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6.6mil RO4835 High Frequency PCB Materials 1oz Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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6.6mil RO4835 High Frequency PCB Materials 1oz Immersion Gold

6.6mil RO4835 High Frequency PCB Materials 1oz Immersion Gold
6.6mil RO4835 High Frequency PCB Materials 1oz Immersion Gold 6.6mil RO4835 High Frequency PCB Materials 1oz Immersion Gold 6.6mil RO4835 High Frequency PCB Materials 1oz Immersion Gold

Large Image :  6.6mil RO4835 High Frequency PCB Materials 1oz Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99/PCS-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

Hydrocarbon Ceramic Laminates PCB Substrates


High Frequency PCB 1oz


Immersion Gold High Frequency PCB Materials

Our newly shipped product is a 2-layer rigid PCB, meticulously constructed to meet the demands of performance-sensitive applications. It features Rogers RO4835, a Hydrocarbon/Ceramic/Woven Glass material renowned for its exceptional properties in high-frequency operation.


With a dielectric constant (DK) of 3.48 +/- 0.05 at 10 GHz/23°C and a dissipation factor of 0.0037 at the same frequency and temperature, low loss and excellent electrical performance are achieved, making it well-suited for applications requiring higher operating frequencies. The thermal coefficient of er (TcDK) ranges from +50 ppm/°C within -100 to 250°C, ensuring stability across a wide temperature range. The Tg (glass transition temperature) exceeds 280°C, providing robustness in diverse environments. Additionally, a moisture absorption rate of only 0.05% is exhibited.


Property RO4835 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z - 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z - 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037 Z - 10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε +50 Z ppm/℃ -100℃to 150℃ IPC-TM-650
Volume Resistivity 5 x 108   MΩ.cm COND A IPC-TM-650
Surface Resistivity 7 x108   COND A IPC-TM-650
Electrical Strength 30.2(755) Z Kv/mm(v/mil)   IPC-TM-650
Tensile Modulus 7780(1128) Y MPa(ksi) RT ASTM D 638
Tensile Strength 136(19.7) Y MPa(ksi) RT ASTM D 638
Flexural Strength 186 (27)   Mpa (kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.66   W/m/oK 80℃ ASTM C518
Moisture Absorption 0.05   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.92   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88 (5.0)   N/mm (pli) after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


A range of remarkable features distinguishes our PCB from typical thermoset microwave materials. Significantly improved oxidation resistance is offered, making it ideal for demanding applications with high volumes. Controlled impedance transmission lines are achieved due to the tight dielectric constant tolerance. Compatibility with lead-free processes eliminates concerns of blistering or delamination. Low Z-axis expansion ensures reliable plated through holes, while the low in-plane expansion coefficient maintains stability over a wide range of circuit processing temperatures. Furthermore, it is resistant to CAF (Conductive Anodic Filament) formation, ensuring long-term reliability.


This PCB is constructed with a 35 μm copper layer, a 0.168 mm (6.6 mil) Rogers RO4835 core, and another 35 μm copper layer, resulting in a sturdy and reliable structure.


PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4835
Dielectric constant: 3.48 (10 GHz)
Dissipation Factor 0.0037 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (ED copper) 6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Dielectric thickness (LoPro copper) 4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


Construction details encompass precise board dimensions of 5mm x 9mm with a tolerance of +/- 0.15mm. A minimum trace/space of 4/4 mils and a minimum hole size of 0.2mm are specified. The absence of blind vias simplifies the manufacturing process. With a finished board thickness of 0.3mm and a 1oz (1.4 mils) copper weight on the outer layers, the PCB strikes a balance between durability and lightweight design. The via plating thickness measures 20 μm, ensuring robust connections. The surface finish is Immersion Gold, providing excellent conductivity and corrosion resistance. Silkscreen and solder mask layers are not included.


Prior to shipment, each PCB undergoes a rigorous 100% electrical test, ensuring its reliability and adherence to quality standards. Compliance with the IPC-Class-2 standard guarantees consistent performance and durability.


6.6mil RO4835 High Frequency PCB Materials 1oz Immersion Gold 0


This PCB offers versatility with its statistics, including 1 component, 3 total pads, 2 thru-hole pads, 1 top surface mount technology (SMT) pad, 0 bottom SMT pads, 2 vias, and 1 net. The artwork is supplied in Gerber RS-274-X format, compatible with standard manufacturing processes.

Our product is globally available, enabling customers worldwide to benefit from its exceptional performance. It finds applications in various fields, including automotive radar and sensors, point-to-point microwave systems, power amplifiers, phased-array radar, and RF components.


For any technical inquiries or further information, please do not hesitate to contact our dedicated team at Exceptional support is our commitment, ensuring your satisfaction with our products.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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