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Product Details:
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| Material: | TMM10 | PCB Size: | 63mm X 45 Mm=1PCS, +/- 0.15mm |
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| Copper Weight: | 1OZ | Surface Finish: | Immersion Silver |
| Layer Count: | Double-sided | PCB Thickness: | 0.6mm |
| High Light: | Blue Soldermask RF PCB,20mil Thick RF PCB,Immersion Silver RF PCB |
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Prepare to witness a new era in RF and microwave circuitry with our groundbreaking TMM10 PCB. Meticulously engineered using Rogers TMM 10 thermoset microwave material, this advanced PCB is poised to revolutionize the industry. Discover the extraordinary features and benefits that set the TMM10 PCB apart, delivering unparalleled performance and setting new standards of excellence.
Unmatched Performance:
1. Superior Signal Integrity:
- With a Dk of 9.20 +/- .23 at 10GHz, the TMM10 PCB ensures precise and reliable signal propagation, minimizing loss and distortion.
- A dissipation factor of .0022 at 10GHz guarantees exceptional signal fidelity, allowing for high-quality data transmission.
- The thermal coefficient of Dk of -38 ppm/°K enables stable performance across temperature variations, ensuring consistent signal integrity.
2. Advanced Thermal Management:
- The TMM10 PCB boasts a thermal coefficient of expansion matched to copper, mitigating thermal stress and enhancing overall reliability.
- With a thermal conductivity of 0.76W/mk, heat dissipation is optimized, preventing performance degradation in demanding applications.
- The impressive Decomposition Temperature (Td) of 425 °C TGA ensures the PCB's resilience even under high-temperature conditions.
| TMM10 Typical Value | ||||||
| Property | TMM10 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 9.20±0.23 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | -38 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 285 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 21 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 21 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.2 | |||||
| Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
Unrivaled Reliability:
1. Exceptional Mechanical Properties:
- The TMM10 PCB exhibits outstanding resistance to creep and cold flow, ensuring long-term stability and reliability.
- Resistant to process chemicals, the PCB minimizes damage risks during fabrication, leading to enhanced durability and extended lifespan.
2. Streamlined Production Process:
- The TMM10 PCB eliminates the need for a sodium napthanate treatment prior to electroless plating, simplifying the manufacturing process and saving valuable time.
- Based on a thermoset resin, this PCB enables reliable wire-bonding, ensuring secure connections and reducing the risk of failures.
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM10 |
| Dielectric constant: | 9.20 ±0.23 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Precision Construction:
This PCB features a 2-layer rigid design, meticulously engineered to meet the most demanding requirements:
- Board dimensions: 63mm x 45mm, offering a compact yet versatile solution.
- Minimum Trace/Space: 5/5 mils, enabling intricate circuitry and precise signal routing.
- Minimum Hole Size: 0.35mm, facilitating seamless integration of components.
- Finished board thickness: 0.6mm, striking a balance between durability and space constraints.
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring optimal conductivity and signal integrity.
- Via plating thickness: 20 μm, guaranteeing reliable interconnects.
- Surface finish: Immersion Silver, providing excellent solderability and corrosion resistance.
- Top Silkscreen: White, facilitating clear component identification for ease of assembly and inspection.
- Top Solder Mask: Blue, offering effective protection and insulation.
- 100% Electrical test used prior to shipment, ensuring product quality and reliability.
Versatile Applications:
The TMM10 PCB is ideal for a wide range of applications, including:
- RF and microwave circuitry, guaranteeing precise signal transmission and reception.
- Power amplifiers and combiners, enabling efficient power management and distribution.
- Filters and couplers, facilitating accurate signal manipulation and filtering.
- Satellite communication systems, ensuring seamless and reliable connectivity.
- Global Positioning Systems (GPS) Antennas, providing precise location information.
- Patch Antennas, enabling wireless communication in various scenarios.
- Dielectric polarizers and lenses, enhancing optical performance and functionality.
- Chip testers, offering a reliable platform for efficient testing and validation.
Uncompromising Quality and Availability:
Our PCB adheres to the stringent IPC-Class-2 quality standard, ensuring the highest level of manufacturing excellence and reliability. We are proud to offer worldwide availability, enabling customers across the globe to access this groundbreaking technology.
In conclusion, the TMM10 PCB represents a significant leap forward in RF and microwave applications. With its exceptional features, unrivaled reliability, and versatility, it empowers engineers and designers to unlock new levels of performance and innovation. Trust in the TMM10 PCB to revolutionize your projects and propel you towards unprecedented success.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
