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RO3010 PTFE Composite High Frequency PCB With Immersion Silver

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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RO3010 PTFE Composite High Frequency PCB With Immersion Silver

RO3010 PTFE Composite High Frequency PCB With Immersion Silver
RO3010 PTFE Composite High Frequency PCB With Immersion Silver RO3010 PTFE Composite High Frequency PCB With Immersion Silver

Large Image :  RO3010 PTFE Composite High Frequency PCB With Immersion Silver

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD 9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

PTFE Composite High Frequency PCB


High Frequency PCB RO3010


5mil PCB Circuit Boards

Today, I'd like to discuss a remarkable ceramic-filled PTFE composite that offers exceptional stability in both electrical and mechanical aspects.


Rogers' RO3010 high frequency circuit laminates are specifically designed for commercial microwave and radio frequency applications. These laminates are made of ceramic-filled PTFE composites, which provide outstanding electrical properties and consistent mechanical properties. This allows our designers to create multilayer board designs using different dielectric constant materials for each layer, without facing any issues related to warping or reliability.


RO3010 Typical Properties

The dielectric constant of RO3010 material is typically 10.2, with a tolerance of ±0.15.


It also exhibits a dissipation factor of 0.0022, which makes it an excellent choice for high frequency circuits that require minimal signal loss.


However, the thermal coefficient of dielectric constant in the Z direction is −395 ppm/°C at 10 GHz, ranging from -50℃ to 150℃. This value is relatively high and may not be suitable for temperature-sensitive working environments.


The dimensional stability of RO3010 is noteworthy. In the X and Y directions, it experiences minimal dimensional changes, measuring only 0.35 and 0.31 mm/m, respectively. This ensures that the material remains stable and does not warp or deform during the manufacturing process, guaranteeing that the final product meets the required specifications.


Impressively, both the volume resistivity and surface resistivity of RO3010 are rated at 105 MΩ.cm and 105 MΩ, respectively. These resistivity values effectively control the flow of electricity within the circuit and ensure efficient signal transmission.


Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.3 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z   10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.35
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC
Surface Resistivity 105   COND A IPC
Tensile Modulus 1902
MPa 23℃ ASTM D 638
Moisture Absorption 0.05   % D48/50 IPC-TM-650
Specific Heat 0.8   j/g/k   Calculated
Thermal Conductivity 0.95   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500   ℃ TGA   ASTM D 3850
Density 2.8   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


RO3010 exhibits a tensile modulus exceeding 1900 MPa in the X and Y directions.


With a moisture absorption rate of 0.05%, it demonstrates high resistance to water intrusion.


Furthermore, the specific heat capacity of RO3010 is calculated at 0.8 J/g/K, indicating its ability to absorb thermal energy.


Moreover, as per the ASTM D 5470 method at a temperature of 50°C, the thermal conductivity of RO3010 measures 0.95 W/m/K, suggesting good thermal conductivity.


Regarding the coefficient of thermal expansion (CTE), the material's performance, determined using the IPC-TM-650 test method at 23°C and 50% relative humidity, yields values of 13, 11, and 16 ppm/°C in the X, Y, and Z directions, respectively, within a temperature range of -55 to 288°C. This result is quite favorable, as the CTE is similar to that of copper. Consequently, PCBs utilizing RO3010 exhibit excellent dimensional stability and reliability in plated-through-holes.


RO3010 can withstand decomposition temperatures up to 500°C.


Additionally, it has been tested and confirmed to have a density of 2.8 gm/cm3 at 23°C.


The copper peel strength of RO3010 after solder float, measured using 1oz ED copper and IPC-TM 2.4.8, is 9.4 lbs/in.


It is classified as V-0 flammability according to the UL 94 standard and is also compatible with lead-free processes.


RO3010 PTFE Composite High Frequency PCB With Immersion Silver 0


PCB Capability (RO3010)

For RO3010 PCBs, we offer options for double layer, multilayer, and hybrid designs.


Copper weights available include 1oz (35µm) and 2oz (70µm).


The PCB thickness can be customized, with choices ranging from 5mil (0.127mm) to 50mil (1.27mm).


The maximum size for RO3010 PCBs is 400mm X 500mm, allowing for single board designs or multiple designs within a panel.


We also provide solder masks in various colors, such as green, black, blue, yellow, red, white, and more.


Moreover, we offer different surface treatment options, including immersion gold, HASL, immersion silver, immersion tin, bare copper, and OSP, to meet diverse requirements.


PCB Material: Ceramic-filled PTFE composite
Designation: RO3010
Dielectric constant: 10. 2 ±0.3 (process Dk) 11.2 (design Dk)
Layer count: Double layer, Multi-layer, Hybrid designs
Copper weight: 1oz (35µm), 2oz (70µm)
PCB thickness: 5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red, White etc.
Surface finish: Immersoin gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG etc..


RO3010 PCBs are suitable for applications in automotive radar, GPS antennas, wireless communication patch antennas, and direct broadcast satellite systems, among others.



The manufacturing process for RO3010 high frequency PCBs is similar to standard PTFE PCBs. Developers, strippers, and copper etchants commonly used for processing epoxy glass materials are also applicable to RO3010. Therefore, it is suitable for volume manufacturing processes, allowing for a competitive advantage in the market.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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