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0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold

0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold
0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold 0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold

Large Image :  0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TMM3 PCB Size: 51mm X 25 Mm=1PCS, +/- 0.15mm
Copper Weight: 1OZ Surface Finish: Immersion Gold
Layer Count: 2 Layers PCB Thickness: 0.6mm
High Light:

Green Soldermask PCB

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20mil Dual Layer PCB

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0.6mm TMM3 PCB

Introducing our latest shipment of PCBs based on TMM3: the ultimate solution for high-reliability strip-line and micro-strip applications. The Rogers TMM3 thermoset microwave material combines the best features of ceramic and traditional PTFE microwave circuit laminates, all without the need for specialized production techniques. With TMM3 laminates, you can enjoy the benefits of exceptional performance and reliability while avoiding pad lifting or substrate deformation during wire-bonding.

 

The TMM3 substrates offer exceptional performance and reliability. With a dielectric constant (Dk) of 3.27 +/- .032 at 10GHz and a dissipation factor as low as .0020 at 10GHz, these PCBs ensure consistent signal performance and excellent signal integrity. They also feature a thermal coefficient of Dk of 37 ppm/°K for stability across temperature variations and a high decomposition temperature (Td) of 425°C TGA for thermal stability. Additionally, the PCBs have a copper-matched coefficient of thermal expansion and a thermal conductivity of 0.7W/mk for enhanced reliability and efficient heat dissipation. Available in a thickness range of .0015 to .500 inches (+/- .0015”), these PCBs provide versatility to meet various design requirements.

 

Property TMM3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.27±0.032 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 3.45 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +37 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 109 - Mohm.cm - ASTM D257
Surface Resistivity >9x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 441 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 15 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 15 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 23 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 16.53 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.72 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.12
Specific Gravity 1.78 - - A ASTM D792
Specific Heat Capacity 0.87 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

Benefits:

1. Mechanical properties resist creep and cold flow, ensuring long-term stability.
2. Resistant to process chemicals, reducing damage during fabrication.
3. No sodium napthanate treatment required prior to electroless plating.
4. Reliable wire-bonding due to the thermoset resin base.

 

This PCB has specifications supplied to meet diverse needs. It's a 2-layer rigid PCBs with a copper layer thickness of 35 μm on each side. The Rogers TMM3 Core has a thickness of 0.508 mm (20mil), providing structural integrity. These PCBs come in a compact size of 51mm x 25mm (1PCS), with a tolerance of +/- 0.15mm. They offer a minimum Trace/Space of 4/7 mils, allowing for precise circuit design, and a minimum Hole Size of 0.4mm to accommodate various component placements. With a finished board thickness of 0.6mm, a finished Cu weight of 1oz (1.4 mils) on outer layers, and a via plating thickness of 20 μm, these PCBs are optimized for reliable interconnection and optimal conductivity. They feature an immersion gold surface finish, green solder mask on both top and bottom layers, and undergo a 100% electrical test prior to shipment to ensure their quality.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM3
Dielectric constant: 3.27
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

 

0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold 0

 

PCB Statistics:

Supports 15 components.
Total of 26 pads: 17 through-hole pads, 9 top SMT pads.
12 vias and 2 nets for efficient interconnection.
Quality and Availability:

IPC-Class-2 quality standard.
Compatible with Gerber RS-274-X artwork.
Available worldwide for easy access.

 

Typical Applications:

RF and microwave circuitry.
Power amplifiers and combiners.
Filters and couplers.
Satellite communication systems.
Global Positioning Systems (GPS) Antennas.
Patch Antennas.
Dielectric polarizers and lenses.
Chip testers.

 

Experience exceptional performance, reliability, and versatility with our TMM3-based PCBs. Contact us today to elevate your RF, microwave, and power applications.

 

0.6mm TMM3 PCB 20mil Dual Layer Green Soldermask Immersion Gold 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)