2L Immersion Silver High Frequency PCB 30mil RT Duroid 6035HTC

Introducing the RT/duroid 6035HTC PCB, a cutting-edge solution intended to meet the demanding requirements of high-power RF and microwave applications. Crafted using advanced ceramic-filled PTFE composites, this PCB material offers exceptional performance and reliability. With a process DK of 3.5 at 10 GHz/23°C and a dissipation factor of 0.0013 at the same frequency, the RT/duroid 6035HTC ensures superior signal integrity and minimal loss, even in high-frequency environments.

The RT/duroid 6035HTC PCB boasts several features and benefits that make it an ideal choice for critical electronic designs. Its high thermal conductivity enables efficient heat dissipation, resulting in lower operating temperatures for high-power applications. With a low loss tangent, this PCB delivers excellent high-frequency performance, ensuring optimal signal transmission. The thermally stable low-profile and reverse-treated copper foil contribute to lower insertion loss and exceptional thermal stability of traces.

One of the key advantages of the RT/duroid 6035HTC PCB is its advanced filler system, which enhances drillability and extends tool life compared to alumina-containing circuit materials. This means improved manufacturing efficiency and cost-effectiveness for your projects.

The 2-layer rigid PCB construction features copper layers of 35 μm thickness, sandwiching the 0.762 mm (30mil) Rogers Core RT/duroid 6035HTC. With a finished board thickness of 0.9mm and a finished copper weight of 1 oz (1.4 mils) on the outer layers, this PCB strikes the perfect balance between durability and compactness.

The RT/duroid 6035HTC PCB is designed to meet IPC-Class-2 standards, ensuring its quality and reliability. It undergoes a rigorous 100% electrical test prior to shipment, ensuring that it meets the highest performance standards.

With its wide availability worldwide, the RT/duroid 6035HTC PCB is ready to support your projects wherever you are. It comes with Gerber RS-274-X artwork, making it compatible with various design software and manufacturing processes.

This high-performance PCB finds numerous applications in the field of RF and microwave electronics. It is particularly well-suited for high-power RF and microwave amplifiers, power amplifiers, couplers, filters, combiners, and power dividers.

For any technical inquiries or further information, please reach out to Ivy at sales10@bichengpcb.com. Our expert team is ready to assist you in unlocking the full potential of the RT/duroid 6035HTC PCB for your next project.

Benefits of Using RT/duroid 6035HTC Material:

1. High Thermal Conductivity: The RT/duroid 6035HTC material offers high thermal conductivity, enabling efficient heat dissipation. This feature is particularly beneficial for high-power applications as it helps to lower operating temperatures and improve the overall reliability of the PCB.

2. Low Loss Tangent: With a low loss tangent, the RT/duroid 6035HTC material provides excellent high-frequency performance. It minimizes signal loss and ensures optimal signal transmission, making it suitable for RF and microwave applications that require precise and reliable signal integrity.

3. Thermally Stable Copper Foil: The material incorporates a thermally stable low-profile and reverse-treated copper foil. This enhances the thermal stability of traces and reduces insertion loss. It also ensures the reliability and longevity of the PCB, even in challenging operating conditions.

4. Advanced Filler System: The RT/duroid 6035HTC material utilizes an advanced filler system, which improves drillability compared to alumina-containing circuit materials. This results in enhanced manufacturing efficiency and extended tool life, making it a cost-effective choice for PCB fabrication.

5. Wide Temperature Range: The RT/duroid 6035HTC material is designed to operate in a temperature range of -40°C to +85°C. This wide temperature range makes it suitable for various applications where temperature fluctuations are expected.

Disadvantages of Using RT/duroid 6035HTC Material:

1. Cost: The advanced properties and performance of the RT/duroid 6035HTC material come at a higher cost compared to standard PCB materials. The increased cost may be a consideration for projects with strict budget constraints.

2. Limited Availability: Although the product is available worldwide, the RT/duroid 6035HTC material may not be as readily available as some other common PCB materials. This could pose challenges in terms of sourcing and lead times, particularly for urgent or time-sensitive projects.

3. Complexity in Fabrication: The unique properties of the RT/duroid 6035HTC material may require specialized manufacturing processes and expertise. Fabricating and assembling PCBs with this material may be more complex compared to conventional materials, potentially leading to increased production costs.

4. Restricted Design Flexibility: Certain design constraints may apply when using the RT/duroid 6035HTC material. These constraints may include limitations on minimum trace width, spacing, and hole sizes. Designers should be aware of these limitations and plan their layouts accordingly.

Despite these potential disadvantages, the benefits of using the RT/duroid 6035HTC material, such as high thermal conductivity, low loss tangent, and thermally stable copper foil, make it an excellent choice for high-power RF and microwave applications where superior performance and reliability are critical.