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Highlight: | Hydrocarbon Ceramic Laminates PCB Substrates,High Frequency PCB 1oz,Immersion Gold High Frequency PCB Materials |
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Our newly shipped product is a 2-layer rigid PCB, meticulously constructed to meet the demands of performance-sensitive applications. It features Rogers RO4835, a Hydrocarbon/Ceramic/Woven Glass material renowned for its exceptional properties in high-frequency operation.
With a dielectric constant (DK) of 3.48 +/- 0.05 at 10 GHz/23°C and a dissipation factor of 0.0037 at the same frequency and temperature, low loss and excellent electrical performance are achieved, making it well-suited for applications requiring higher operating frequencies. The thermal coefficient of er (TcDK) ranges from +50 ppm/°C within -100 to 250°C, ensuring stability across a wide temperature range. The Tg (glass transition temperature) exceeds 280°C, providing robustness in diverse environments. Additionally, a moisture absorption rate of only 0.05% is exhibited.
Property | RO4835 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.48±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign | 3.66 | Z | - | 8 to 40 GHz | Differential Phase Length Method |
Dissipation Factortan,δ | 0.0037 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε | +50 | Z | ppm/℃ | -100℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 5 x 108 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 7 x108 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 30.2(755) | Z | Kv/mm(v/mil) | IPC-TM-650 2.5.6.2 | |
Tensile Modulus | 7780(1128) | Y | MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 136(19.7) | Y | MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 186 (27) | Mpa (kpsi) | IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 10 12 31 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.66 | W/m/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.05 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.92 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
A range of remarkable features distinguishes our PCB from typical thermoset microwave materials. Significantly improved oxidation resistance is offered, making it ideal for demanding applications with high volumes. Controlled impedance transmission lines are achieved due to the tight dielectric constant tolerance. Compatibility with lead-free processes eliminates concerns of blistering or delamination. Low Z-axis expansion ensures reliable plated through holes, while the low in-plane expansion coefficient maintains stability over a wide range of circuit processing temperatures. Furthermore, it is resistant to CAF (Conductive Anodic Filament) formation, ensuring long-term reliability.
This PCB is constructed with a 35 μm copper layer, a 0.168 mm (6.6 mil) Rogers RO4835 core, and another 35 μm copper layer, resulting in a sturdy and reliable structure.
PCB Material: | Hydrocarbon Ceramic Laminates |
Designation: | RO4835 |
Dielectric constant: | 3.48 (10 GHz) |
Dissipation Factor | 0.0037 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness (ED copper) | 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
Dielectric thickness (LoPro copper) | 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Construction details encompass precise board dimensions of 5mm x 9mm with a tolerance of +/- 0.15mm. A minimum trace/space of 4/4 mils and a minimum hole size of 0.2mm are specified. The absence of blind vias simplifies the manufacturing process. With a finished board thickness of 0.3mm and a 1oz (1.4 mils) copper weight on the outer layers, the PCB strikes a balance between durability and lightweight design. The via plating thickness measures 20 μm, ensuring robust connections. The surface finish is Immersion Gold, providing excellent conductivity and corrosion resistance. Silkscreen and solder mask layers are not included.
Prior to shipment, each PCB undergoes a rigorous 100% electrical test, ensuring its reliability and adherence to quality standards. Compliance with the IPC-Class-2 standard guarantees consistent performance and durability.
This PCB offers versatility with its statistics, including 1 component, 3 total pads, 2 thru-hole pads, 1 top surface mount technology (SMT) pad, 0 bottom SMT pads, 2 vias, and 1 net. The artwork is supplied in Gerber RS-274-X format, compatible with standard manufacturing processes.
Our product is globally available, enabling customers worldwide to benefit from its exceptional performance. It finds applications in various fields, including automotive radar and sensors, point-to-point microwave systems, power amplifiers, phased-array radar, and RF components.
For any technical inquiries or further information, please do not hesitate to contact our dedicated team at sales10@bichengpcb.com. Exceptional support is our commitment, ensuring your satisfaction with our products.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848