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0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG

0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG
0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG 0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG 0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG

Large Image :  0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: High-Tg And High Thermal Reliability Epoxy Resin DK: 4.3
Thickness: 0.8mm Surface Finish: ENIG

Sharing a new RF PCB made of TU-768 material. The TU-768 laminate by Taiwan Union is a high-Tg (glass transition temperature) and high thermal reliability laminate designed to meet rigorous performance requirements. It is accompanied by TU-768P, a matching prepreg for enhanced functionality. These laminates and prepregs are constructed using high-quality woven E-glass coated with an epoxy resin system, offering UV-block characteristics and compatibility with automated optical inspection (AOI) processes. The TU-768 series is well-suited for applications that demand resilience against thermal cycles and extensive assembly work. Notably, TU-768 laminates exhibit exceptional CTE (coefficient of thermal expansion), superior chemical resistance, thermal stability, and CAF (conductive anodic filament) resistance properties.

 

Key Features:
- Dk (dielectric constant) of 4.3 at 10GHz
- Dissipation factor of .0023 at 10GHz
- CTE x-axis of 11-15 ppm/°C, CTE y-axis of 11-15 ppm/°C
- Coefficient of thermal expansion matched to copper
- Decomposition Temperature (Td) of 350 °C TGA
- Tg (glass transition temperature) of 180°C
- High thermal reliability with T260 >60 min, T288>15 min, T300 >2 min

 

Benefits:
- Compatible with lead-free processes
- Excellent coefficient of thermal expansion for stability
- Anti-CAF (conductive anodic filament) property for improved reliability
- Superior chemical and thermal resistance
- Fluorescent properties enable AOI (automated optical inspection)
- Resistant to moisture-related issues

 

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 190°C    
Tg (DSC) 180°C   > 170°C
Tg (TMA) 170°C E-2/105  
Td (TGA) 350°C   > 340°C
CTE x-axis 11~15 ppm/°C   N/A
CTE y-axis 11~15 ppm/°C E-2/105 N/A
CTE z-axis 2.70%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 > 60 min   > 30 min
T288 > 20 min E-2/105 > 15 min
T300 > 2 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 4.3    
Loss Tangent (RC 50%) @10GHz 0.018    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 4.4 / 4.3   < 5.2
5GHz (SPC method) 4.3 E-2/105 N/A
10GHz (SPC method) 4.3   N/A
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.019 /0.018   < 0.035
5GHz (SPC method) 0.021 E-2/105 N/A
10GHz (SPC method) 0.023   N/A
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 KV/mm
Dielectric Breakdown > 50 kV A > 40 KV
Mechanical      
Young’s Modulus      
Warp Direction 25 GPa A N/A
Fill Direction 22 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 7~9 lb/in A > 4 lb/in
Water Absorption 0.18% E-1/105+D-24/23 < 0.8 %

 

PCB Stackup:
This PCB is a 2-layer rigid PCB design with the following specifications:
- Copper_layer_1: 35 μm
- TU-768 Core: 0.76 mm
- Copper_layer_2: 35 μm

 

PCB Construction Details:
- Board dimensions: 47.8mm x 47.8mm (1PCS), with a tolerance of +/- 0.15mm
- Minimum Trace/Space: 4/4 mils, allowing for precise circuitry
- Minimum Hole Size: 0.2mm, providing flexibility for component placement
- No blind vias, simplifying the manufacturing process
- Finished board thickness: 0.8mm, balancing durability and compactness
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring efficient conduction
- Via plating thickness: 20 μm, enabling reliable interconnectivity
- Surface finish: Immersion Gold, for protection and improved conductivity
- Top Silkscreen: White, facilitating component identification
- Bottom Silkscreen: None, for a clean and minimalistic appearance
- Top Solder Mask: Black, enhancing soldering and protection
- Bottom Solder Mask: None, for a simplified PCB design
- Each PCB undergoes a 100% electrical test prior to shipment, ensuring quality and functionality

 

PCB Statistics:
- Components: 11, providing versatility for various applications
- Total Pads: 24, facilitating component connectivity
- Thru Hole Pads: 15, enabling secure connections
- Top SMT Pads: 9, supporting surface mount technology (SMT) components
- Bottom SMT Pads: 0, indicating single-sided SMT assembly
- Vias: 7, allowing for efficient signal routing
- Nets: 2, ensuring proper connectivity

 

PCB Material: High-Tg and High Thermal Reliability Epoxy Resin
Designation: TU-768
Dielectric constant: 4.3
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG 0

 

Artwork Supplied:
This PCB artwork is provided in Gerber RS-274-X format, a widely used industry standard for PCB manufacturing. This format ensures compatibility and accuracy during the fabrication process.

 

Quality Standard and Availability:
The PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality manufacturing and reliability. It is available for purchase worldwide, making it accessible to customers globally.

 

Typical Applications:

The TU-768 PCB is widely applicable in various fields, including:
- Consumer Electronics
- Servers and workstations
- Automotive industry

 

With its high-Tg and thermal reliability features, the TU-768 PCB is an excellent choice for demanding electronic applications that require exceptional performance and durability.

 

0.8mm TU-768 High Tg PCB Black Soldermask White Silkscreen ENIG 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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