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0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin

0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin
0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin 0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin 0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin

Large Image :  0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99/PCS-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

RF PCB Board 0.8mm


Immersion Tin PCB Circuit Board


2-Layer Rigid PCB

Introducing our newly shipped PCB, featuring cutting-edge technology and exceptional performance. This 2-layer rigid PCB is constructed using high-quality Rogers AD255C Woven Glass Reinforced PTFE Antenna Grade Laminates, ensuring unparalleled reliability and functionality. With a dielectric constant of 2.55 and a tight tolerance at 10 GHz/23°C, this PCB guarantees optimal signal integrity and stability.


Engineered with a focus on low loss and superior performance, the substrate incorporates a very low loss PTFE and ceramic filled composite.


The low profile copper and lower insertion loss further enhance its efficiency, making it an ideal choice for antenna applications. This PCB boasts low PIM (Passive Intermodulation) that ensures minimal interference and distortion in antenna systems.


Electrical Properties AD255C Units Test Conditions Test Method
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.55 - 23°C @ 50% RH 10 GHz IPC TM-650
(IPC TM-650
Dielectric Constant (design) 2.60 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650
Thermal Coefficient of Dielectric Constant -110 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650
Volume Resistivity 7.4 x 108 Mohm-cm C-96/35/90 - IPC TM-650
Surface Resistivity 3.6 x 107 Mohm C-96/35/90 - IPC TM-650
Electrical Strength (dielectric strength) 911 V/mil - - IPC TM-650
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x 34 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 26 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Thermal Conductivity 0.35 W/mK - z direction ASTM D5470
Time to Delamination >60 minutes as-received 288˚C IPC TM-650
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.4
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 8.1/6.6 (55.8/45.5) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 930/818 (6,412/5,640) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.03/0.07 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.03 % E1/105 +D48/50 - IPC TM-650
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716


One of the standout features of this PCB is its remarkable phase stability, attributed to the excellent TCEr (Thermal Coefficient of Expansion). This ensures consistent performance even under varying temperature conditions. Additionally, this PCB is compatible with the processing techniques used for standard PTFE-based PCB substrates, making it easy to incorporate into existing designs and manufacturing processes.


The stackup of this PCB consists of two layers, with a copper layer thickness of 35 μm on both sides. The AD255C substrate, measuring 0.762 mm (30 mil), provides excellent stability and durability. With a finished board thickness of 0.8mm, this PCB strikes the perfect balance between compactness and robustness.


It features a board dimension of 175.42mm x 143.84mm, allowing for versatile usage in various applications. The minimum trace/space of 5/5 mils and minimum hole size of 0.3mm provide flexibility and precision in circuit design. The absence of blind vias simplifies the manufacturing process, ensuring cost-effectiveness and ease of production.


PCB Material: Glass-reinforced, PTFE based Composites
Designation: AD255C
Dielectric constant: 2.55 (10 GHz)
Dissipation Factor 0.0013 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


To ensure reliability, each PCB undergoes a 100% electrical test before shipment, guaranteeing optimal performance upon arrival. The surface finish is Immesion Tin, providing excellent corrosion resistance and solderability. The top solder mask is green, while the top silkscreen is white, facilitating clear labeling and identification of components.


0.8mm AD255C 2-Layer Rigid RF PCB Board PTFE Based With Immersion Tin 0


With 26 components and 82 pads, including 29 thru-hole pads and 53 top SMT pads, this PCB offers extensive versatility for various applications. It features 54 vias and 4 nets, enabling efficient signal routing and connectivity.


This PCB meets IPC-Class-2 standards, it is built to withstand demanding environments and deliver consistent performance. Its applications range from cellular infrastructure base station antennas to automotive telematics antenna systems and commercial satellite radio antennas.


We proudly offer worldwide availability, ensuring that our PCB can be accessed and utilized wherever you are. For any technical inquiries or further information, please contact our dedicated sales team at


Choose our advanced PCB solution and experience unrivaled performance and reliability in your electronic projects.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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