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20mil High Frequency PCB Based On RT Duroid 6035HTC 2L No Surface Finishes

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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20mil High Frequency PCB Based On RT Duroid 6035HTC 2L No Surface Finishes

20mil High Frequency PCB Based On RT Duroid 6035HTC 2L No Surface Finishes
20mil High Frequency PCB Based On RT Duroid 6035HTC 2L No Surface Finishes 20mil High Frequency PCB Based On RT Duroid 6035HTC 2L No Surface Finishes

Large Image :  20mil High Frequency PCB Based On RT Duroid 6035HTC 2L No Surface Finishes

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99/PCS-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

Ceramic Filled PTFE High Frequency PCB


No Surface Finishes High Frequency PCB


High Frequency RF PCB Board 20mil

Introducing our newly shipped PCB which is based on the RT/duroid 6035HTC high Frequency material. The RT/duroid 6035HTC High Frequency substrate is a cutting-edge circuit material designed specifically for high power RF and microwave applications. With its ceramic filled PTFE composites, this exceptional PCB offers unparalleled performance and reliability. Let's delve into the features and benefits that make this PCB stand out from the rest.


1. DK of 3.5 +/- 0.05 at 10 GHz/23°C: The PCB provides a stable dielectric constant, ensuring consistent signal integrity and precise electrical characteristics.


2. Dissipation factor of 0.0013 at 10 GHz/23°C: With low loss tangent, this PCB exhibits excellent high-frequency performance, minimizing signal loss and distortion.

3. Thermal Coefficient of dielectric constant of -66 ppm/°C: The PCB's thermal stability ensures reliable operation across a wide range of temperatures, safeguarding against performance fluctuations.

4. Moisture Absorption 0.06%: The low moisture absorption rate enhances the PCB's durability and prevents degradation caused by moisture exposure.

5. Thermal Conductivity of 1.44 W/m/K at 80°C: With high thermal conductivity, this PCB efficiently dissipates heat, enabling lower operating temperatures for high-power applications.

6. CTE in X-axis of 19 ppm/°C, Y-axis of 19 ppm/°C, and Z-axis of 39 ppm/°C: The PCB's low coefficient of thermal expansion minimizes the risk of warping or damage due to temperature changes.


RT/duroid 6035HTC Typical Value
Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650,
Volume Resistivity 108   MΩ.cm A IPC-TM-650,
Surface Resistivity 108   A IPC-TM-650,
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        


1. High Thermal Conductivity: The improved dielectric heat dissipation capability of the RT/duroid 6035HTC PCB allows for lower operating temperatures, ensuring optimal performance and reliability, particularly in high-power applications.


2. Low Loss Tangent: With excellent high-frequency performance, this PCB minimizes signal loss and distortion, enabling precise and reliable transmission of RF and microwave signals.

3. Thermally Stable Low Profile and Reverse Treat Copper Foil: The PCB's copper foil, featuring low profile and reverse treat properties, offers lower insertion loss and excellent thermal stability for the traces, resulting in enhanced signal integrity and durability.

4. Advanced Filler System: The innovative filler system employed in this PCB improves drillability and extends tool life, surpassing the performance of circuit materials that contain alumina fillers.


PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..


20mil High Frequency PCB Based On RT Duroid 6035HTC 2L No Surface Finishes 0


PCB Stackup:
This 2-layer rigid PCB features a copper layer of 35 μm on both sides, sandwiching the RT/duroid 6035HTC material with a thickness of 0.508 mm (20mil). The stackup design ensures optimal signal transmission and structural integrity.


PCB Construction Details:
The size of this PCB measuring 200.5mm x 41.5mm, with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 4/6 mils and a minimum hole size of 0.3mm. The finished board thickness is 0.6mm, and the finished copper weight is 1oz (1.4 mils) on the outer layers. With a via plating thickness of 20 μm and a bare copper surface finish, this PCB is ready to meet your high-frequency application needs. It does not have top or bottom silkscreen, and no solder mask is applied. Every PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring optimal functionality and reliability.


PCB Statistics:
This PCB features 26 components and a total of 100 pads, with 58 thru-hole pads and 42 top surface mount technology (SMT) pads. There are no bottom SMT pads. The PCB includes 47 vias and is designed to accommodate 5 nets, providing versatility for various circuit configurations.


Accepted Standard and Availability:
This PCB adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly. It is available worldwide, making it accessible for customers across the globe.


Typical Applications:

The RT/duroid 6035HTC PCB is ideally suited for a range of applications, including:
- High-power RF and microwave amplifiers
- Power amplifiers
- Couplers
- Filters
- Combiners
- Power dividers


Experience the superior performance and reliability of the RT/duroid 6035HTC High Frequency PCB. Its exceptional thermal conductivity, low loss tangent, and advanced construction make it the perfect choice for demanding high-power RF and microwave applications.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)