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25mil Double Sided PCB On RO3210 Material With Immersion Gold No Solder Mask And No Silkscreen

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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25mil Double Sided PCB On RO3210 Material With Immersion Gold No Solder Mask And No Silkscreen

25mil Double Sided PCB On RO3210 Material With Immersion Gold No Solder Mask And No Silkscreen
25mil Double Sided PCB On RO3210 Material With Immersion Gold No Solder Mask And No Silkscreen

Large Image :  25mil Double Sided PCB On RO3210 Material With Immersion Gold No Solder Mask And No Silkscreen

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD 9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
High Light:

Double Sided High Frequency PCB


25mil Double Sided PCB


RO3210 Double Sided PCB

Today's topic revolves around an extension material belonging to Rogers' RO3000 series, which possesses a distinct characteristic: enhanced mechanical stability. This material is known as RO3210 high frequency PCB and is the featured product of the day.


RO3210 high frequency circuit materials are laminates reinforced with woven fiberglass and filled with ceramics. They are specifically engineered to provide exceptional electrical performance while offering improved mechanical stability at competitive prices.


Let's begin by examining the data sheet for RO3210 materials.


RO3210 Typical Properties

The data sheet presents the fundamental properties of these high frequency circuit laminates.


Property Typical Value RO3210 Direction Unit Condition Test Method
Dielectric Constant, er Process 10.2± 0.50 Z - 10 GHz 23°C IPC-TM-650
Clamped Stripline
Dielectric Constant, er Design 10.8 Z - 8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor, tan d 0.0027 Z - 10 GHz 23°C IPC-TM-650
Thermal Coefficient of er -459 Z ppm/°C 10 GHz 0-100°C IPC-TM-650
Dimensional Stability 0.8 X,Y mm/m COND A ASTM D257
Volume Resistivity 103   MW•cm COND A IPC
Surface Resistivity 103   MW COND A IPC
Tensile Modulus 579
MD CMD kpsi 23°C ASTM D638
Water Absorption <0.1 - % D24/23 IPC-TM-650
Specific Heat 0.79   J/g/K   Calculated
Thermal Conductivity 0.81 - W/m/K 80°C ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C) 13
X,Y Z ppm/°C 23°C/50% RH IPC-TM-650 2.4.41
Td 500   °C TGA ASTM D3850
Density 3.0   gm/cm3    
Color Off White        
Flammability V-0       UL 94
Lead Free Process Compatible YES        


Firstly, we have the dielectric constant (DK) as item 1. RO3210 is a high DK material with a value of 10.2 and a dissipation factor of 0.0027 at 10 GHz and 23 ℃. The dielectric constant and dissipation factor of RO3210 are tightly controlled within the tolerance range indicated here.


The next property is the thermal coefficient of dielectric constant (TCDk). TCDk describes the variation in Dk with changes in temperature and is a characteristic possessed by all materials. Some materials exhibit better TCDk values than others. Ideally, a TCDk value of 0 ppm/℃ would indicate no change in DK with temperature, while TCDk values below |50| ppm/℃ are considered good.


In the case of RO3210, the TCDk is -459 ppm/℃, which indicates a poor TCDk. Therefore, RO3210 is not suitable for circuit boards that need to be installed in environments with significant temperature fluctuations, such as automotive electronics or 5G base stations.


However, RO3210 demonstrates excellent volume resistivity and surface resistivity, falling within the range of most printed circuit board materials.


Water absorption of less than 0.1% is a crucial factor. Even if a material possesses excellent RF properties, if its moisture absorption is inadequate, the absorbed or released moisture under different environmental conditions can cause variations in the dielectric constant and dissipation factor. Therefore, RO3210's moisture absorption of less than 0.1% is considered extremely good.


The specific heat value of RO3210 is 0.79 J/g/K. Comparatively, water has a specific heat of 4.186 J/g/K, copper has 0.385 J/g/K, and lead has 0.128 J/g/K. The thermal conductivity of RO3210 is 0.81 W/mK, which is acceptable.


RO3210 exhibits a low coefficient of thermal expansion (-55 to 288 °C) in the X and Y directions, similar to copper, with a value of 13 ppm/°C. This characteristic makes it suitable for use in epoxy multi-layer board hybrid designs and allows for more reliable surface-mounted assemblies.


Furthermore, RO3210 has a decomposition temperature exceeding 500 °C and a density of 3 gm/cm3. It has an off-white color and complies with UL-94V0 flammability standards. It is also lead-free and environmentally friendly.


These properties make RO3210 suitable for high frequency circuit applications that require both excellent electrical performance and enhanced mechanical stability. However, it should be noted that its poor thermal coefficient of dielectric constant (TCDk) makes it less suitable for applications with significant temperature fluctuations.


PCB Capability (RO3210)

For RO3210 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types.


RO3210 PCBs are typically available in two thicknesses for our application: 25 mils and 50 mils. Finished copper on track lines can be 1oz, 2oz or 3oz.


Our maximum PCB size on high frequency materials is 400mm by 500mm, which can be a single board in the sheet or multiple designs in this panel.


Solder masks in green, black, blue, and yellow etc. are available in the house. Surface pads are available in immersion gold, HASL, immersion silver, immersion tin, and OSP etc.


PCB Material: Woven-Glass Reinforced Ceramic-filled Laminates
Designation: RO3210
Dielectric constant: 10.2 ±0.5 (process)
  10.8 (design)
Layer count: 1-layer, 2-layer, Multi-layer, Hybrid PCB
PCB thickness: 25mil (0.635mm), 50mil (1.27mm)
Copper weight: 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP etc..


This type of PCB is commonly used in various high-frequency applications such as automotive collision avoidance systems, automotive GPS antennas, base station infrastructure, direct broadcast satellite systems, and wireless telecommunications systems.


The RO3210 high frequency PCB offers a combination of surface smoothness found in non-woven PTFE circuits and the rigidity of woven-glass PTFE boards. The manufacturing process for RO3210 high frequency PCB is similar to standard PTFE circuit board processing techniques.


25mil Double Sided PCB On RO3210 Material With Immersion Gold No Solder Mask And No Silkscreen 0

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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