60mil AD250C Double Sided Rigid Circuit Board With Hot Air Soldering Level

Introducing our latest shipment PCB based on the advanced AD250 material, specifically designed for commercial microwave and RF applications. The AD250C laminate offers a tightly controlled dielectric constant of 2.50, ensuring superior performance and reliability in today's telecommunications infrastructure.

Key Features:
Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates provide the foundation for this PCB. With a dielectric constant of 2.5 and tight tolerance at 10 GHz/23°C, this material delivers precise electrical characteristics. The PCB exhibits a low loss tangent of 0.0013 at 10GHz and base station frequencies, ensuring excellent circuit performance. Its decomposition temperature (Td) exceeds 500°C, making it highly durable in high-temperature environments. Additionally, the AD250C laminate boasts an extremely low moisture absorption rate of 0.04% and exhibits excellent dimensional stability with a coefficient of thermal expansion (CTE) of 47 ppm/°C (X-axis), 29 ppm/°C (Y-axis), and 196 ppm/°C (Z-axis).

Benefits:
The low loss tangent (<0.002 at 10 GHz) of this PCB enables superior circuit performance across a wide range of wireless frequency bands. With a controlled dielectric constant (±0.05), the PCB ensures consistent and predictable circuit performance. The ceramic material used in the AD250 laminate provides exceptional stability of the dielectric constant during temperature changes. The very low Passive Intermodulation (PIM) of -159 dBc at 30 mil, 1900 MHz significantly reduces signal interference, resulting in improved antenna performance. The excellent dimensional stability of the PCB enhances repeatability of circuit performance and contributes to high manufacturing yields. Compared to typical PTFE-based laminates, this PCB offers improved reliability and performance.

Construction Details:
This PCB is a 2-layer rigid construction with the following stackup: Copper_layer_1 (35 μm), AD250C (1.524 mm or 60mil), and Copper_layer_2 (35 μm). It has a finished board thickness of 1.6mm and a finished copper weight of 1oz (1.4 mils) for the outer layers, striking a balance between durability and performance.

Additional Specifications:
The board dimensions are 355mm x 210 mm (1PCS) with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 6/6 mils and a minimum hole size of 0.4mm. This PCB does not have blind vias. It features a Hot Air Soldering Level surface finish and does not have top or bottom silkscreens or solder masks. Prior to shipment, each PCB undergoes a 100% electrical test to ensure optimal performance.

Statistics:
This PCB consists of 118 components, 260 pads, 118 thru-hole pads, 142 top SMT pads, and no bottom SMT pads. It contains 161 vias and supports 3 nets.

Standards and Availability:
This PCB adheres to IPC-Class-2 standards, guaranteeing high manufacturing and performance standards. It is available worldwide, providing customers across the globe with access to its exceptional features and performance.

Applications:
This versatile PCB finds applications in various fields, including cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas. Choose our AD250-based PCB for reliable, high-performance solutions in commercial microwave and RF applications.