0.813mm 2L RF PCB Made Of RO4003C Laminates For High Frequency Applications

Introduction:
It's very happy to introduce our newly shipped PCB which made of RO4003C laminates. RO4003C laminates are cost-effective microwave materials known for their precise control over dielectric constant (ε) and low loss. They are available in different configurations, utilizing 1080 and 1674 glass fabric styles. Unlike PTFE-based microwave materials, RO4003C laminates do not require special handling procedures or through-hole treatments. These laminates are non-brominated and do not have a UL 94 V-0 rating.

Features:
RO4003C laminates are composed of woven glass reinforced hydrocarbon/ceramics. They have a dielectric constant (DK) of 3.38 ± 0.05 at 10 GHz and a dissipation factor (tan δ) of 0.0027 at the same frequency. The laminates exhibit a thermal conductivity of 0.71 W/m/°K. The coefficient of thermal expansion (CTE) is 11 ppm/°C in the X-axis, 14 ppm/°C in the Y-axis, and 46 ppm/°C in the Z-axis. The glass transition temperature (Tg) is greater than 280 °C, and the laminates can operate within a temperature range of -40℃ to +85℃.

Benefits:
RO4003C laminates offer excellent electrical performance with low dielectric tolerance and low loss. They maintain stable electrical properties across a wide frequency range. The laminates exhibit a low thermal coefficient of dielectric constant, providing dimensional stability. They also offer reliable plated through holes with low Z-axis expansion. With a low in-plane expansion coefficient, RO4003C laminates remain stable over a range of circuit processing temperatures. Moreover, these laminates are cost-effective compared to conventional microwave laminates. They are also resistant to conductive anodic filamentation (CAF).

PCB Stackup:
This PCB is a 2-layer rigid construction, the stackup consists of a 35 μm copper layer on the top, a 0.813 mm (32 mil) RO4003C core, and another 35 μm copper layer on the bottom.

PCB Construction Details:
The dimensions for this PCB.It's two types of the design. The size are 265mm x 66.88mm with a tolerance of +/- 0.15mm. The minimum trace/space is 6/5 mils, and the minimum hole size is 0.35mm. The PCB does not have blind vias, and the finished board thickness is 0.9mm. The outer copper layer weight is 1 oz (1.4 mils), and the via plating thickness is 20 μm. The surface finish is immersion gold, while the top and bottom silkscreens are white. The solder masks are green on both sides. A 100% electrical test is conducted prior to shipment.

PCB Statistics:
This PCB consists of 66 components and has a total of 153 pads, including 81 through-hole pads and 72 top surface mount technology (SMT) pads. The PCB does not have bottom SMT pads. It includes 120 vias and 4 nets.

Supplied Artwork Type and Quality Standard:
The supplied artwork type is Gerber RS-274-X, and the quality standard is IPC-Class-2.

Availability:
This PCB made of RO4003C laminates are available worldwide.

Typical Applications:
RO4003C laminates are commonly used in cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNBs (Low Noise Block downconverters) for direct broadcast satellites.