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2-layer RF PCB Based on 20mil TMM10i Immersion Gold with 1OZ Copper

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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2-layer RF PCB Based on 20mil TMM10i Immersion Gold with 1OZ Copper

2-layer RF PCB Based on 20mil TMM10i Immersion Gold with 1OZ Copper
2-layer RF PCB Based on 20mil TMM10i Immersion Gold with 1OZ Copper 2-layer RF PCB Based on 20mil TMM10i Immersion Gold with 1OZ Copper

Large Image :  2-layer RF PCB Based on 20mil TMM10i Immersion Gold with 1OZ Copper

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TMM10i Thickness: 20mil
Surface Finish: Immersion Gold Solder Mask: Green

Introducing the RF PCB built on 20mil TMM10i laminates. The TMM10i material is an outstanding choice for high-performance strip-line and micro-strip applications, offering reliability and precision. Engineered with Rogers TMM 10i isotropic thermoset microwave material, this ceramic thermoset polymer composite combines the best features of ceramic and PTFE substrates while enabling flexible processing techniques.

 

Key Features:

Isotropic dielectric constant (Dk) for consistent performance
Low dissipation factor of .0020 at 10GHz
Thermal coefficient of Dk (-43 ppm/°K) matched to copper
High decomposition temperature (Td) of 425 °C TGA
Excellent thermal conductivity of 0.76W/mk
Thickness range: .0015 to .500 inches (+/- .0015”)

 

Benefits:

Superior resistance to creep and cold flow for enhanced mechanical properties
Exceptional resistance to process chemicals, minimizing damage during fabrication
Sodium napthanate treatment not required prior to electroless plating
Reliable wire-bonding facilitated by the thermoset resin composition.

 

TMM10i Typical Value
Property TMM10i Direction Units Condition Test Method
Dielectric Constant,εProcess 9.80±0.245 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.9 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -43 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 267 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.8 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.72 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

PCB Stackup:

This PCB stackup consists of a 2-layer rigid PCB design. It features copper_layer_1 with a thickness of 35 μm, a Rogers TMM10i Core measuring 0.508 mm (20mil) in thickness, and copper_layer_2 with a thickness of 35 μm. This stackup ensures structural integrity and optimal performance for the PCB.

 

PCB Construction Details:

This PCB has a compact size, with board dimensions measuring 60mm x 70 mm (+/- 0.15mm). It supports precise circuitry with a minimum trace/space requirement of 8/8 mils, allowing for intricate designs. The minimum hole size is 0.3mm, providing flexibility for component placement.

The finished board thickness is 0.6mm, ensuring a slim profile while maintaining durability. The outer layers have a copper weight of 1oz (1.4 mils), allowing for efficient conduction. The via plating thickness is 20 μm, enabling reliable interconnectivity.

 

To protect the PCB and enhance its performance, the surface finish is Immersion Gold. However, there is no top or bottom silkscreen or solder mask, allowing for a clean and minimalistic appearance. Each PCB undergoes a thorough 100% electrical test before shipment to ensure quality and functionality.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10i
Dielectric constant: 9.80 ±0.245
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..

 

2-layer RF PCB Based on 20mil TMM10i Immersion Gold with 1OZ Copper 0

 

PCB Statistics:

This PCB consists of 8 components, providing versatility for various applications. It features a total of 18 pads, including 11 thru-hole pads and 7 top surface mount technology (SMT) pads. There are no bottom SMT pads present. Additionally, the PCB has 9 vias and 2 nets, allowing for efficient signal routing and connectivity.

 

Artwork Supplied:

The artwork for this PCB is provided in Gerber RS-274-X format, a widely used industry standard for PCB manufacturing. This format ensures compatibility and accuracy during the fabrication process.

 

Quality Standard and Availability:

This PCB adheres to the IPC-Class-2 quality standard, ensuring high-quality manufacturing and reliability. It is available for purchase worldwide, making it accessible to customers globally.

 

Applications:

The TMM10i PCB finds application in various fields, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers

 

With its superior performance and compatibility, the TMM10i PCB is suitable for a wide range of high-frequency electronic applications, empowering engineers and designers to achieve optimal results.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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