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|Material:||Hydrocarbon / Ceramic / Woven Glass||Layer Count:||2 Layer|
|PCB Thickness:||0.9mm||PCB Size:||146.15mm X 60.8mm = 20PCS, +/- 0.15mm|
|Copper Weight:||1oz (1.4 Mils) Outer Layers||Solder Mask:||Green|
|Surface Finish:||Immersion Gold|
Antenna RF PCB Board,
Double Layer Copper Antenna PCB Board,
Immersion Golds Antenna PCB
This 2-layer rigid PCB features a stackup with copper_layer_1 of 35 μm, a Rogers RO4725JXR Core of 30.7mil (0.780 mm), and copper_layer_2 of 35 μm. It has a finished board thickness of 0.9mm and a finished Cu weight of 1oz (1.4 mils) on the outer layers. The construction details include board dimensions of 146.15mm x 60.8mm, minimum trace/space of 5/6 mils, and a minimum hole size of 0.5mm. It does not have blind vias and has a via plating thickness of 20 μm.
The PCB utilizes immersion gold as the surface finish, with green top solder mask and no bottom solder mask. It does not have top or bottom silkscreen. Prior to shipment, a 100% electrical test is performed to ensure quality. The supplied artwork is in the form of Gerber RS-274-X files, and the PCB conforms to IPC-Class-2 quality standard. It is available worldwide.
With a total of 54 components and 67 pads, this PCB has 67 top SMT pads, no bottom SMT pads, 249 vias, and 3 nets. It is commonly used in applications such as Cellular Base Station Antennas and Power Amplifiers.
|PCB Type||2-layer rigid PCB|
|Rogers RO4725JXR Core||30.7mil (0.780 mm)|
|Board Dimensions||146.15mm x 60.8mm = 20PCS, +/- 0.15mm|
|Minimum Trace/Space||5/6 mils|
|Minimum Hole Size||0.5mm|
|Finished Board Thickness||0.9mm|
|Finished Cu Weight||1oz (1.4 mils) outer layers|
|Via Plating Thickness||20 μm|
|Surface Finish||Immersion Gold|
|Top Solder Mask||Green|
|Bottom Solder Mask||No|
|Electrical Test||100% prior to shipment|
|Thru Hole Pads||0|
|Top SMT Pads||67|
|Bottom SMT Pads||0|
|Type of Artwork Supplied||Gerber RS-274-X|
|Typical Applications||Cellular Base Station Antennas and Power Amplifiers|
RO4725JXR RF PCBs offer a range of advantages due to their unique properties:
Reduced PIM: These PCBs exhibit reduced passive inter-modulation, resulting in improved signal quality and reduced interference.
Low insertion loss: With low loss dielectric and low profile foil, these PCBs minimize signal loss during transmission.
RO4725JXR Dk 2.55: The dielectric constant of 2.55 ensures consistent electrical performance and compatibility with standard PTFE-based materials.
The PCBs also feature unique filler and closed microspheres, providing additional benefits:
Low density: With a density of only 1.27 gm/cm3, these PCBs are approximately 30% lighter than PTFE/Glass boards, offering weight savings in applications.
Low Z-axis CTE (Coefficient of Thermal Expansion) of 25.6ppm/°C: This property ensures dimensional stability and reliable performance across temperature variations.
Other notable features include:
High Tg (>280°C): The high glass transition temperature allows for design flexibility and compatibility with automated assembly processes.
Low TCDk (+34 ppm/°C): The low thermal coefficient of dielectric constant ensures consistent circuit performance, minimizing variations due to temperature changes.
Specially formulated thermoset resin system/filler: This formulation offers ease of fabrication and compatibility with plated through-hole (PTH) processes.
In addition, RO4725JXR laminates are environmentally friendly:
Lead-free process compatibility: These PCBs are suitable for lead-free soldering processes.
RoHS compliant: They meet the requirements of the Restriction of Hazardous Substances (RoHS) directive.
Typical applications for RO4725JXR PCBs include Cellular Base Station Antennas etc.
|Substrate Types and Brands||Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials|
|Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic|
|Board Types||Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB|
|CCL Model||High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A High CTI FR-4: S1600L, ST115|
|Rogers Corp: RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917|
|Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z;|
|F4B PTFE Composites: (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2)|
|Maximum Delivery Size||1200mm x 572 mm|
|Minimum Finished Board Thickness||L≤2L: 0.15mm; 4L: 0.4mm|
|Maximum Finished Board Thickness||10.0 mm|
|Blind Buried Holes (Non-crossing)||0.1mm|
|Maximum Hole Aspect Ratio||15:01|
|Minimum Mechanical Drill Hole Diameter||0.1 mm|
|Through-hole Tolerance||+/- 0.0762 mm|
|Press-fit Hole Tolerance||+/- 0.05mm|
|Non-plated Copper Hole Tolerance||+/- 0.05mm|
|Maximum Number of Layers||32|
|Internal and External Layer Maximum Copper Thickness||12Oz|
|Minimum Drill Hole Tolerance||+/- 2mil|
|Minimum Layer-to-Layer Tolerance||+/- 3mil|
|Minimum Line Width/Spacing||3mil/3mil|
|Minimum BGA Diameter||8mil|
|Impedance Tolerance||< 50Ω ±5Ω; ≥50Ω±10%|
|Surface Treatment Processes||Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Carbon Ink, Peelable Mask, Gold Finger, etc.|
Contact Person: Ms. Ivy Deng