Payment & Shipping Terms:
|Material:||Ceramic-filled Laminates Reinforced With Woven Fiberglass||Layer Count:||Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB|
|PCB Thickness:||25mil (0.635mm), 50mil (1.27mm)||PCB Size:||≤400mm X 500mm|
|Copper Weight:||1oz (35µm), 2oz (70µm)||Solder Mask:||Green, Black, Blue, Yellow, Red Etc.|
|Surface Finish:||Immersion Gold, HASL, Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare Copper, Pure Gold Plated Etc..|
Multilayer RF Printed Circuit Board,
RO3206 High Frequency PCB,
High Frequency PCB 25mil
RO3206 high frequency circuit materials are laminates that contain ceramic fillers and are reinforced with woven fiberglass. These materials have been specifically engineered to provide exceptional electrical performance and mechanical stability while maintaining competitive pricing. They are an extension of the RO3000 series high frequency circuit materials, with the notable improvement of enhanced mechanical stability.
With a dielectric constant of 6.15 and a low dissipation factor of 0.0027, RO3206 high frequency circuit materials offer an extended useful frequency range beyond 40 GHz. This makes them suitable for applications requiring high-frequency performance.
The RO3206 laminates combine the advantages of a non-woven PTFE laminate, such as surface smoothness for finer line etching tolerances, with the rigidity provided by a woven-glass PTFE laminate. These materials can be easily fabricated into printed circuit boards using standard PTFE circuit board processing techniques.
To ensure consistent quality, RO3206 laminates are manufactured under an ISO 9002 certified quality system. This certification guarantees that the materials meet stringent quality standards and adhere to established manufacturing practices.
Features and Benefits:
RO3206 offers the following features and benefits:
Woven glass reinforcement:
Enhances rigidity, facilitating easier handling during fabrication and assembly processes.
Uniform electrical and mechanical performance:
Ideal for complex multi-layer high frequency structures, ensuring consistent performance throughout the design.
Low dielectric loss:
Enables excellent high frequency performance by minimizing signal loss and distortion.
Low in-plane expansion coefficient (matched to copper):
Compatible with epoxy multi-layer board hybrid designs, ensuring reliable surface mounted assemblies.
Excellent dimensional stability:
Maintains consistent dimensions and shape during manufacturing processes, leading to high production yields.
Provides economical solutions for volume manufacturing, making it a cost-efficient option for large-scale production.
Features a smooth surface that allows for finer line etching tolerances, enabling precise circuit design and fabrication.
Our PCB Capability (RO3206)
|PCB Material:||Ceramic-filled Laminates Reinforced with Woven Fiberglass|
|Layer count:||Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB|
|Copper weight:||1oz (35µm), 2oz (70µm)|
|Dielectric thickness||25mil (0.635mm), 50mil (1.27mm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Yellow, Red etc.|
|Surface finish:||Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..|
RO3206 PCBs find application in various industries, including:
1. Automotive collision avoidance systems
2. Automotive global position satellite antennas
3. Base station infrastructure
4. Direct broadcast satellites
5. Datalink on cable systems
6. LMDS (Local Multipoint Distribution Service) and wireless broadband
7. Microstrip patch antennas for wireless communications
8. Remote meter readers
9. Power backplanes
10. Wireless telecommunications systems
RO3206 Data Sheet
|Dielectric Constant, εr Process||6.15± 0.15||Z||-||10 GHz 23°C||IPC-TM-650 188.8.131.52 Clamped Stripline|
|Dielectric Constant, εr Design||6.6||Z||-||8 GHz - 40 GHz||Differential Phase Length Method|
|Dissipation Factor, tan δ||0.0027||Z||-||10 GHz 23°C||IPC-TM-650 184.108.40.206|
|Thermal Coefficient of εr||-212||Z||ppm/°C||10 GHz 0-100°C||IPC-TM-650 220.127.116.11|
|Dimensional Stability||0.8||X,Y||mm/m||COND A||ASTM D257|
|Volume Resistivity||103||MΩ•cm||COND A||IPC 18.104.22.168|
|Surface Resistivity||103||MΩ||COND A||IPC 22.214.171.124|
|Thermal Conductivity||0.67||-||W/m/K||80°C||ASTM C518|
|Coefficient of Thermal Expansion (-55 to 288 °C)||13
|ppm/°C||23°C/50% RH||IPC-TM-650 2.4.41|
|Copper Peel Strength||10.7||pli||1 oz. EDC After Solder Float||IPC-TM-2.4.8|
|Lead Free Process
Contact Person: Ms. Ivy Deng