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Double Sided High Frequency PCB,
25mil Double Sided PCB,
RO3210 Double Sided PCB
Today's topic revolves around an extension material belonging to Rogers' RO3000 series, which possesses a distinct characteristic: enhanced mechanical stability. This material is known as RO3210 high frequency PCB and is the featured product of the day.
RO3210 high frequency circuit materials are laminates reinforced with woven fiberglass and filled with ceramics. They are specifically engineered to provide exceptional electrical performance while offering improved mechanical stability at competitive prices.
Let's begin by examining the data sheet for RO3210 materials.
RO3210 Typical Properties
The data sheet presents the fundamental properties of these high frequency circuit laminates.
|Property||Typical Value RO3210||Direction||Unit||Condition||Test Method|
|Dielectric Constant, er Process||10.2± 0.50||Z||-||10 GHz 23°C||IPC-TM-650 184.108.40.206
|Dielectric Constant, er Design||10.8||Z||-||8 GHz - 40 GHz||Differential Phase Length Method|
|Dissipation Factor, tan d||0.0027||Z||-||10 GHz 23°C||IPC-TM-650 220.127.116.11|
|Thermal Coefficient of er||-459||Z||ppm/°C||10 GHz 0-100°C||IPC-TM-650 18.104.22.168|
|Dimensional Stability||0.8||X,Y||mm/m||COND A||ASTM D257|
|Volume Resistivity||103||MW•cm||COND A||IPC 22.214.171.124|
|Surface Resistivity||103||MW||COND A||IPC 126.96.36.199|
|MD CMD||kpsi||23°C||ASTM D638|
|Water Absorption||<0.1||-||%||D24/23||IPC-TM-650 188.8.131.52|
|Thermal Conductivity||0.81||-||W/m/K||80°C||ASTM C518|
|Coefficient of Thermal Expansion (-55 to 288 °C)||13
|X,Y Z||ppm/°C||23°C/50% RH||IPC-TM-650 2.4.41|
|Lead Free Process Compatible||YES|
Firstly, we have the dielectric constant (DK) as item 1. RO3210 is a high DK material with a value of 10.2 and a dissipation factor of 0.0027 at 10 GHz and 23 ℃. The dielectric constant and dissipation factor of RO3210 are tightly controlled within the tolerance range indicated here.
The next property is the thermal coefficient of dielectric constant (TCDk). TCDk describes the variation in Dk with changes in temperature and is a characteristic possessed by all materials. Some materials exhibit better TCDk values than others. Ideally, a TCDk value of 0 ppm/℃ would indicate no change in DK with temperature, while TCDk values below |50| ppm/℃ are considered good.
In the case of RO3210, the TCDk is -459 ppm/℃, which indicates a poor TCDk. Therefore, RO3210 is not suitable for circuit boards that need to be installed in environments with significant temperature fluctuations, such as automotive electronics or 5G base stations.
However, RO3210 demonstrates excellent volume resistivity and surface resistivity, falling within the range of most printed circuit board materials.
Water absorption of less than 0.1% is a crucial factor. Even if a material possesses excellent RF properties, if its moisture absorption is inadequate, the absorbed or released moisture under different environmental conditions can cause variations in the dielectric constant and dissipation factor. Therefore, RO3210's moisture absorption of less than 0.1% is considered extremely good.
The specific heat value of RO3210 is 0.79 J/g/K. Comparatively, water has a specific heat of 4.186 J/g/K, copper has 0.385 J/g/K, and lead has 0.128 J/g/K. The thermal conductivity of RO3210 is 0.81 W/mK, which is acceptable.
RO3210 exhibits a low coefficient of thermal expansion (-55 to 288 °C) in the X and Y directions, similar to copper, with a value of 13 ppm/°C. This characteristic makes it suitable for use in epoxy multi-layer board hybrid designs and allows for more reliable surface-mounted assemblies.
Furthermore, RO3210 has a decomposition temperature exceeding 500 °C and a density of 3 gm/cm3. It has an off-white color and complies with UL-94V0 flammability standards. It is also lead-free and environmentally friendly.
These properties make RO3210 suitable for high frequency circuit applications that require both excellent electrical performance and enhanced mechanical stability. However, it should be noted that its poor thermal coefficient of dielectric constant (TCDk) makes it less suitable for applications with significant temperature fluctuations.
PCB Capability (RO3210)
For RO3210 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types.
RO3210 PCBs are typically available in two thicknesses for our application: 25 mils and 50 mils. Finished copper on track lines can be 1oz, 2oz or 3oz.
Our maximum PCB size on high frequency materials is 400mm by 500mm, which can be a single board in the sheet or multiple designs in this panel.
Solder masks in green, black, blue, and yellow etc. are available in the house. Surface pads are available in immersion gold, HASL, immersion silver, immersion tin, and OSP etc.
|PCB Material:||Woven-Glass Reinforced Ceramic-filled Laminates|
|Dielectric constant:||10.2 ±0.5 (process)|
|Layer count:||1-layer, 2-layer, Multi-layer, Hybrid PCB|
|PCB thickness:||25mil (0.635mm), 50mil (1.27mm)|
|Copper weight:||1oz (35µm), 2oz (70µm), 3oz (105µm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Yellow, Red etc.|
|Surface finish:||Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP etc..|
This type of PCB is commonly used in various high-frequency applications such as automotive collision avoidance systems, automotive GPS antennas, base station infrastructure, direct broadcast satellite systems, and wireless telecommunications systems.
The RO3210 high frequency PCB offers a combination of surface smoothness found in non-woven PTFE circuits and the rigidity of woven-glass PTFE boards. The manufacturing process for RO3210 high frequency PCB is similar to standard PTFE circuit board processing techniques.
Contact Person: Ms. Ivy Deng