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60mil AD255C RF PCB PTFE Based Composites With Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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60mil AD255C RF PCB PTFE Based Composites With Immersion Gold

60mil AD255C RF PCB PTFE Based Composites With Immersion Gold
60mil AD255C RF PCB PTFE Based Composites With Immersion Gold 60mil AD255C RF PCB PTFE Based Composites With Immersion Gold 60mil AD255C RF PCB PTFE Based Composites With Immersion Gold

Large Image :  60mil AD255C RF PCB PTFE Based Composites With Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD 9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

RF PCB With Immersion Gold


60mil RF PCB


PTFE Based Composites PCB Board

Today, we will be discussing Rogers' AD255C antenna grade laminate and the printed circuit boards built using this antenna material.


AD255C copper clad laminates combine a fluoropolymer resin system with selected ceramic materials and fiberglass reinforcement, offering exceptional thermal properties. They exhibit lower loss, lower thermal expansion, and lower passive intermodulation (PIM). These laminates provide stability over a wide range of frequencies and temperatures, making them ideal for various microwave and radio frequency applications in telecommunications infrastructure.


The inclusion of micro-dispersed ceramics improves the thermal stability of AD255C by reducing its CTE values and enhancing phase stability at different temperatures.


Now, let's dive into the data sheet to explore the properties of AD255C.


Properties AD255C Units Test Conditions Test Method
Electrical Properties
PIM (30mil/60mil) -159/-163 dBc Reflected 43 dBm swept tones at 1900 MHz, S1/S1 Rogers Internal 50 ohm
Dielectric Constant (process) 2.55 - 23°C @ 50% RH 10 GHz IPC TM-650
(IPC TM-650
Dielectric Constant (design) 2.60 - C-24/23/50 10 GHz Microstrip Differential Phase Length
Dissipation Factor (process) 0.0013 - 23°C @ 50% RH 10 GHz IPC TM-650
Electrical Strength (dielectric strength) 911 V/mil - - IPC TM-650
Thermal Coefficient of Dielectric Constant -110 ppm/ºC 0°C to 100°C 10 GHz IPC TM-650
Volume Resistivity 7.4 x 108 Mohm-cm C-96/35/90 - IPC TM-650
Surface Resistivity 3.6 x 107 Mohm C-96/35/90 - IPC TM-650
Dielectric Breakdown >40 kV D-48/50 X/Y direction IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td) >500 ˚C 2hrs @ 105˚C 5% Weight Loss IPC TM-650 2.3.40
Thermal Conductivity 0.35 W/mK - z direction ASTM D5470
Coefficient of Thermal Expansion - x 34 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y 26 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z 196 ppm/˚C - -55˚C to 288˚C IPC TM-650 2.4.41
Time to Delamination >60 minutes as-received 288˚C IPC TM-650
Mechanical Properties
Copper Peel Strength after Thermal Stress 2.4
N/mm (lbs/in) 10s @288˚C 35 μm foil IPC TM-650 2.4.8
Flexural Strength (MD/CMD) 8.8/6.4 (60.7/44.1) MPa (ksi ) 25°C ± 3°C - ASTM D790
Tensile Strength (MD/CMD) 8.1/6.6 (55.8/45.5) MPa (ksi ) 23°C/50% RH - ASTM D3039/D3039-14
Flex Modulus (MD/CMD) 930/818 (6,412/5,640) MPa (ksi ) 25°C ± 3°C - IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD) 0.03/0.07 mils/inch after etch + bake - IPC-TM-650 2.4.39a
Physical Properties
Flammability V-0 - - - UL-94
Moisture Absorption 0.03 % E1/105 +D48/50 - IPC TM-650
Density 2.28 g/cm3 C-24/23/50 - ASTM D792
Specific Heat Capacity 0.813 J/g°K 2 hours at 105°C - ASTM E2716


AD255C Typical Properties

One of the most impressive features of AD255C is its PIM rating of -159/-163 dBc. Using reverse treated ED copper foil, typical PIM values are -159 dBc at a thickness of 30 mil and -163 dBc at a thickness of 60 mil. These values were obtained through extensive PIM testing at Rogers, conducted at 1900 MHz using a swept tone, reflected method on a 50Ω microstrip test vehicle.


AD255C has a dielectric constant of 2.55 (process) and 2.60 (design), enabling excellent signal transmission at high frequencies.


The material also boasts an extremely low dissipation factor of 0.0013 and high electrical strength of 911 V/mil, contributing to its outstanding electrical performance.


AD255C exhibits a thermal coefficient of dielectric constant of -110 ppm/ºC at a frequency of 10 GHz over the temperature range of 0°C to 100°C, as tested according to IPC TM-650. This negative coefficient indicates that the dielectric constant decreases with increasing temperature.


Volume resistivity and surface resistivity at C-96/35/90 are 7.4 x 10^8 Mohm-cm and 3.6 x 10^7 Mohm, respectively, as per IPC TM-650


Dielectric breakdown in both the X and Y directions exceeds 40 kV, measured by D-48/50, IPC TM-650 2.5.6.


In terms of thermal performance, AD255C has a decomposition temperature exceeding 500 ˚C and a thermal conductivity of 0.35 W/mK in the z direction.


The material also exhibits a low coefficient of thermal expansion of 34 ppm/˚C (x-direction), 26 ppm/˚C (y-direction), and 196 ppm/˚C (z-direction) over the temperature range of -55˚C to 288˚C.


AD255C has a delamination time of over 60 minutes at 288˚C, making it an ideal material for high-temperature applications.


60mil AD255C RF PCB PTFE Based Composites With Immersion Gold 0


Regarding mechanical properties, AD255C demonstrates a copper peel strength of 2.4 N/mm after thermal stress, allowing it to withstand challenging environments.


The material also exhibits excellent flexural strength of 8.8/6.4 MPa in the machine direction and cross direction.


Tensile strength in the machine direction is 8.1 MPa, while in the cross-machine direction, it is 6.6 MPa at 23°C and 50% relative humidity, following the ASTM D3039/D3039-14 standard.


Flex modulus in the machine direction is 930 MPa, and in the cross-machine direction, it is 818 MPa at 25°C, as per IPC-TM-650 Test Method 2.4.4.


The dimensional stability is 0.03 and 0.07 mils/inch in the cross direction and cross-machine direction, respectively, after etching and baking.


Additionally, AD255C has a flammability rating of V-0 grade, a low moisture absorption rate of 0.03%, a density of 2.28 g/cm3, and a specific heat capacity of 0.813 J/g°K.


PCB Capability (AD255C)

We offer a diverse range of PCB manufacturing capabilities to accommodate various project specifications.


These options include layer count variations such as double-sided PCBs, multi-layer PCBs, and hybrid-designed boards.


Copper weight options can be 1oz (35µm) and 2oz (70µm), and dielectric thickness options include 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), and 125mil (3.175mm).


PCB material: Glass-reinforced, PTFE based Composites
Designation: AD255C
Dielectric constant: 2.55 (10 GHz)
Dissipation Factor 0.0013 (10 GHz)
Layer count: Double Sided PCB, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness: 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red, Purple etc.
Surface Finish: Immersion gold, Hot air soldering level (HASL), Immersion silver, Immersion tin, OSP, Pure gold plated, ENEPIG, Bare copper, etc..


The maximum PCB size is 400mm X 500mm,and it can be a single board of this size or multiple designs on a panel.


We provide various solder mask options, including Green, Black, Blue, Yellow, Red, Purple, and more.


There is also a wide range of surface finish options available, such as Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, and Pure gold plated, among others.


AD255C PCBs perform exceptionally well in cellular infrastructure base station antennas, commercial satellite radio antennas, and more.



AD255C PCBs are processed using standard equipment and chemical processes to plate, image, and etch circuit patterns. It is important to handle them with care to preserve the post-etch laminate surface, as the remaining topography promotes improved adhesion to solder masks.


Thank you for joining us today. We hope you found the information presented here valuable and informative.


Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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