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Multilayer Hybrid PCB on 0.305mm RO4003C and High Tg FR4 Substrate with ENIG

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Multilayer Hybrid PCB on 0.305mm RO4003C and High Tg FR4 Substrate with ENIG

Multilayer Hybrid PCB on 0.305mm RO4003C and High Tg FR4 Substrate with ENIG
Multilayer Hybrid PCB on 0.305mm RO4003C and High Tg FR4 Substrate with ENIG Multilayer Hybrid PCB on 0.305mm RO4003C and High Tg FR4 Substrate with ENIG

Large Image :  Multilayer Hybrid PCB on 0.305mm RO4003C and High Tg FR4 Substrate with ENIG

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

ENIG Multilayer Hybrid PCB


0.305mm RO4003C Multilayer Hybrid PCB


FR4 Multilayer Hybrid PCB

Introducing our newly shipped PCB, a high-quality product that combines the exceptional performance of RO4003C and FR-4 (IT-180A) materials. This 6-layer rigid PCB is designed to meet the stringent requirements of various applications, providing reliable and efficient performance. Let's delve into the details of this advanced PCB:


1. RO4003C Profile:
The PCB utilizes the Rogers RO4003C Hydrocarbon Ceramic woven glass material. With a Dielectric Constant (Dk) of 3.38 at 10 GHz and a Dissipation Factor of 0.0027 at 10 GHz, it ensures reliable signal integrity in high-frequency applications. The RO4003C material has a Tg (Glass Transition Temperature) greater than 280 °C and a Td (Thermal Decomposition Temperature) greater than 425°C, ensuring excellent thermal stability.


1.2 FR-4 (IT-180A) Profile:
This hybrid PCB also incorporates the IT-180A FR-4 material by ITEQ. This high-Tg (175℃ by DSC) material offers low CTE (Coefficient of Thermal Expansion) and high thermal reliability. With a Dielectric Constant (Dk) of 4.4 at 1 GHz and a Dissipation Factor of 0.015 at 1 GHz, it provides reliable electrical performance. The IT-180A material has a Tg greater than 175 °C, ensuring stability under high-temperature conditions. It also exhibits excellent CAF (Conductive Anodic Filament) resistance, lead-free compatibility, and exceptional mechanical processability.


2. Features and Attentions:
The RO4003C laminates offer tight control on dielectric constant (Dk) and low loss, providing excellent signal integrity. They are cost-effective compared to conventional microwave laminates and utilize the same processing method as standard epoxy/glass laminates. However, it's important to note that RO4003C materials are non-brominated and are not UL 94 V-0 rated. The IT-180A material, on the other hand, offers exceptional CAF resistance, lead-free compatibility, and through-hole reliability. It also exhibits high heat resistance and excellent mechanical processability.


RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
Z   10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650
Surface Resistivity 4.2 x 109   COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 19,650(2,850)
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
MPa(ksi) RT ASTM D 638
Flexural Strength 276
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        


3. Stackup:
This 6-layer rigid PCB features a well-designed stackup for optimal performance. The copper layers are 35 μm (1oz) thick on both sides. The PCB consists of two Rogers 4003C cores, each with a thickness of 12mil (0.305mm), and a core IT-180A FR-4 layer. Prepreg layers with a thickness of 0.1mm are used for insulation between copper layers.


4. Construction Details:
The board dimensions of this PCB are 57mm x 57mm, providing a compact and efficient form factor. The minimum trace/space is 4/5 mils, allowing for precise routing of high-density circuits. The minimum hole size is 0.3mm, and all vias are filled and capped for enhanced reliability. The finished board thickness is 1.1mm, with a finished copper weight of 1oz (1.4 mils) on each layer. The via plating thickness is 25 μm, ensuring strong and reliable electrical connections. The surface finish is Immersion Gold (ENIG), providing excellent solderability and corrosion resistance. The PCB features white top and bottom silkscreens, as well as a Matt Blue top and bottom solder mask. The top traces are designed to have a 7 mil width, with a single-end impedance controlled at 90 ohms. Each PCB undergoes a 100% electrical test prior to shipment to ensure quality and reliability.


Multilayer Hybrid PCB on 0.305mm RO4003C and High Tg FR4 Substrate with ENIG 0


5. PCB Statistics:
This PCB includes a total of 28 components and 68 pads. It comprises 32 thru-hole pads, 21 top SMT pads, and 15 bottom SMT pads. There are 73 vias and 6 nets, enabling efficient electrical connections.


6. Artwork and Quality Standard:
The artwork supplied for this circuit baord is in Gerber RS-274-X format, ensuring compatibility with standard PCB manufacturing processes. The PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality manufacturing and reliability.


7. Availability:
This hybrid PCB is available worldwide, ensuring engineers and designers from various regions can access this high-performance and reliable product.


8. Typical Applications:
This PCB is suitable for a wide range of applications due to its excellent performance characteristics. Some typical applications include Cellular Base Station Antennas and Power Amplifiers, RF Identification Tags, Automotive Radar and Sensors, and LNB's (Low Noise Block) for Direct Broadcast Satellites. Its reliable signal transmission, thermal stability, and mechanical processability make it an ideal choice for demanding electronic systems.


In summary, our newly shipped PCB combines the advantages of RO4003C and FR-4 (IT-180A) materials to deliver exceptional performance, reliability, and thermal stability. With its advanced features, precise construction, and adherenceto industry standards, this PCB is well-suited for a variety of applications. Whether you're working on cellular base stations, RF identification systems, automotive radar, or satellite receivers, this PCB provides the reliability and efficiency you need. Order now and experience the high-performance capabilities of our RO4003C and FR-4 (IT-180A) PCB. Available worldwide, it's the perfect choice for your advanced electronic projects.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)