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Ceramic-Filled PTFE Laminates High Frequency RF PCB Board 2 Layers RO3003G2

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Ceramic-Filled PTFE Laminates High Frequency RF PCB Board 2 Layers RO3003G2

MOQ:	1PCS
Price:	USD9.99-99.99/PCS
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

PCB Material:

RO3003G2

Layer Count:

2 Layers

Dielectric Constant:

Dissipation Factor:

0.0011

PCB Size:

≤400mm X 500mm

Copper Weight:

1oz (35µm), 2oz (70µm)

Highlight:

Ceramic-Filled PTFE Laminates PCB Board

PCB Board RO3003G2

2 Layers High Frequency PCB

Product Description

Material Introduction

The high-frequency, ceramic-filled PTFE laminates of Rogers RO3003G2 are an extension of Rogers' industry-leading RO3003 solutions. The development of RO3003G2 laminates is based on industry feedback, with a special focus on addressing the next generation needs for millimeter wave automotive radar applications.

The incorporation of an optimized resin and filler content, along with the utilization of Very Low Profile ED copper provides a reduced insertion loss. This characteristic makes RO3003G2 laminates well-suited for implementation in Advanced Driver Assistance Systems (ADAS) such as adaptive cruise control, forward collision warning, active braking, and lane change assist.

Features

1. The dielectric constant of 3.00 at 10 GHz and 3.07 at 77 GHz.

2. Very Low Profile (VLP) ED copper.

3. Homogeneous construction incorporating VLP ED copper and reduced dielectric porosity.

4. Enhanced filler system.

Benefits

1. Best-in-class performance for insertion loss.

2. Minimize variation in dielectric constant in the finished PCB.

3. Enable the trend towards using smaller diameter vias; Enhanced filler system using small rounded particles

4. Global manufacturing footprint.

Ceramic-Filled PTFE Laminates High Frequency RF PCB Board 2 Layers RO3003G2 0

Our PCB Capability (RO3003G2 laminates)

PCB Material:	Ceramic-filled PTFE Laminates
Designation:	RO3003G2
Dielectric constant:	3
Dissipation factor	0.0011
Layer count:	Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness	5mil (0.127mm), 10mil (0.254mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

Typical Applications

1. Adaptive cruise control

2. Forward collision warning

3. Active brake assist

4. Lane change assist

5. Traffic jam pilot

6. Parking pilot

7. Blind spot detection

RO3003G2’s Data Sheet

PROPERTY	RO3003G2	Direction	Unit	condition	Test Method
Dielectric Constant, er Process	3.00 ± 0.04	Z	-	10 GHz 23°C	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, er Design	3.07	Z	-	77 GHZ	Differential Phase Length Method
Dissipation Factor, tan d	0.0011	Z	-	10 GHz 23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of er	-35	Z	ppm/°C	10 GHz -50 to 150°C	IPC-TM-650 2.5.5.5
Dimensional Stability	-0.16 -0.14	X Y	mm/m	Method C	IPC TM-650 2.2.4
Volume Resistivity	1.4 x 10⁹	-	MΩ•cm	COND A	IPC 2.5.17.1
Surface Resistivity	2.6 x 10⁸	-	MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	378 396	X Y	ksi	23°C	ASTM D638
Moisture Absorption	0.06	-	%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.73 0.83	Z	J/g/K	0°C 50°C	ASTM E1269-11
Thermal Conductivity	0.43	Z	W/m/K	50°C	ASTM D5470
Coefficient of Thermal Expansion	16 17 18	X Y Z	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
Td	500	-	°CTGA	-	ASTM D3850
Density	2.15	-	gm/cm³	23°C	ASTM D792
Copper Peel Strength	12.0	-	lb/in	1/2 oz. EDC After Solder Float	IPC-TM-2.4.8
Flammability	V-0	-	-	-	UL 94
Lead Free Process Compatible	YES	-	-	-	-

Ceramic-Filled PTFE Laminates High Frequency RF PCB Board 2 Layers RO3003G2 1

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99/PCS
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

PCB Material:

RO3003G2

Layer Count:

2 Layers

Dielectric Constant:

Dissipation Factor:

0.0011

PCB Size:

≤400mm X 500mm

Copper Weight:

1oz (35µm), 2oz (70µm)

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99/PCS

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

Ceramic-Filled PTFE Laminates PCB Board

PCB Board RO3003G2

2 Layers High Frequency PCB

Product Description

Material Introduction

Features

1. The dielectric constant of 3.00 at 10 GHz and 3.07 at 77 GHz.

2. Very Low Profile (VLP) ED copper.

3. Homogeneous construction incorporating VLP ED copper and reduced dielectric porosity.

4. Enhanced filler system.

Benefits

1. Best-in-class performance for insertion loss.

2. Minimize variation in dielectric constant in the finished PCB.

3. Enable the trend towards using smaller diameter vias; Enhanced filler system using small rounded particles

4. Global manufacturing footprint.

Ceramic-Filled PTFE Laminates High Frequency RF PCB Board 2 Layers RO3003G2 0

Our PCB Capability (RO3003G2 laminates)

PCB Material:	Ceramic-filled PTFE Laminates
Designation:	RO3003G2
Dielectric constant:	3
Dissipation factor	0.0011
Layer count:	Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness	5mil (0.127mm), 10mil (0.254mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

Typical Applications

1. Adaptive cruise control

2. Forward collision warning

3. Active brake assist

4. Lane change assist

5. Traffic jam pilot

6. Parking pilot

7. Blind spot detection

RO3003G2’s Data Sheet

PROPERTY	RO3003G2	Direction	Unit	condition	Test Method
Dielectric Constant, er Process	3.00 ± 0.04	Z	-	10 GHz 23°C	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, er Design	3.07	Z	-	77 GHZ	Differential Phase Length Method
Dissipation Factor, tan d	0.0011	Z	-	10 GHz 23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of er	-35	Z	ppm/°C	10 GHz -50 to 150°C	IPC-TM-650 2.5.5.5
Dimensional Stability	-0.16 -0.14	X Y	mm/m	Method C	IPC TM-650 2.2.4
Volume Resistivity	1.4 x 10⁹	-	MΩ•cm	COND A	IPC 2.5.17.1
Surface Resistivity	2.6 x 10⁸	-	MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	378 396	X Y	ksi	23°C	ASTM D638
Moisture Absorption	0.06	-	%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.73 0.83	Z	J/g/K	0°C 50°C	ASTM E1269-11
Thermal Conductivity	0.43	Z	W/m/K	50°C	ASTM D5470
Coefficient of Thermal Expansion	16 17 18	X Y Z	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
Td	500	-	°CTGA	-	ASTM D3850
Density	2.15	-	gm/cm³	23°C	ASTM D792
Copper Peel Strength	12.0	-	lb/in	1/2 oz. EDC After Solder Float	IPC-TM-2.4.8
Flammability	V-0	-	-	-	UL 94
Lead Free Process Compatible	YES	-	-	-	-

Ceramic-Filled PTFE Laminates High Frequency RF PCB Board 2 Layers RO3003G2 1

Tags:

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Ceramic-Filled PTFE Laminates High Frequency RF PCB Board 2 Layers RO3003G2

Ceramic-Filled PTFE Laminates PCB Board

PCB Board RO3003G2

2 Layers High Frequency PCB

1oz RF PCB Board,

1.6mm RF PCB Board,

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Ceramic-Filled PTFE Laminates PCB Board

PCB Board RO3003G2

2 Layers High Frequency PCB

1oz RF PCB Board,

1.6mm RF PCB Board,