   TMM10 Direction Units Condition Test Method
Dielectric Constant,εProcess 9.20±0.23 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.8 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0022 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -38 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 285 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 21 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 21 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 13.62 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.79 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.09 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.74 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

Unrivaled Reliability:

 

1. Exceptional Mechanical Properties:
- The TMM10 PCB exhibits outstanding resistance to creep and cold flow, ensuring long-term stability and reliability.
- Resistant to process chemicals, the PCB minimizes damage risks during fabrication, leading to enhanced durability and extended lifespan.

 

2. Streamlined Production Process:
- The TMM10 PCB eliminates the need for a sodium napthanate treatment prior to electroless plating, simplifying the manufacturing process and saving valuable time.

 

- Based on a thermoset resin, this PCB enables reliable wire-bonding, ensuring secure connections and reducing the risk of failures.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10
Dielectric constant: 9.20 ±0.23
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

2-layer RF PCB TMM10 20mil Thick with Blue Soldermask and Immersion Silver 0

 

Precision Construction:

 

This PCB features a 2-layer rigid design, meticulously engineered to meet the most demanding requirements:
- Board dimensions: 63mm x 45mm, offering a compact yet versatile solution.
- Minimum Trace/Space: 5/5 mils, enabling intricate circuitry and precise signal routing.
- Minimum Hole Size: 0.35mm, facilitating seamless integration of components.
- Finished board thickness: 0.6mm, striking a balance between durability and space constraints.
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring optimal conductivity and signal integrity.
- Via plating thickness: 20 μm, guaranteeing reliable interconnects.
- Surface finish: Immersion Silver, providing excellent solderability and corrosion resistance.
- Top Silkscreen: White, facilitating clear component identification for ease of assembly and inspection.
- Top Solder Mask: Blue, offering effective protection and insulation.
- 100% Electrical test used prior to shipment, ensuring product quality and reliability.

 

Versatile Applications:

 

The TMM10 PCB is ideal for a wide range of applications, including:
- RF and microwave circuitry, guaranteeing precise signal transmission and reception.
- Power amplifiers and combiners, enabling efficient power management and distribution.
- Filters and couplers, facilitating accurate signal manipulation and filtering.
- Satellite communication systems, ensuring seamless and reliable connectivity.
- Global Positioning Systems (GPS) Antennas, providing precise location information.
- Patch Antennas, enabling wireless communication in various scenarios.
- Dielectric polarizers and lenses, enhancing optical performance and functionality.
- Chip testers, offering a reliable platform for efficient testing and validation.

 

2-layer RF PCB TMM10 20mil Thick with Blue Soldermask and Immersion Silver 1

 

Uncompromising Quality and Availability:

 

Our PCB adheres to the stringent IPC-Class-2 quality standard, ensuring the highest level of manufacturing excellence and reliability. We are proud to offer worldwide availability, enabling customers across the globe to access this groundbreaking technology.

 

In conclusion, the TMM10 PCB represents a significant leap forward in RF and microwave applications. With its exceptional features, unrivaled reliability, and versatility, it empowers engineers and designers to unlock new levels of performance and innovation. Trust in the TMM10 PCB to revolutionize your projects and propel you towards unprecedented success.

products
PRODUCTS DETAILS
2-layer RF PCB TMM10 20mil Thick with Blue Soldermask and Immersion Silver
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
TMM10
PCB Size:
63mm X 45 Mm=1PCS, +/- 0.15mm
Copper Weight:
1OZ
Surface Finish:
Immersion Silver
Layer Count:
Double-sided
PCB Thickness:
0.6mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Blue Soldermask RF PCB

,

20mil Thick RF PCB

,

Immersion Silver RF PCB

Product Description

Prepare to witness a new era in RF and microwave circuitry with our groundbreaking TMM10 PCB. Meticulously engineered using Rogers TMM 10 thermoset microwave material, this advanced PCB is poised to revolutionize the industry. Discover the extraordinary features and benefits that set the TMM10 PCB apart, delivering unparalleled performance and setting new standards of excellence.

 

Unmatched Performance:

 

1. Superior Signal Integrity:
- With a Dk of 9.20 +/- .23 at 10GHz, the TMM10 PCB ensures precise and reliable signal propagation, minimizing loss and distortion.
- A dissipation factor of .0022 at 10GHz guarantees exceptional signal fidelity, allowing for high-quality data transmission.
- The thermal coefficient of Dk of -38 ppm/°K enables stable performance across temperature variations, ensuring consistent signal integrity.

 

2. Advanced Thermal Management:
- The TMM10 PCB boasts a thermal coefficient of expansion matched to copper, mitigating thermal stress and enhancing overall reliability.
- With a thermal conductivity of 0.76W/mk, heat dissipation is optimized, preventing performance degradation in demanding applications.
- The impressive Decomposition Temperature (Td) of 425 °C TGA ensures the PCB's resilience even under high-temperature conditions.

 

TMM10 Typical Value
Property   TMM10 Direction Units Condition Test Method
Dielectric Constant,εProcess 9.20±0.23 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.8 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0022 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -38 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 285 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 21 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 21 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 13.62 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.79 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.09 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.74 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

Unrivaled Reliability:

 

1. Exceptional Mechanical Properties:
- The TMM10 PCB exhibits outstanding resistance to creep and cold flow, ensuring long-term stability and reliability.
- Resistant to process chemicals, the PCB minimizes damage risks during fabrication, leading to enhanced durability and extended lifespan.

 

2. Streamlined Production Process:
- The TMM10 PCB eliminates the need for a sodium napthanate treatment prior to electroless plating, simplifying the manufacturing process and saving valuable time.

 

- Based on a thermoset resin, this PCB enables reliable wire-bonding, ensuring secure connections and reducing the risk of failures.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10
Dielectric constant: 9.20 ±0.23
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

2-layer RF PCB TMM10 20mil Thick with Blue Soldermask and Immersion Silver 0

 

Precision Construction:

 

This PCB features a 2-layer rigid design, meticulously engineered to meet the most demanding requirements:
- Board dimensions: 63mm x 45mm, offering a compact yet versatile solution.
- Minimum Trace/Space: 5/5 mils, enabling intricate circuitry and precise signal routing.
- Minimum Hole Size: 0.35mm, facilitating seamless integration of components.
- Finished board thickness: 0.6mm, striking a balance between durability and space constraints.
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring optimal conductivity and signal integrity.
- Via plating thickness: 20 μm, guaranteeing reliable interconnects.
- Surface finish: Immersion Silver, providing excellent solderability and corrosion resistance.
- Top Silkscreen: White, facilitating clear component identification for ease of assembly and inspection.
- Top Solder Mask: Blue, offering effective protection and insulation.
- 100% Electrical test used prior to shipment, ensuring product quality and reliability.

 

Versatile Applications:

 

The TMM10 PCB is ideal for a wide range of applications, including:
- RF and microwave circuitry, guaranteeing precise signal transmission and reception.
- Power amplifiers and combiners, enabling efficient power management and distribution.
- Filters and couplers, facilitating accurate signal manipulation and filtering.
- Satellite communication systems, ensuring seamless and reliable connectivity.
- Global Positioning Systems (GPS) Antennas, providing precise location information.
- Patch Antennas, enabling wireless communication in various scenarios.
- Dielectric polarizers and lenses, enhancing optical performance and functionality.
- Chip testers, offering a reliable platform for efficient testing and validation.

 

2-layer RF PCB TMM10 20mil Thick with Blue Soldermask and Immersion Silver 1

 

Uncompromising Quality and Availability:

 

Our PCB adheres to the stringent IPC-Class-2 quality standard, ensuring the highest level of manufacturing excellence and reliability. We are proud to offer worldwide availability, enabling customers across the globe to access this groundbreaking technology.

 

In conclusion, the TMM10 PCB represents a significant leap forward in RF and microwave applications. With its exceptional features, unrivaled reliability, and versatility, it empowers engineers and designers to unlock new levels of performance and innovation. Trust in the TMM10 PCB to revolutionize your projects and propel you towards unprecedented success.

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