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Highlight: | Hot Air Soldering PCB Board,AD250C Double Sided Rigid Circuit Board,60mil Double Sided Rigid Circuit Board |
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Introducing our latest shipment PCB based on the advanced AD250 material, specifically designed for commercial microwave and RF applications. The AD250C laminate offers a tightly controlled dielectric constant of 2.50, ensuring superior performance and reliability in today's telecommunications infrastructure.
Key Features:
Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates provide the foundation for this PCB. With a dielectric constant of 2.5 and tight tolerance at 10 GHz/23°C, this material delivers precise electrical characteristics. The PCB exhibits a low loss tangent of 0.0013 at 10GHz and base station frequencies, ensuring excellent circuit performance. Its decomposition temperature (Td) exceeds 500°C, making it highly durable in high-temperature environments. Additionally, the AD250C laminate boasts an extremely low moisture absorption rate of 0.04% and exhibits excellent dimensional stability with a coefficient of thermal expansion (CTE) of 47 ppm/°C (X-axis), 29 ppm/°C (Y-axis), and 196 ppm/°C (Z-axis).
Electrical Properties | AD250C | Units | Test Conditions | Test Method | |
PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
Dielectric Constant (process) | 2.52 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
Dielectric Constant (design) | 2.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant | -117 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
Volume Resistivity | 4.8 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Surface Resistivity | 4.1 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Electrical Strength (dielectric strength) | 979 | V/mil | - | - | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
Thermal Properties | |||||
Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
Coefficient of Thermal Expansion - x | 47 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - y | 29 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Thermal Conductivity | 0.33 | W/mK | - | z direction | ASTM D5470 |
Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
Mechanical Properties | |||||
Copper Peel Strength after Thermal Stress | 2.6 (14.8) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
Tensile Strength (MD/CMD) | 6.0/5.6 (41.4/38.6) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
Flex Modulus (MD/CMD) | 885/778 (6,102/5,364) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
Dimensional Stability (MD/CMD) | 0.02/0.06 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
Physical Properties | |||||
Flammability | V-0 | - | - | - | UL-94 |
Moisture Absorption | 0.04 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Benefits:
The low loss tangent (<0.002 at 10 GHz) of this PCB enables superior circuit performance across a wide range of wireless frequency bands. With a controlled dielectric constant (±0.05), the PCB ensures consistent and predictable circuit performance. The ceramic material used in the AD250 laminate provides exceptional stability of the dielectric constant during temperature changes. The very low Passive Intermodulation (PIM) of -159 dBc at 30 mil, 1900 MHz significantly reduces signal interference, resulting in improved antenna performance. The excellent dimensional stability of the PCB enhances repeatability of circuit performance and contributes to high manufacturing yields. Compared to typical PTFE-based laminates, this PCB offers improved reliability and performance.
Construction Details:
This PCB is a 2-layer rigid construction with the following stackup: Copper_layer_1 (35 μm), AD250C (1.524 mm or 60mil), and Copper_layer_2 (35 μm). It has a finished board thickness of 1.6mm and a finished copper weight of 1oz (1.4 mils) for the outer layers, striking a balance between durability and performance.
Additional Specifications:
The board dimensions are 355mm x 210 mm (1PCS) with a tolerance of +/- 0.15mm. It supports a minimum trace/space of 6/6 mils and a minimum hole size of 0.4mm. This PCB does not have blind vias. It features a Hot Air Soldering Level surface finish and does not have top or bottom silkscreens or solder masks. Prior to shipment, each PCB undergoes a 100% electrical test to ensure optimal performance.
Statistics:
This PCB consists of 118 components, 260 pads, 118 thru-hole pads, 142 top SMT pads, and no bottom SMT pads. It contains 161 vias and supports 3 nets.
Standards and Availability:
This PCB adheres to IPC-Class-2 standards, guaranteeing high manufacturing and performance standards. It is available worldwide, providing customers across the globe with access to its exceptional features and performance.
Applications:
This versatile PCB finds applications in various fields, including cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas. Choose our AD250-based PCB for reliable, high-performance solutions in commercial microwave and RF applications.
PCB Material: | PTFE based Woven Fiberglass/Ceramic Filled Composites |
Designation: | AD250C |
Dielectric constant: | 2.50 (10 GHz) |
Dissipation factor | 0.0013 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated etc.. |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848