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25mil RF-60A Immersion Tin PCB Double Sided Customized Circuit Board

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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25mil RF-60A Immersion Tin PCB Double Sided Customized Circuit Board

25mil RF-60A Immersion Tin PCB Double Sided Customized Circuit Board
25mil RF-60A Immersion Tin PCB Double Sided Customized Circuit Board 25mil RF-60A Immersion Tin PCB Double Sided Customized Circuit Board

Large Image :  25mil RF-60A Immersion Tin PCB Double Sided Customized Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: RF-60A PCB Size: 83mm X 65mm
Copper Weight: 1OZ Surface Finish: Immersion Tin
High Light:

Double Sided RF-60A PCB Board


25mil RF-60A PCB Circuit Board


RF-60A Immersion tin PCB Circuit Board

Introducing our newly shipped PCB based on the RF-60A Organic Ceramic Fiberglass Reinforced Laminate. This advanced product boasts a unique composition that offers exceptional electrical properties and low moisture absorption. With its woven fiberglass reinforcement, RF-60A ensures excellent dimensional stability, enhanced flexural strength, and reliable plated-through-hole performance even in extreme thermal environments. This laminate also exhibits remarkable interlaminar bond strength and solder resistance, making it a top choice for various applications.


Taconic, a renowned leader in RF laminates and high-speed digital materials, brings you RF-60A as part of their comprehensive range of high-frequency laminates and prepregs. These cutting-edge materials find application in antennas, multilayer RF and high-speed digital boards, interconnections, and devices, enabling unparalleled performance and connectivity.


- RF-60A offers a dielectric constant (Dk) of 6.15 at 10GHz, ensuring stable performance across frequencies.
- With a dissipation factor of .0028 at 10GHz, this laminate minimizes signal loss and distortion.
- It exhibits a low coefficient of thermal expansion (CTE), with 9 ppm/°C in the x-axis, 8 ppm/°C in the y-axis, and 69 ppm/°C in the z-axis, allowing reliable performance from -30°C to 125°C.
- RF-60A features high thermal conductivity of 0.54 W/mk, facilitating efficient heat dissipation.
- Its high flexural strength of 18300 psi (MD) and 14600 psi (CD) ensures durability and reliability.
- This laminate has a moisture absorption rate of 0.02%, maintaining its performance even in humid conditions.
- RF-60A is compliant with ROHS and WEEE regulations, meeting environmental standards.


RF-60A Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650   6.15   6.15
Df @ 10 GHz IPC-650   0.0038   0.0038
Moisture Absorption IPC-650 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV 53 kV 53
Dielectric Strength ASTM D 149 V/mil 880 kV/mm 35
Volume Resistivity IPC-650 (After Humidity) Mohm/cm 9.0 x 108 Mohm/cm 9.0 x 108
Surface Resistivity IPC-650 (After Humidity) Mohm 2.28 x 108 Mohm 2.28 x 108
Arc Resistance IPC-650 2.5.1 Seconds 193 Seconds 193
Flexural Strength (MD) ASTM D 790 psi 18,300 N/mm2 126.2
Flexural Strength (CD) ASTM D 790 psi 14,600 N/mm2 100.7
Tensile Strength (MD) ASTM D 3039 psi 19,500 N/mm2 134.4
Tensile Strength (CD) ASTM D 3039 psi 16,300 N/mm2 112.4
Young’s Modulus ASTM D 3039 kpsi 1,590 N/mm2 11,000
Poisson’s Ratio ASTM D 3039   0.068 N/mm2 0.068
Compressive Modulus ASTM D 695 (23°C) kpsi 338   2,330
Peel Strength (1 oz. ED) IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) lbs/in 8 N/mm 1.4
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.68 mm/M 0.68
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 1.05 mm/M 1.05
Density (Specific Gravity) ASTM D 792 g/cm3 2.79 g/cm3 2.79
Thermal Conductivity ASTM F 433 W/M*K 0.4 W/M*K 0.4
CTE (X axis) ASTM D 3386 (-30°C - 125°C) ppm/°C 9 ppm/°C 9
CTE (Y axis) ASTM D 3386 (-30°C - 125°C) ppm/°C 8 ppm/°C 8
CTE (Z axis) ASTM D 3386 (-30°C - 125°C) ppm/°C 69 ppm/°C 69
Outgassing (% TML) ASTM E 595* % 0.02 % 0.02
Outgassing (% CVCM) ASTM E 595* % 0.00 % 0.00
Outgassing (% WVR) ASTM E 595* % 0.01 % 0.01
Flammability Rating UL 94   V-0   V-0


- The stability of the dielectric constant (Dk) across frequencies ensures consistent performance in various applications.
- RF-60A offers excellent dimensional stability, ensuring reliable operation and ease of integration.
- Its exceptional interlaminar bond strength guarantees the integrity and durability of the PCB.
- The low Z-axis expansion of RF-60A allows for reliable plated-through-hole connections, even in extreme thermal environments.


This PCB features a 2-layer rigid construction that ensures optimal performance and durability. The stackup consists of copper layers sandwiching the RF-60A core. The first copper layer has a thickness of 35 μm, followed by the RF-60A core, which measures 0.635 mm (25mil) in thickness. Lastly, the second copper layer, also 35 μm thick, completes the stackup. This construction provides a solid foundation for reliable circuit connections and efficient signal transmission.


25mil RF-60A Immersion Tin PCB Double Sided Customized Circuit Board 0


PCB Construction Details:
- Board Dimensions: The PCB measures 83mm x 65mm with a tolerance of +/- 0.15mm, providing a compact and precise form factor.
- Minimum Trace/Space: The PCB supports a minimum trace width and spacing of 6/7 mils, allowing for intricate circuit designs.
- Minimum Hole Size: The PCB accommodates a minimum hole size of 0.4mm, enabling the use of various components.
- No Blind Vias: The design does not include blind vias, simplifying the manufacturing process.
- Finished Board Thickness: The finished PCB has a thickness of 0.71mm, providing a compact and lightweight solution.
- Finished Copper Weight: The outer copper layers have a weight of 1oz (1.4 mils), ensuring optimal conductivity.
- Via Plating Thickness: The via plating thickness is 20 μm, guaranteeing reliable electrical connections.
- Surface Finish: The PCB features an immersion tin surface finish, providing a protective and solderable layer.
- Top Silkscreen: No top silkscreen is applied to the PCB.
- Bottom Silkscreen: No bottom silkscreen is applied to the PCB.
- Top Solder Mask: No top solder mask is applied to the PCB.
- Bottom Solder Mask: No bottom solder mask is applied to the PCB.
- 100% Electrical Test: Each PCB undergoes a comprehensive electrical test before shipment to ensure functionality and quality.


PCB Statistics:
- Components: This PCB contains a total of 17 components, enabling versatile functionality.
- Total Pads: There are 44 pads on this PCB, facilitating component connections.
- Thru Hole Pads: Out of the total pads, 25 are dedicated to through-hole components.
- Top SMT Pads: The remaining 19 pads are for surface mount technology (SMT) components on the top layer.
- Bottom SMT Pads: There are no SMT pads on the bottom layer.
- Vias:it includes 23 vias for interconnection purposes.
- Nets: it contains 4 nets, representing interconnected paths between components.


PCB Material: Organic-ceramic Woven Fiberglass Reinforced Laminates
Designation: RF-60A
Dielectric constant: 6.15 ±0.25
Dissipation Factor DF 0.0038@10 GHz
Thermal Conductivity 0.4 W/MK
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm), 50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..


Additional Information:
This PCB artwork supplied is in Gerber RS-274-X format, ensuring compatibility and accuracy during production. Our quality standard adheres to IPC-Class-2 specifications, guaranteeing reliable performance and manufacturing excellence. The RF-60A PCB is available worldwide, enabling easy access forcustomers around the globe.


Typical Applications:

The RF-60A PCB finds its application in various areas, including:

- Power Amplifiers: It provides a reliable platform for power amplification circuits, ensuring efficient and stable signal amplification.

- Filters & Couplers: The PCB enables the implementation of filters and couplers, ensuring precise signal manipulation and control.

- Passive Components: It accommodates passive components, such as resistors and capacitors, enabling their integration into the circuitry.

- Antennas: The RF-60A PCB supports the creation of high-performance antennas, facilitating wireless communication and connectivity.


With its exceptional properties and reliable construction, the RF-60A PCB offers a versatile and high-quality solution for a wide range of applications.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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