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20mil RO4730G3 High Frequency Circuit Board ENEPIG Cost-Effective PCB

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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20mil RO4730G3 High Frequency Circuit Board ENEPIG Cost-Effective PCB

20mil RO4730G3 High Frequency Circuit Board ENEPIG Cost-Effective PCB
20mil RO4730G3 High Frequency Circuit Board ENEPIG Cost-Effective PCB 20mil RO4730G3 High Frequency Circuit Board ENEPIG Cost-Effective PCB

Large Image :  20mil RO4730G3 High Frequency Circuit Board ENEPIG Cost-Effective PCB

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

20mil PCB Frequency Circuit Board


ENEPIG Frequency Circuit Board


RO4730G3 Circuit Board

Introducing our newly shipped PCB which based on RO4730G3 substrates. RO4730G3 by Rogers is a cutting-edge hydrocarbon/ceramic/woven glass UL 94 V-0 antenna grade laminate, designed to provide exceptional performance while offering a low-cost alternative to traditional PTFE-based laminates. With its advanced resin systems, RO4730G3 delivers the necessary properties required for ideal antenna performance, making it a go-to choice for designers seeking to optimize both cost and functionality.


Key Features of RO4730G3:


1. Impressive Electrical Properties:
- Dielectric Constant (Dk) of 3.0 +/- 0.05 at 10GHz: Ensures reliable signal transmission and reception.
- Dissipation Factor of 0.0028 at 10GHz: Results in low signal loss and reduced interference.
- Thermal Coefficient of Dk of 34 ppm/°C: Enables consistent performance across temperature variations.
- Coefficient of Thermal Expansion (CTE) matched to copper: Minimizes stress and ensures PCB integrity.
- Tg (Glass Transition Temperature) of >280 °C: Offers excellent thermal stability and reliability.
- Decomposition Temperature (Td) of 411 °C TGA: Ensures high-temperature resistance.


2. Benefits That Set RO4730G3 Apart:
- Low Loss Dielectric with Low Profile Foil:
* Reduced PIM (Passive Intermodulation)
* Low insertion loss for optimized signal integrity.

- Unique Filler/Closed Microspheres:
* Lightweight: 30% lighter than PTFE/Glass materials, enabling weight-optimized designs.
* Low density for enhanced performance.

- Low Z-Axis CTE (<30 ppm/°C) and High Tg (>280°C):
* Design flexibility and compatibility with automated assembly processes.

- Low TCDk (<40 ppm/°C):
* Consistent circuit performance under varying temperature conditions.

- Specially Formulated Thermoset Resin System/Filler:
* Ease of fabrication and PTH (Plated Through-Hole) process capability.

- Environmentally Friendly:
* Lead-free process compatibility and RoHS compliance.


3. PCB Construction Details:
- 2-layer rigid PCB with a copper layer thickness of 35 μm.
- RO4730G3 core thickness of 0.508 mm (20mil).
- Finished board thickness of 0.6mm.
- 1oz (1.4 mils) outer layer copper weight.
- Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) surface finish.
- Green solder mask on both top and bottom layers.
- No silkscreen for a clean and minimalistic look.
- Via plating thickness of 20 μm.
- Minimum trace/space of 4/6 mils.
- Minimum hole size of 0.25mm.
- 100% electrical testing conducted prior to shipment.


RO4730G3 Typical Value
Property RO4730G3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.5 Z   10 GHz 23℃ IPC-TM-650
Dielectric Constant,εDesign 2.98 Z   1.7 GHz to 5 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0028 Z   10 GHz 23℃ IPC-TM-650
  2.5 GHz
Thermal Coefficient of ε +34 Z ppm/℃ -50 ℃to 150℃ IPC-TM-650
Dimensional Stability <0.4 X, Y mm/m after etech +E2/150 ℃ IPC-TM-650 2.4.39A
Volume Resistivity (0.030") 9 X 107   MΩ.cm COND A IPC-TM-650
Surface Resistivity (0.030") 7.2 X 105   COND A IPC-TM-650
PIM -165   dBc 50 ohm 0.060" 43 dBm 1900 MHz
Electrical Strength (0.030") 730 Z V/mil   IPC-TM-650
Flexural Strength MD 181 (26.3)   Mpa (kpsi) RT ASTM D790
CMD 139 (20.2)  
Moisure Absorption 0.093 - % 48/50 IPC-TM-650 ASTM D570
Thermal Conductivity 0.45 Z W/mK 50℃ ASTM D5470
Coefficient of Thermal Expansion 15.9
ppm/℃ -50 ℃to 288℃ IPC-TM-650
Tg >280     IPC-TM-650 2.4.24
Td 411     ASTM D3850
Density 1.58   gm/cm3   ASTM D792
Copper Peel Stength 4.1   pli 1oz,LoPro EDC IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


4. PCB Statistics:
- Components: 29
- Total Pads: 38
- Thru Hole Pads: 22
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 17
- Nets: 6


5. Quality Standard, Artwork, and Availability:
- Quality Standard: IPC-Class-2, ensuring high manufacturing standards.
- Artwork Supplied: Gerber RS-274-X, facilitating accurate reproduction.
- Availability: RO4730G3 is available worldwide, providing easy access for PCB manufacturers and designers.


PCB Material: Hydrocarbon ceramic woven glass
Designator: RO4730G3
Dielectric constant: 3.0 ±0.05 (process)
2.98 (design)
Layer count: 1 Layer, 2 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm)
Laminate thickness(low profile copper): 5.7mil(0.145mm), 10.7mil(0.272mm), 20.7mil(0.526mm, 30.7mil(0.780mm), 60.7mil(1.542mm)
Laminate thickness(ED Copper) 20mil(0.508mm), 30mil(0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, Immersion silver, OSP,etc.


20mil RO4730G3 High Frequency Circuit Board ENEPIG Cost-Effective PCB 0


6. Typical Applications:
- Cellular Base Station Antennas: RO4730G3's superior electrical properties make it an ideal choice for base station antennas, ensuring reliable communication in cellular networks.


In conclusion, Rogers RO4730G3 PCBs offer a reliable, cost-effective, and high-performance solution for antenna applications. With its exceptional electrical properties, design flexibility, and environmentally friendly features, RO4730G3 empowers designers to achieve optimal antenna performance while optimizing costs. Whether you're building cellular base station antennas or any other RF application, RO4730G3 is the go-to PCB material for superior results.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)