Product Details:
Payment & Shipping Terms:
|
Highlight: | RF PCB Board 0.8mm,Immersion Tin PCB Circuit Board,2-Layer Rigid PCB |
---|
Introducing our newly shipped PCB, featuring cutting-edge technology and exceptional performance. This 2-layer rigid PCB is constructed using high-quality Rogers AD255C Woven Glass Reinforced PTFE Antenna Grade Laminates, ensuring unparalleled reliability and functionality. With a dielectric constant of 2.55 and a tight tolerance at 10 GHz/23°C, this PCB guarantees optimal signal integrity and stability.
Engineered with a focus on low loss and superior performance, the substrate incorporates a very low loss PTFE and ceramic filled composite.
The low profile copper and lower insertion loss further enhance its efficiency, making it an ideal choice for antenna applications. This PCB boasts low PIM (Passive Intermodulation) that ensures minimal interference and distortion in antenna systems.
Electrical Properties | AD255C | Units | Test Conditions | Test Method | |
PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
Dielectric Constant (process) | 2.55 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
Dielectric Constant (design) | 2.60 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
Thermal Coefficient of Dielectric Constant | -110 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
Volume Resistivity | 7.4 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Surface Resistivity | 3.6 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
Electrical Strength (dielectric strength) | 911 | V/mil | - | - | IPC TM-650 2.5.6.2 |
Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
Thermal Properties | |||||
Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
Coefficient of Thermal Expansion - x | 34 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - y | 26 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
Thermal Conductivity | 0.35 | W/mK | - | z direction | ASTM D5470 |
Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
Mechanical Properties | |||||
Copper Peel Strength after Thermal Stress | 2.4 (13.6) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
Tensile Strength (MD/CMD) | 8.1/6.6 (55.8/45.5) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
Flex Modulus (MD/CMD) | 930/818 (6,412/5,640) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
Dimensional Stability (MD/CMD) | 0.03/0.07 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
Physical Properties | |||||
Flammability | V-0 | - | - | - | UL-94 |
Moisture Absorption | 0.03 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
One of the standout features of this PCB is its remarkable phase stability, attributed to the excellent TCEr (Thermal Coefficient of Expansion). This ensures consistent performance even under varying temperature conditions. Additionally, this PCB is compatible with the processing techniques used for standard PTFE-based PCB substrates, making it easy to incorporate into existing designs and manufacturing processes.
The stackup of this PCB consists of two layers, with a copper layer thickness of 35 μm on both sides. The AD255C substrate, measuring 0.762 mm (30 mil), provides excellent stability and durability. With a finished board thickness of 0.8mm, this PCB strikes the perfect balance between compactness and robustness.
It features a board dimension of 175.42mm x 143.84mm, allowing for versatile usage in various applications. The minimum trace/space of 5/5 mils and minimum hole size of 0.3mm provide flexibility and precision in circuit design. The absence of blind vias simplifies the manufacturing process, ensuring cost-effectiveness and ease of production.
PCB Material: | Glass-reinforced, PTFE based Composites |
Designation: | AD255C |
Dielectric constant: | 2.55 (10 GHz) |
Dissipation Factor | 0.0013 (10 GHz) |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
To ensure reliability, each PCB undergoes a 100% electrical test before shipment, guaranteeing optimal performance upon arrival. The surface finish is Immesion Tin, providing excellent corrosion resistance and solderability. The top solder mask is green, while the top silkscreen is white, facilitating clear labeling and identification of components.
With 26 components and 82 pads, including 29 thru-hole pads and 53 top SMT pads, this PCB offers extensive versatility for various applications. It features 54 vias and 4 nets, enabling efficient signal routing and connectivity.
This PCB meets IPC-Class-2 standards, it is built to withstand demanding environments and deliver consistent performance. Its applications range from cellular infrastructure base station antennas to automotive telematics antenna systems and commercial satellite radio antennas.
We proudly offer worldwide availability, ensuring that our PCB can be accessed and utilized wherever you are. For any technical inquiries or further information, please contact our dedicated sales team at sales10@bichengpcb.com.
Choose our advanced PCB solution and experience unrivaled performance and reliability in your electronic projects.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848