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High Light: | No Solder Mask Bare Copper PCB,0.7mm Bare Copper PCB |
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Introducing the TMM10 PCB, a high-performance solution provided to meet the demanding requirements of RF and microwave applications. Crafted using advanced ceramic, hydrocarbon, and thermoset polymer composites, this PCB material offers exceptional performance, reliability, and durability. The TMM10 PCB is engineered to deliver superior signal integrity, efficient thermal management, and resistance to process chemicals, making it an ideal choice for a wide range of applications.
The TMM10 PCB features a process dielectric constant (Dk) of 9.20 +/- .23 at 10 GHz/23°C, ensuring reliable signal transmission and excellent performance in high-frequency environments. With a dissipation factor of 0.0022 at the same frequency, it minimizes signal loss and ensures optimal signal integrity.
TMM10 Typical Value | ||||||
Property | TMM10 | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 9.20±0.23 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant,εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | -38 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
Electrical Strength(dielectric strength) | 285 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
Thermal Properties | ||||||
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - x | 21 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Y | 21 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
Mechanical Properties | ||||||
Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 | |
Physical Properties | ||||||
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.2 | |||||
Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
One of the key advantages of the TMM10 PCB is its coefficient of thermal expansion, which is matched to copper. This feature reduces the risk of mechanical stress and improves the overall reliability of the PCB, particularly in applications where temperature fluctuations are common.
The TMM10 PCB is available in a thickness range of .0015 to .500 inches, providing flexibility in design and accommodating various space constraints. Its mechanical properties resist creep and cold flow, ensuring the integrity of the PCB over time.
Resistance to process chemicals is another noteworthy feature of the TMM10 PCB. This property reduces the risk of damage during fabrication processes, ensuring high manufacturing yield and reliability.
The material does not require a sodium napthanate treatment prior to electroless plating, streamlining the manufacturing process and reducing the overall production time.
With its thermoset resin base, the TMM10 PCB allows for reliable wire-bonding, making it suitable for applications that require this bonding technique.
The 2-layer rigid PCB construction features copper layers of 35 μm thickness, sandwiching the 0.635 mm (25mil) Rogers Core TMM10. The board dimensions are 210mm x 210mm with a finished board thickness of 0.7mm. The PCB conforms to IPC-Class-2 standards, ensuring high quality and reliability.
The TMM10 PCB is compatible with Gerber RS-274-X artwork, making it easy to integrate into various design software and manufacturing processes.
This high-performance PCB finds numerous applications in the field of RF and microwave electronics. It is particularly well-suited for RF and microwave circuitry, power amplifiers, combiners, filters, couplers, satellite communication systems, Global Positioning Systems antennas, patch antennas, dielectric polarizers and lenses, and chip testers.
For any technical inquiries or further information, please reach out to Ivy at sales10@bichengpcb.com. Our expert team is ready to assist you in
unlocking the full potential of the TMM10 PCB for your next project.
Unveiling the Next Generation: TMM10 PCB Redefines RF and Microwave Applications
The world of RF and microwave technology is witnessing a paradigm shift with the introduction of the groundbreaking TMM10 PCB. Crafted using advanced ceramic, hydrocarbon, and thermoset polymer composites, the TMM10 PCB delivers unparalleled performance, reliability, and durability. Provided to meet the demanding requirements of high-frequency environments, this cutting-edge PCB material is set to transform the industry.
Unmatched Performance and Reliability
Exploring the Advanced Properties of TMM10 PCB
The TMM10 PCB boasts an impressive dielectric constant (εProcess) of 9.20 ± 0.23 at 10 GHz, ensuring reliable signal transmission. Its dielectric constant (εDesign) of 9.8 from 8 GHz to 40 GHz, determined by the Differential Phase Length Method, guarantees consistent performance across a wide frequency range. Additionally, the low dissipation factor (0.0022) minimizes signal loss and preserves signal integrity.
Reliability in Extreme Conditions: Thermal Stability and Low Dissipation Factor
The TMM10 PCB's coefficient of thermal expansion, matched to copper, mitigates mechanical stress and ensures its integrity even in temperature-fluctuating environments. With a thermal coefficient of dielectric constant of -38 ppm/°K from -55°C to 125°C, it maintains stable performance in demanding conditions. Moreover, its exceptional thermal conductivity of 0.76 W/m/K at 80°C facilitates efficient heat dissipation.
Seamless Integration Made Easy: Compatibility with Gerber RS-274-X Artwork
The TMM10 PCB seamlessly integrates into existing design software and manufacturing processes, thanks to its compatibility with Gerber RS-274-X artwork. This feature simplifies the design-to-production transition, saving time and effort.
Popular Applications and Future Prospects
Optimized Signal Transmission: TMM10 PCB's Role in Power Amplifiers and Filters
The TMM10 PCB is a game-changer in power amplifiers, filters, and couplers, ensuring optimized signal transmission and amplification. Its exceptional performance empowers RF and microwave circuitry to deliver superior results.
Beyond the Sky: TMM10 PCB's Impact on Satellite Communication Systems
The TMM10 PCB plays a pivotal role in satellite communication systems, enabling seamless data transfer and reliable signal reception. Its durability and thermal stability make it an ideal choice for space applications.
Conclusion
Shaping the Future: Advancements and Innovations in TMM10 PCB Technology
The TMM10 PCB revolutionizes RF and microwave applications with its exceptional properties and unmatched performance. From its reliable signal transmission to efficient thermal management and chemical resistance, it surpasses industry standards. As we look ahead, the TMM10 PCB's continuous advancements and innovations promise to unlock new frontiers in electronic design and manufacturing. Embrace the future with the TMM10 PCB and unlock the full potential of your RF and microwave projects.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848