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Highlight: | Immersion Tin RF PCB,62mil CER-10 RF PCB,Black Soldermask RF PCB |
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Introducing the high frequency PCB which built on CER-10 laminates. The CER-10 is an organic-ceramic laminate in the ORCER family of Taconic products, featuring a woven glass reinforcement. It combines Taconic's expertise in ceramic fill technology and coated PTFE fiberglass to deliver exceptional interlaminar bond strength and solder resistance. The proprietary composition of CER-10 ensures low moisture absorption and uniform electrical properties. With its woven glass reinforcement, CER-10 offers excellent dimensional stability and enhanced flexural strength, making it reliable even in extreme thermal environments.
The CER-10 material boasts impressive features. It has a Dk of 10 at 10GHz, ensuring reliable signal integrity in high-frequency applications. The dissipation factor is as low as .0035 at 10GHz, minimizing signal loss. The coefficient of thermal expansion (CTE) is carefully matched to copper, enabling plated-through-hole reliability in the face of extreme thermal environments. With a thermal conductivity of 0.63 W/mk, the CER-10 substrate efficiently dissipates heat, contributing to effective thermal management. Its moisture absorption is as low as 0.02%, enhancing dimensional stability and reducing the risk of warping or distortion. The dielectric breakdown of 44 kV ensures robust insulation capabilities.
The CER-10 laminate also offers several benefits. It exhibits exceptional interlaminar bond strength and solder resistance, guaranteeing the durability and reliability of the PCB. The low moisture absorption enhances dimensional stability, reducing the risk of warping or distortion during manufacturing and in various operating conditions. The low Z-axis expansion of CER-10 (CTE 46 ppm/°C) ensures reliable plated-through-hole connections, even in environments with rapid temperature changes. The stable DK over frequency allows for precise control of impedance and optimal signal propagation. Additionally, the CER-10 PCB enables circuit miniaturization due to its enhanced dimensional stability and increased flexural strength.
Property | Test Method | Unit | Value | Unit | Value |
Dielectric Constant (Nominal) | IPC-TM-650 2.5.5.6 | 10 | 10 | ||
Dissipation Factor 10 GHz | IPC-TM-650 2.5.5.5.1 | 0.0035 | 0.0035 | ||
Moisture Absorption | IPC-TM-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Dielectric Breakdown | IPC-TM-650 2.5.6 | kV | 44 | kV | 44 |
Volume Resistivity | IPC-TM-650 2.5.17.1 | Mohm/cm | 2.1 x 108 | Mohm/cm | 2.1 x 108 |
Surface Resistivity | IPC-TM-650 2.5.17.1 | Mohm | 1.1 x 109 | Mohm | 1.1 x 109 |
Arc Resistance | IPC-TM-650 2.5.1 | Seconds | >180 | Seconds | >180 |
Flexural Strength (MD) | ASTM D 790 | psi | 16500 | N/mm2 | 114 |
Flexural Strength (CD) | ASTM D 790 | psi | 15500 | N/mm2 | 107 |
Tensile Strength (MD) | ASTM D 638 | psi | 7700 | N/mm2 | 53 |
Tensile Strength (CD) | ASTM D 3039 | psi | 6700 | N/mm2 | 46 |
Peel Strength (1 oz. ED) | IPC-TM-650 2.4.8 | lbs/linear inch | 9 | N/mm | 1.61 |
Dimensional Stability (MD) | IPC-TM-650 2.4.39 | in/in | -0.0002 | mm/mm | -0.0002 |
Dimensional Stability (CD) | IPC-TM-650 2.4.39 | in/in | -0.0003 | mm/mm | -0.0003 |
Density (Specific Gravity) | g/cm3 | 3.05 | g/cm3 | 3.05 | |
Thermal Conductivity | ASTM F 433 | W/m/K | 0.63 | W/m/K | 0.63 |
CTE (x-y) | ASTM D 3386 (TMA) | ppm/℃ | 13-15 | ppm/℃ | 13-15 |
CTE (z) | ASTM D 3386 (TMA) | ppm/℃ | 46 | ppm/℃ | 46 |
Outgassing (%TML) | ASTM E 595 | % | 0.02 | % | 0.02 |
Outgassing (%CVCM) | ASTM E 595 | % | 0.01 | % | 0.01 |
Outgassing (%WVR) | ASTM E 595 | % | 0.01 | % | 0.01 |
The stackup of this PCB consists of a 2-layer rigid PCB with copper layers of 35 μm thickness on both sides. The CER-10 core has a thickness of 1.575 mm (62mil), providing structural integrity and optimal performance.
In terms of construction details, this PCB has a board dimension of 73.2mm x 36.44mm, with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 5/5 mils and a minimum hole size of 0.4mm. The finished board thickness is 1.65mm, with a finished Cu weight of 1oz (1.4 mils) on the outer layers. Via plating has a thickness of 20 μm. The surface finish is immersion tin, providing excellent solderability. The top silkscreen is black, adding clear labeling and identification to the PCB. There is no bottom silkscreen or solder mask. Prior to shipment, each PCB undergoes a 100% electrical test for quality assurance.
This PCB statistics include 14 components, totaling 28 pads. Among them, there are 17 thru-hole pads and 11 top SMT pads. The bottom SMT pads are not present. The PCB features 16 vias and 2 nets, enabling efficient electrical connections.
PCB Material: | Organic-ceramic Laminate based on Woven Glass Reinforcement. |
Designation: | CER-10 |
Dielectric constant: | 10 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 25mil (0.635mm), 30mil(0.762mm), 47mil(1.194mm), 50mil (1.27mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG,Immersion Silver, Immersion Tin and OSP etc.. |
The artwork supplied for this PCB is Gerber RS-274-X, a widely recognized format in the industry. The quality standard adhered to is IPC-Class-2, ensuring high-quality manufacturing processes and reliability. The CER-10 PCB is available worldwide, providing engineers and designers with a reliable and high-performance solution.
The CER-10 Organic-Ceramic Laminate PCB finds application in various industries. It is well-suited for power amplifiers, benefiting from its stability, low Z-axis expansion, and efficient signal transmission. Filters and couplers also benefit from the high-frequency performance and low loss characteristics of CER-10, ensuring optimal operation in communication systems. Additionally, the CER-10 PCB supports the integration of passive components, leveraging exceptional interlaminar bond strength and dimensional stability for reliable performance.
The CER-10 laminate sets a new standard in performance and reliability. With its advanced features, benefits, and adherence to quality standards, it empowers engineers to create cutting-edge electronic devices for a wide range of applications globally.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848