0.8mm TU-768 High Tg PCB Board Black Soldermask White Silkscreen ENIG

Sharing a new RF PCB made of TU-768 material. The TU-768 laminate by Taiwan Union is a high-Tg (glass transition temperature) and high thermal reliability laminate designed to meet rigorous performance requirements. It is accompanied by TU-768P, a matching prepreg for enhanced functionality. These laminates and prepregs are constructed using high-quality woven E-glass coated with an epoxy resin system, offering UV-block characteristics and compatibility with automated optical inspection (AOI) processes. The TU-768 series is well-suited for applications that demand resilience against thermal cycles and extensive assembly work. Notably, TU-768 laminates exhibit exceptional CTE (coefficient of thermal expansion), superior chemical resistance, thermal stability, and CAF (conductive anodic filament) resistance properties.

Key Features:
- Dk (dielectric constant) of 4.3 at 10GHz
- Dissipation factor of .0023 at 10GHz
- CTE x-axis of 11-15 ppm/°C, CTE y-axis of 11-15 ppm/°C
- Coefficient of thermal expansion matched to copper
- Decomposition Temperature (Td) of 350 °C TGA
- Tg (glass transition temperature) of 180°C
- High thermal reliability with T260 >60 min, T288>15 min, T300 >2 min

Benefits:
- Compatible with lead-free processes
- Excellent coefficient of thermal expansion for stability
- Anti-CAF (conductive anodic filament) property for improved reliability
- Superior chemical and thermal resistance
- Fluorescent properties enable AOI (automated optical inspection)
- Resistant to moisture-related issues

PCB Stackup:
This PCB is a 2-layer rigid PCB design with the following specifications:
- Copper_layer_1: 35 μm
- TU-768 Core: 0.76 mm
- Copper_layer_2: 35 μm

PCB Construction Details:
- Board dimensions: 47.8mm x 47.8mm (1PCS), with a tolerance of +/- 0.15mm
- Minimum Trace/Space: 4/4 mils, allowing for precise circuitry
- Minimum Hole Size: 0.2mm, providing flexibility for component placement
- No blind vias, simplifying the manufacturing process
- Finished board thickness: 0.8mm, balancing durability and compactness
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring efficient conduction
- Via plating thickness: 20 μm, enabling reliable interconnectivity
- Surface finish: Immersion Gold, for protection and improved conductivity
- Top Silkscreen: White, facilitating component identification
- Bottom Silkscreen: None, for a clean and minimalistic appearance
- Top Solder Mask: Black, enhancing soldering and protection
- Bottom Solder Mask: None, for a simplified PCB design
- Each PCB undergoes a 100% electrical test prior to shipment, ensuring quality and functionality

PCB Statistics:
- Components: 11, providing versatility for various applications
- Total Pads: 24, facilitating component connectivity
- Thru Hole Pads: 15, enabling secure connections
- Top SMT Pads: 9, supporting surface mount technology (SMT) components
- Bottom SMT Pads: 0, indicating single-sided SMT assembly
- Vias: 7, allowing for efficient signal routing
- Nets: 2, ensuring proper connectivity

Artwork Supplied:
This PCB artwork is provided in Gerber RS-274-X format, a widely used industry standard for PCB manufacturing. This format ensures compatibility and accuracy during the fabrication process.

Quality Standard and Availability:
The PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality manufacturing and reliability. It is available for purchase worldwide, making it accessible to customers globally.

Typical Applications:

The TU-768 PCB is widely applicable in various fields, including:
- Consumer Electronics
- Servers and workstations
- Automotive industry

With its high-Tg and thermal reliability features, the TU-768 PCB is an excellent choice for demanding electronic applications that require exceptional performance and durability.