RO3010 PTFE Composite High Frequency PCB With Immersion Silver

Today, I'd like to discuss a remarkable ceramic-filled PTFE composite that offers exceptional stability in both electrical and mechanical aspects.

Rogers' RO3010 high frequency circuit laminates are specifically designed for commercial microwave and radio frequency applications. These laminates are made of ceramic-filled PTFE composites, which provide outstanding electrical properties and consistent mechanical properties. This allows our designers to create multilayer board designs using different dielectric constant materials for each layer, without facing any issues related to warping or reliability.

RO3010 Typical Properties

The dielectric constant of RO3010 material is typically 10.2, with a tolerance of ±0.15.

It also exhibits a dissipation factor of 0.0022, which makes it an excellent choice for high frequency circuits that require minimal signal loss.

However, the thermal coefficient of dielectric constant in the Z direction is −395 ppm/°C at 10 GHz, ranging from -50℃ to 150℃. This value is relatively high and may not be suitable for temperature-sensitive working environments.

The dimensional stability of RO3010 is noteworthy. In the X and Y directions, it experiences minimal dimensional changes, measuring only 0.35 and 0.31 mm/m, respectively. This ensures that the material remains stable and does not warp or deform during the manufacturing process, guaranteeing that the final product meets the required specifications.

Impressively, both the volume resistivity and surface resistivity of RO3010 are rated at 105 MΩ.cm and 105 MΩ, respectively. These resistivity values effectively control the flow of electricity within the circuit and ensure efficient signal transmission.

RO3010 exhibits a tensile modulus exceeding 1900 MPa in the X and Y directions.

With a moisture absorption rate of 0.05%, it demonstrates high resistance to water intrusion.

Furthermore, the specific heat capacity of RO3010 is calculated at 0.8 J/g/K, indicating its ability to absorb thermal energy.

Moreover, as per the ASTM D 5470 method at a temperature of 50°C, the thermal conductivity of RO3010 measures 0.95 W/m/K, suggesting good thermal conductivity.

Regarding the coefficient of thermal expansion (CTE), the material's performance, determined using the IPC-TM-650 2.4.4.1. test method at 23°C and 50% relative humidity, yields values of 13, 11, and 16 ppm/°C in the X, Y, and Z directions, respectively, within a temperature range of -55 to 288°C. This result is quite favorable, as the CTE is similar to that of copper. Consequently, PCBs utilizing RO3010 exhibit excellent dimensional stability and reliability in plated-through-holes.

RO3010 can withstand decomposition temperatures up to 500°C.

Additionally, it has been tested and confirmed to have a density of 2.8 gm/cm3 at 23°C.

The copper peel strength of RO3010 after solder float, measured using 1oz ED copper and IPC-TM 2.4.8, is 9.4 lbs/in.

It is classified as V-0 flammability according to the UL 94 standard and is also compatible with lead-free processes.

PCB Capability (RO3010)

For RO3010 PCBs, we offer options for double layer, multilayer, and hybrid designs.

Copper weights available include 1oz (35µm) and 2oz (70µm).

The PCB thickness can be customized, with choices ranging from 5mil (0.127mm) to 50mil (1.27mm).

The maximum size for RO3010 PCBs is 400mm X 500mm, allowing for single board designs or multiple designs within a panel.

We also provide solder masks in various colors, such as green, black, blue, yellow, red, white, and more.

Moreover, we offer different surface treatment options, including immersion gold, HASL, immersion silver, immersion tin, bare copper, and OSP, to meet diverse requirements.

RO3010 PCBs are suitable for applications in automotive radar, GPS antennas, wireless communication patch antennas, and direct broadcast satellite systems, among others.

Conclusion

The manufacturing process for RO3010 high frequency PCBs is similar to standard PTFE PCBs. Developers, strippers, and copper etchants commonly used for processing epoxy glass materials are also applicable to RO3010. Therefore, it is suitable for volume manufacturing processes, allowing for a competitive advantage in the market.