|
Product Details:
Payment & Shipping Terms:
|
| High Light: | Silkscreen Surface Finish PCB Board,Double Sided PCB Substrates,30mil PCB Substrates |
||
|---|---|---|---|
Introducing our newly shipped PCB, which has been meticulously supplied to meet high-performance requirements. This 2-layer rigid PCB has been constructed using Rogers RO4535 Ceramic-filled, Glass-reinforced Hydrocarbon Laminates, renowned for their exceptional properties. With a dielectric constant (DK) of 3.41 at 10GHz and a dissipation factor of 0.0037 at 10GHz, low loss and low PIM response are ensured, offering reliable performance.
The PCB substrates boast a PIM (typical) value of -157 dBC, indicating excellent signal integrity and minimal interference. With X-axis CTE of 16ppm/°C, Y-axis CTE of 17ppm/°C, and Z-axis CTE of 50ppm/°C, this PCB provides stability in various temperature conditions. It operates reliably from -40℃ to +85℃, making it suitable for diverse environments.
| Property | RO4535 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.44 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.0032 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0037 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.5 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 16 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 17 | Y | ||||
| 50 | Z | ||||
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.09 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.9 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 5.1 (0.9) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |
A range of features and benefits is offered by our PCB, catering to various applications. It is engineered for low loss, low DK, and low PIM response, ensuring optimal performance across a wide range of applications. The thermoset resin system used is compatible with standard PCB fabrication processes, simplifying production and assembly. Excellent dimensional stability is exhibited by the PCB, enabling greater yield on larger panel sizes. Its uniform mechanical properties ensure the maintenance of form during handling, enhancing reliability. Additionally, the PCB exhibits high thermal conductivity, improving power handling capabilities.
The stackup comprises a copper layer of 35 μm, a Rogers 4535 core of 0.762 mm, and another 35 μm copper layer. This PCB has been supplied with a finished board thickness of 0.88mm, adhering to precise construction details. With board dimensions of 94.05mm x 116.05mm, it offers compact yet efficient design options. The minimum trace/space measures 6/7 mils, and the minimum hole size is 0.35mm, allowing for intricate circuitry. This PCB has been designed without blind vias and has been finished with a high-quality immersion gold surface finish.
Prior to shipment, the PCB has undergone a thorough 100% electrical test, ensuring its reliability and adherence to quality standards. It complies with the IPC-Class-2 quality standard, guaranteeing consistent performance and durability.
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |
Featuring 134 components and 243 total pads, including 130 thru-hole pads and 113 top surface mount technology (SMT) pads, this PCB offers versatility in terms of component integration. It boasts 271 vias and 9 nets, providing flexibility for various circuit connections.
The artwork has been supplied in Gerber RS-274-X format, ensuring compatibility with standard manufacturing processes. Our PCB is globally available, accessible to customers worldwide. Typical applications for this product include cellular infrastructure base station antennas and WiMAX antenna networks.
Should you have any technical inquiries or require additional information, please do not hesitate to reach out to our dedicated team at sales10@bichengpcb.com. Our team is fully committed to providing outstanding support and ensuring your utmost satisfaction with our products.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
