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60.7mil RO4003C LoPro PCB 2-layer Immersion Gold Circuit Board

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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60.7mil RO4003C LoPro PCB 2-layer Immersion Gold Circuit Board

60.7mil RO4003C LoPro PCB 2-layer Immersion Gold Circuit Board
60.7mil RO4003C LoPro PCB 2-layer Immersion Gold Circuit Board 60.7mil RO4003C LoPro PCB 2-layer Immersion Gold Circuit Board

Large Image :  60.7mil RO4003C LoPro PCB 2-layer Immersion Gold Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Layer Count: 2-layer Thickness: 60.7mil
Copper Weight: 1OZ Surface Finish: Immersion Gold
High Light:

Immersion Gold RO4003C LoPro PCB


RO4003C LoPro PCB Circuit Board


60.7mil RO4003C LoPro PCB

Introducing our newly shipped PCB based on RO4003C Low Profile. It's a high-performance laminate designed to deliver exceptional signal integrity and low insertion loss while offering cost-effective circuit fabrication. Utilizing Rogers' proprietary technology, the RO4003C LoPro laminates combine reverse treated foil bonding with the standard RO4003C dielectric, resulting in a laminate with low conductor loss and improved insertion loss. This unique technology maintains all the desirable attributes of the standard RO4003C laminate system. The hydrocarbon ceramic laminates of RO4003C are specifically engineered for superior high-frequency performance and compatibility with standard epoxy/glass (FR-4) processes, eliminating the need for specialized via preparation methods like sodium etch, thereby reducing manufacturing costs.


With a dielectric constant of 3.38+/- 0.05 at 10 GHz/23°C and a dissipation factor of 0.0027 at 10 GHz/23°C, the RO4003C Low Profile PCB ensures accurate and reliable signal transmission. It exhibits excellent thermal properties with a Td> 425°C and a high Tg exceeding 280 °C TMA. The laminate boasts a high thermal conductivity of 0.64 W/mK, efficiently dissipating heat. Its Z-axis coefficient of thermal expansion is low at 46 ppm/°C, while the copper-matched coefficient of thermal expansion ranges from -55 to 288 °C with 11 ppm/°C for the X axis and 14 ppm/°C for the Y axis. Additionally, the PCB is lead-free process compatible, aligning with environmental concerns.

The RO4003C Low Profile PCB brings numerous benefits to your designs. Its lower insertion loss allows for higher operating frequency designs, even surpassing 40 GHz. It reduces passive inter-modulation (PIM) for base station antennas, ensuring optimal performance. The lower conductor loss contributes to improved thermal performance. With its multilayer PCB capability and design flexibility, it accommodates complex circuitry requirements. The PCB can withstand high-temperature processing and is resistant to CAF (Conductive Anodic Filament) formation, ensuring long-term reliability.


Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 Clamped Stripline
Dielectric Constant, Design 3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650
Thermal Coeffifi cient of r 40 z ppm/°C -50°C to 150°C IPC-TM-650
Volume Resistivity 1.7 X 1010   MΩ•cm COND A IPC-TM-650
Surface Resistivity 4.2 X 109   COND A IPC-TM-650
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280   °C TMA A IPC-TM-650
Td 425   °C TGA   ASTM D3850
Thermal Conductivity 0.64   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79   gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-Free Process Compatible Yes        


PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..


This PCB is a 2-layer rigid board with a stackup consisting of a 35 μm copper layer, a 60.7mil (1.542mm) Rogers RO4003C LoPro substrate, and another 35 μm copper layer. It adheres to IPC-Class-2 standards, ensuring high quality and reliability. The board dimensions are 86.6mm x 90.8mm, and each order includes 16 PCBs. The minimum trace/space is 4/4 mils, and the minimum hole size is 0.4mm. The finished board thickness is 1.6mm, with a 1 oz (1.4 mils) outer layer copper weight. The via plating thickness is 20 μm, and the surface finish is immersion gold. The top solder mask is green, while the bottom solder mask is not present. The PCB undergoes a thorough 100% electrical test before shipment, ensuring its performance and reliability.


60.7mil RO4003C LoPro PCB 2-layer Immersion Gold Circuit Board 0


The RO4003C Low Profile PCB is suitable for a wide range of applications. It excels in digital applications such as servers, routers, and high-speed backplanes. It is also ideal for cellular base station antennas and power amplifiers, as well as LNB's (Low-Noise Block Downconverters) for direct broadcast satellites. Additionally, it finds applications in RF Identification Tags and other high-frequency designs.


Choose the RO4003C Low Profile PCB for superior signal integrity, low insertion loss, and cost-effective circuit fabrication. Experience reliable and high-performance circuitry with this advanced PCB material.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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