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20mil TC350 PCB 2-layer 1oz Copper Via Filled by Resin and Capped

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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20mil TC350 PCB 2-layer 1oz Copper Via Filled by Resin and Capped

20mil TC350 PCB 2-layer 1oz Copper Via Filled by Resin and Capped
20mil TC350 PCB 2-layer 1oz Copper Via Filled by Resin and Capped 20mil TC350 PCB 2-layer 1oz Copper Via Filled by Resin and Capped

Large Image :  20mil TC350 PCB 2-layer 1oz Copper Via Filled by Resin and Capped

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TC350 PCB Size: 68.35mm X 41.4 Mm=1PCS, +/- 0.15mm
Copper Weight: 1OZ Surface Finish: Hot Air Soldering Level (HASL)
Layer Count: 2 Layers PCB Thickness: 0.6mm
High Light:

Capped PCB


Resin Filled PCB


20mil TC350 PCB

Introducing our newly shipped PCB based on TC350 substrates - a cutting-edge solution for high-power applications. The TC350 laminates are designed with advanced materials, including PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. This unique combination offers exceptional performance in terms of low insertion loss, higher thermal conductivity, and superior reliability, allowing for reduced operating temperatures in demanding environments.


With excellent dielectric constant stability across various temperatures, the TC350 laminates are ideal for power amplifier and antenna designers seeking to maximize gain and minimize bandwidth loss. They also provide crucial stability for phase and impedance sensitive devices like network transformers and Wilkinson Power Dividers.


Property Units Value Test Merthod
1. Electrical Properties  
Dielectric Constant (may vary by thickness)      
@1 MHz 3.50 IPC TM-650
@10 GHz 3.50 IPC TM-650
Dissipation Factor      
@1 MHz 0.0015 IPC TM-650
@10 GHz 0.0020 IPC TM-650
Temperature Coefficient of Dielectric    
TC r @ 10 GHz (-40-150°C) ppm/ºC -9 IPC TM-650
Volume Resistivity      
C96/35/90 MΩ-cm 7.4x106 IPC TM-650
E24/125 MΩ-cm 1.4x108  
Surface Resistivity      
C96/35/90 3.2x107 IPC TM-650
E24/125 4.3x108 IPC TM-650
Electrical Strength Volts/mil (kV/mm) 780 (31) IPC TM-650
Dielectric Breakdown kV 40 IPC TM-650 2.5.6
Arc Resistance sec >240 IPC TM-650 2.5.1
2.Thermal Properties  
Decomposition Temperature (Td)      
Initial °C 520 IPC TM-650
5% °C 567 IPC TM-650
T260 min >60 IPC TM-650
T288 min >60 IPC TM-650
T300 min >60 IPC TM-650
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 7, 7 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 12 IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC) % 1.2 IPC TM-650 2.4.24
3. Mechanical Properties  
Peel Strength to Copper (1 oz/35 micron)      
After Thermal Stress lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
At Elevated Temperatures (150ºC) lb/in (N/mm) 9 (1.6) IPC TM-650
After Process Solutions lb/in (N/mm) 7 (1.2) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa)   IPC TM-650
Flexural Strength (Machine/Cross) kpsi (MPa) 14/10 (97/69) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 11/8 (76/55) IPC TM-650
Compressive Modulus kpsi (MPa)   ASTM D-3410
Poisson’s Ratio   ASTM D-3039
4. Physical Properties  
Water Absorption % 0.05 IPC TM-650
Density, ambient 23ºC g/cm3 2.30 ASTM D792 Method A
Thermal Conductivity W/mK 0.72 ASTM D5470
Specific Heat J/gK 0.90 ASTM D5470
Flammability class V0 UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr      
Total Mass Loss % 0.02 NASA SP-R-0022A
Collected Volatiles % 0.01 NASA SP-R-0022A
Water Vapor Recovered % 0.01 NASA SP-R-0022A


This PCB features several notable features and benefits. The TC350 laminates offer a dielectric constant (Dk) of 3.5 at 1MHz, 1.8GHz, and 10GHz, ensuring consistent performance. With a dissipation factor as low as 0.0015 at 1MHz, 0.0018 at 1.8GHz, and 0.002 at 10GHz, signal integrity is maintained even at high frequencies. The laminates exhibit excellent thermal properties, including a low thermal coefficient of Dk, high thermal conductivity of 0.72 W/mk, and a wide temperature range of T260, T288, T300 > 60 minutes. These features contribute to reduced junction temperature, improved reliability, efficient heat dissipation, and enhanced bandwidth utilization for amplifiers and antennas.


This PCB is a 2-layer rigid design with a copper layer thickness of 35 μm on each side. The TC350 core has a thickness of 0.508 mm (20mil). With a finished board thickness of 0.6mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, this PCB offers robust construction while maintaining compactness. The 20 μm via plating thickness, surface finish of Hot Air Soldering Level (HASL), and 0.5mm vias filled by resin and capped ensure reliable electrical connections and structural integrity. The green solder mask on both the top and bottom layers provides protection and a professional finish.


PCB Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
Designation: TC350
Dielectric constant: 3.5±0.05
Thermal Conductivity 0.72 W/m-K
Dissipation Factor Df .002@10 GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.


20mil TC350 PCB 2-layer 1oz Copper Via Filled by Resin and Capped 0


In terms of statistics, this PCB supports the installation of 19 components and offers a total of 48 pads, including 26 through-hole pads and 22 top surface mount technology (SMT) pads. With 25 vias and 3 nets, the PCB facilitates efficient interconnection and flexibility in circuit design. It undergoes a rigorous 100% electrical test before shipment to ensure optimal performance.


This TC350-based PCB adheres to the IPC-Class-2 quality standard and is compatible with Gerber RS-274-X artwork. It is readily available worldwide, making it accessible for various projects and applications. Some typical applications include power amplifiers, filters, couplers, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas sensitive to dielectric drift, and microwave combiners and power dividers.


Experience the advantages of our TC350-based PCB, offering exceptional performance, reliability, and thermal management for your high-power electronic designs.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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